JP2007121248A - 導電性接触子ホルダの製造方法 - Google Patents
導電性接触子ホルダの製造方法 Download PDFInfo
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- JP2007121248A JP2007121248A JP2005317699A JP2005317699A JP2007121248A JP 2007121248 A JP2007121248 A JP 2007121248A JP 2005317699 A JP2005317699 A JP 2005317699A JP 2005317699 A JP2005317699 A JP 2005317699A JP 2007121248 A JP2007121248 A JP 2007121248A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Liquid Crystal (AREA)
- Manufacture Of Switches (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
【解決手段】導電性材料を用いることによって基板32を形成し、この基板32が有する中空部321に対してホルダ部材31(となるべき絶縁性部材30)を嵌入して両部材を固着し、絶縁性部材30の表面と該表面に隣接する基板32の表面とを研磨して互いの表面を滑らかに連続させ、絶縁性部材30を貫通し、複数の導電性接触子2を個別に収容する複数のホルダ孔311を形成する。絶縁性部材30と基板31とを固着する際には、その間に絶縁性を有する接着剤33を注入するか、または絶縁性部材30を嵌入する前に中空部321の内側面および/または嵌入時に絶縁性部材30の中空部321と対向する側面に接着剤33を塗布する。
【選択図】 図2
Description
2 導電性接触子
3 導電性接触子ホルダ
4 配線基板
5 固定部材
6 調整機構
7 フレーム基板
11、12、13 ねじ
21、22 針状部材
22a フランジ部
23 バネ部材
30 絶縁性部材
31 ホルダ部材
32 基板
33 接着剤
61 第1ブロック部材
62 第2ブロック部材
100 信号処理装置
200 液晶パネル
311 ホルダ孔
312、316 小径部
313、315 大径部
314、323 ねじ孔
321 中空部
Claims (3)
- 回路構造との間で信号の入出力を行う複数の導電性接触子を保持するホルダ部材と、前記ホルダ部材を嵌入可能な中空部を有する基板とを備えた導電性接触子ホルダを製造する導電性接触子ホルダの製造方法であって、
導電性材料を用いることによって前記基板を形成する基板形成工程と、
前記基板形成工程で形成した前記基板が有する前記中空部に対して前記ホルダ部材を嵌入して両部材を固着する固着工程と、
前記固着工程で固着した前記ホルダ部材の表面と該表面に隣接する前記基板の表面とを研磨して互いの表面を滑らかに連続させる表面研磨工程と、
前記表面研磨工程で表面が研磨された前記ホルダ部材を貫通し、前記複数の導電性接触子を個別に収容する複数のホルダ孔を形成するホルダ孔形成工程と、
を有し、
前記固着工程は、前記ホルダ部材と前記基板との間に絶縁性を有する接着剤を注入するか、または前記ホルダ部材を嵌入する前に前記中空部の内側面および/または嵌入時に前記ホルダ部材の前記中空部と対向する側面に前記接着剤を塗布することを特徴とする導電性接触子ホルダの製造方法。 - 前記固着工程は、前記ホルダ部材と前記基板とをねじで締結することを特徴とする請求項1記載の導電性接触子ホルダの製造方法。
- 前記基板形成工程は、前記基板の表面に絶縁層を形成する絶縁層形成工程を含むことを特徴とする請求項1または2記載の導電性接触子ホルダの製造方法。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005317699A JP4884749B2 (ja) | 2005-10-31 | 2005-10-31 | 導電性接触子ホルダの製造方法および導電性接触子ユニットの製造方法 |
PCT/JP2006/321515 WO2007052558A1 (ja) | 2005-10-31 | 2006-10-27 | 導電性接触子ホルダの製造方法 |
CNA2006800405393A CN101300494A (zh) | 2005-10-31 | 2006-10-27 | 导电性触点支持物的制造方法 |
US12/084,289 US7832091B2 (en) | 2005-10-31 | 2006-10-27 | Method for manufacturing conductive contact holder |
EP06822476A EP1950572A4 (en) | 2005-10-31 | 2006-10-27 | METHOD FOR PRODUCING A CONDUCTIVE CONTACT HOLDER |
MYPI20081340A MY149192A (en) | 2005-10-31 | 2006-10-27 | Method for manufacturing conductive contact holder |
KR1020087012934A KR101002221B1 (ko) | 2005-10-31 | 2006-10-27 | 도전성 접촉자 홀더의 제조방법 |
TW095140142A TW200722760A (en) | 2005-10-31 | 2006-10-31 | Method for making a holder for conductive contactors |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005317699A JP4884749B2 (ja) | 2005-10-31 | 2005-10-31 | 導電性接触子ホルダの製造方法および導電性接触子ユニットの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007121248A true JP2007121248A (ja) | 2007-05-17 |
JP4884749B2 JP4884749B2 (ja) | 2012-02-29 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005317699A Active JP4884749B2 (ja) | 2005-10-31 | 2005-10-31 | 導電性接触子ホルダの製造方法および導電性接触子ユニットの製造方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7832091B2 (ja) |
EP (1) | EP1950572A4 (ja) |
JP (1) | JP4884749B2 (ja) |
KR (1) | KR101002221B1 (ja) |
CN (1) | CN101300494A (ja) |
MY (1) | MY149192A (ja) |
TW (1) | TW200722760A (ja) |
WO (1) | WO2007052558A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019054346A1 (ja) * | 2017-09-14 | 2019-03-21 | 日本電産サンキョー株式会社 | 検査装置 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4905876B2 (ja) * | 2005-10-31 | 2012-03-28 | 日本発條株式会社 | 導電性接触子ホルダの製造方法および導電性接触子ホルダ |
EP2093576A4 (en) * | 2006-12-15 | 2010-09-22 | Nhk Spring Co Ltd | CONDUCTIVE CONTACT SUPPORT, CONDUCTIVE CONTACT UNIT AND METHOD FOR MANUFACTURING A CONDUCTIVE CONTACT SUPPORT |
TW201039020A (en) * | 2009-04-22 | 2010-11-01 | Advanced Optoelectronic Tech | Back bezel of side emitting type backlight module |
US20120287591A1 (en) * | 2009-11-24 | 2012-11-15 | Nhk Spring Co., Ltd. | Connection member |
JP5394309B2 (ja) | 2010-04-19 | 2014-01-22 | 富士通コンポーネント株式会社 | プローブ及びプローブの製造方法 |
US9941652B2 (en) * | 2015-12-17 | 2018-04-10 | Intel Corporation | Space transformer with perforated metallic plate for electrical die test |
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WO2003087852A1 (en) * | 2002-04-16 | 2003-10-23 | Nhk Spring Co., Ltd. | Holder for conductive contact |
JP2004101410A (ja) * | 2002-09-11 | 2004-04-02 | Dainippon Printing Co Ltd | 電子デバイス検査用コンタクトシートおよびその製造方法 |
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JP3442137B2 (ja) | 1993-12-17 | 2003-09-02 | 日本発条株式会社 | 導電性接触子ユニット |
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JP3022312B2 (ja) * | 1996-04-15 | 2000-03-21 | 日本電気株式会社 | プローブカードの製造方法 |
JP3099754B2 (ja) | 1996-10-23 | 2000-10-16 | 日本電気株式会社 | プローブカードの製造方法 |
JPH1182437A (ja) * | 1997-09-05 | 1999-03-26 | Pop Rivet Fastener Kk | 接着ファスナー |
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US20040101666A1 (en) * | 2002-09-11 | 2004-05-27 | Dai Nippon Prtg. Co., Ltd. | Inspection contact sheet and method of fabricating the same |
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-
2005
- 2005-10-31 JP JP2005317699A patent/JP4884749B2/ja active Active
-
2006
- 2006-10-27 WO PCT/JP2006/321515 patent/WO2007052558A1/ja active Application Filing
- 2006-10-27 MY MYPI20081340A patent/MY149192A/en unknown
- 2006-10-27 KR KR1020087012934A patent/KR101002221B1/ko active IP Right Grant
- 2006-10-27 US US12/084,289 patent/US7832091B2/en active Active
- 2006-10-27 CN CNA2006800405393A patent/CN101300494A/zh active Pending
- 2006-10-27 EP EP06822476A patent/EP1950572A4/en not_active Withdrawn
- 2006-10-31 TW TW095140142A patent/TW200722760A/zh unknown
Patent Citations (2)
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WO2003087852A1 (en) * | 2002-04-16 | 2003-10-23 | Nhk Spring Co., Ltd. | Holder for conductive contact |
JP2004101410A (ja) * | 2002-09-11 | 2004-04-02 | Dainippon Printing Co Ltd | 電子デバイス検査用コンタクトシートおよびその製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2019054346A1 (ja) * | 2017-09-14 | 2019-03-21 | 日本電産サンキョー株式会社 | 検査装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20080063529A (ko) | 2008-07-04 |
EP1950572A4 (en) | 2010-07-14 |
CN101300494A (zh) | 2008-11-05 |
EP1950572A1 (en) | 2008-07-30 |
WO2007052558A1 (ja) | 2007-05-10 |
TW200722760A (en) | 2007-06-16 |
MY149192A (en) | 2013-07-31 |
KR101002221B1 (ko) | 2010-12-20 |
US7832091B2 (en) | 2010-11-16 |
JP4884749B2 (ja) | 2012-02-29 |
US20090151157A1 (en) | 2009-06-18 |
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