JP2007142237A5 - - Google Patents

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Publication number
JP2007142237A5
JP2007142237A5 JP2005335316A JP2005335316A JP2007142237A5 JP 2007142237 A5 JP2007142237 A5 JP 2007142237A5 JP 2005335316 A JP2005335316 A JP 2005335316A JP 2005335316 A JP2005335316 A JP 2005335316A JP 2007142237 A5 JP2007142237 A5 JP 2007142237A5
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JP
Japan
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processing
gas
processing chamber
substrate
concentration
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JP2005335316A
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English (en)
Japanese (ja)
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JP2007142237A (ja
JP5036172B2 (ja
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Priority claimed from JP2005335316A external-priority patent/JP5036172B2/ja
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Publication of JP2007142237A5 publication Critical patent/JP2007142237A5/ja
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Publication of JP5036172B2 publication Critical patent/JP5036172B2/ja
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JP2005335316A 2005-11-21 2005-11-21 基板処理装置、基板処理方法および半導体装置の製造方法 Expired - Fee Related JP5036172B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005335316A JP5036172B2 (ja) 2005-11-21 2005-11-21 基板処理装置、基板処理方法および半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005335316A JP5036172B2 (ja) 2005-11-21 2005-11-21 基板処理装置、基板処理方法および半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2007142237A JP2007142237A (ja) 2007-06-07
JP2007142237A5 true JP2007142237A5 (enExample) 2008-12-18
JP5036172B2 JP5036172B2 (ja) 2012-09-26

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JP2005335316A Expired - Fee Related JP5036172B2 (ja) 2005-11-21 2005-11-21 基板処理装置、基板処理方法および半導体装置の製造方法

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JP (1) JP5036172B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5242984B2 (ja) * 2007-10-12 2013-07-24 株式会社日立国際電気 基板処理装置、及び半導体装置の製造方法
US8889565B2 (en) 2009-02-13 2014-11-18 Asm International N.V. Selective removal of oxygen from metal-containing materials
US7829457B2 (en) * 2009-02-20 2010-11-09 Asm International N.V. Protection of conductors from oxidation in deposition chambers
JP2011155047A (ja) * 2010-01-26 2011-08-11 Koyo Thermo System Kk 熱処理装置及びその運転方法
CN107868942B (zh) * 2016-09-27 2019-11-29 北京北方华创微电子装备有限公司 一种去气腔室及其去气方法和半导体处理设备
CN109817545B (zh) * 2017-11-22 2021-07-16 台湾积体电路制造股份有限公司 半导体晶圆加工系统及加工半导体晶圆的方法
TW202229795A (zh) * 2020-11-23 2022-08-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 具注入器之基板處理設備
JP2024003678A (ja) 2022-06-27 2024-01-15 東京エレクトロン株式会社 熱処理装置、および熱処理装置の温度調整方法
JP7651533B2 (ja) * 2022-09-26 2025-03-26 株式会社Kokusai Electric 基板処理方法、半導体装置の製造方法、基板処理装置およびプログラム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06232140A (ja) * 1993-02-05 1994-08-19 Shinko Electric Co Ltd 水素アニ−ル炉の安全運転方法
JP4161959B2 (ja) * 2002-02-28 2008-10-08 東京エレクトロン株式会社 被処理体の熱処理方法

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