JP2007121167A5 - - Google Patents

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Publication number
JP2007121167A5
JP2007121167A5 JP2005315586A JP2005315586A JP2007121167A5 JP 2007121167 A5 JP2007121167 A5 JP 2007121167A5 JP 2005315586 A JP2005315586 A JP 2005315586A JP 2005315586 A JP2005315586 A JP 2005315586A JP 2007121167 A5 JP2007121167 A5 JP 2007121167A5
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JP
Japan
Prior art keywords
glass substrate
fixed electrode
substrate
silicon
protruding portion
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JP2005315586A
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English (en)
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JP4585426B2 (ja
JP2007121167A (ja
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Priority to JP2005315586A priority Critical patent/JP4585426B2/ja
Priority claimed from JP2005315586A external-priority patent/JP4585426B2/ja
Priority to EP06022314A priority patent/EP1780525B1/en
Priority to DE602006001098T priority patent/DE602006001098D1/de
Priority to US11/553,861 priority patent/US7382599B2/en
Publication of JP2007121167A publication Critical patent/JP2007121167A/ja
Publication of JP2007121167A5 publication Critical patent/JP2007121167A5/ja
Application granted granted Critical
Publication of JP4585426B2 publication Critical patent/JP4585426B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (3)

  1. 相互に対向する一対の主面を有するガラス基板と、前記ガラス基板を貫通して一方の主面側で露出した固定電極を有すると共に、前記ガラス基板を貫通して前記一方の主面側で露出した突出部を有する第１シリコン基板と、前記ガラス基板の一方の主面上に接合されており、前記第固定電極との間でキャビティを形成するように対向して配置された可動電極を有する第２シリコン基板と、を具備し、前記突出部上に前記固定電極用の引き出し電極が形成され、前記第１シリコン基板は、前記固定電極の外側に前記突出部が位置し、前記固定電極と前記突出部とで構成される溝部内に前記ガラス基板が配置され、前記キャビティを形成するガラス基板の凹部が前記固定電極の外側で前記固定電極よりリセスしていることを特徴とする静電容量型圧力センサ。
  2. 前記ガラス基板と前記第１及び第２シリコンとの界面においてＳｉ−Ｓｉ結合又はＳｉ−Ｏ結合を有することを特徴とする請求項１に記載の静電容量型圧力センサ。
  3. 第１シリコン基板を準備し、前記第１シリコン基板の一方の主面をエッチングして、固定電極及び突出部を形成する工程と、前記固定電極及び前記突出部を形成した前記第１シリコン基板上にガラス基板を置き、真空下で、前記第１シリコン基板及び前記ガラス基板を加熱し、前記第１シリコン基板を前記ガラス基板に押圧して前記固定電極及び前記突出部を前記ガラス基板の主面に押し込んで前記第１シリコン基板と前記ガラス基板とを接合する工程と、前記ガラス基板の主面側を研磨処理して、前記第１シリコン基板の前記固定電極及び前記突出部を露出させ、前記ガラス基板及び前記固定電極をミリング加工してキャビティ用の凹部を形成する工程と、前記固定電極の外側をミリング加工してリセスを形成する工程と、前記第１シリコン基板の前記突出部上に、前記固定電極用の引き出し電極を形成する工程と、感圧ダイヤフラムが前記固定電極と所定の間隔をおいて位置するようにして所定の厚さに形成した第２シリコン基板を、前記ガラス基板の接合面上に陽極接合処理により接合する工程と、を具備することを特徴とする静電容量型圧力センサの製造方法。
JP2005315586A 2005-10-31 2005-10-31 静電容量型圧力センサ Expired - Fee Related JP4585426B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005315586A JP4585426B2 (ja) 2005-10-31 2005-10-31 静電容量型圧力センサ
EP06022314A EP1780525B1 (en) 2005-10-31 2006-10-25 Capacitive pressure sensor
DE602006001098T DE602006001098D1 (de) 2005-10-31 2006-10-25 Kapazitiver Drucksensor
US11/553,861 US7382599B2 (en) 2005-10-31 2006-10-27 Capacitive pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005315586A JP4585426B2 (ja) 2005-10-31 2005-10-31 静電容量型圧力センサ

Publications (3)

Publication Number Publication Date
JP2007121167A JP2007121167A (ja) 2007-05-17
JP2007121167A5 true JP2007121167A5 (ja) 2007-11-08
JP4585426B2 JP4585426B2 (ja) 2010-11-24

Family

ID=37499473

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005315586A Expired - Fee Related JP4585426B2 (ja) 2005-10-31 2005-10-31 静電容量型圧力センサ

Country Status (4)

Country Link
US (1) US7382599B2 (ja)
EP (1) EP1780525B1 (ja)
JP (1) JP4585426B2 (ja)
DE (1) DE602006001098D1 (ja)

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JP2008101917A (ja) * 2006-10-17 2008-05-01 Alps Electric Co Ltd 圧力センサのパッケージ
MX2010003679A (es) * 2007-10-05 2010-09-30 Nippon Filcon Kk Tela industrial de dos capas.
EP2194186B1 (en) 2007-10-05 2023-12-20 Nippon Filcon Co., Ltd. Industrial two-layer fabric
US8602564B2 (en) 2008-06-17 2013-12-10 The Invention Science Fund I, Llc Methods and systems for projecting in response to position
US8308304B2 (en) 2008-06-17 2012-11-13 The Invention Science Fund I, Llc Systems associated with receiving and transmitting information related to projection
US8944608B2 (en) 2008-06-17 2015-02-03 The Invention Science Fund I, Llc Systems and methods associated with projecting in response to conformation
US8641203B2 (en) 2008-06-17 2014-02-04 The Invention Science Fund I, Llc Methods and systems for receiving and transmitting signals between server and projector apparatuses
US8376558B2 (en) 2008-06-17 2013-02-19 The Invention Science Fund I, Llc Systems and methods for projecting in response to position change of a projection surface
US8936367B2 (en) 2008-06-17 2015-01-20 The Invention Science Fund I, Llc Systems and methods associated with projecting in response to conformation
US8820939B2 (en) 2008-06-17 2014-09-02 The Invention Science Fund I, Llc Projection associated methods and systems
US8608321B2 (en) 2008-06-17 2013-12-17 The Invention Science Fund I, Llc Systems and methods for projecting in response to conformation
US8262236B2 (en) 2008-06-17 2012-09-11 The Invention Science Fund I, Llc Systems and methods for transmitting information associated with change of a projection surface
US8723787B2 (en) 2008-06-17 2014-05-13 The Invention Science Fund I, Llc Methods and systems related to an image capture projection surface
US20090309826A1 (en) 2008-06-17 2009-12-17 Searete Llc, A Limited Liability Corporation Of The State Of Delaware Systems and devices
US8384005B2 (en) 2008-06-17 2013-02-26 The Invention Science Fund I, Llc Systems and methods for selectively projecting information in response to at least one specified motion associated with pressure applied to at least one projection surface
US8733952B2 (en) 2008-06-17 2014-05-27 The Invention Science Fund I, Llc Methods and systems for coordinated use of two or more user responsive projectors
US8267526B2 (en) 2008-06-17 2012-09-18 The Invention Science Fund I, Llc Methods associated with receiving and transmitting information related to projection
US8141430B2 (en) * 2009-07-01 2012-03-27 Brooks Instrument, Llc Monolithic vacuum manometer utilizing electrostatic interference as a means of detection
JP5913038B2 (ja) * 2012-10-01 2016-04-27 アルプス電気株式会社 静電容量型圧力センサ及びその製造方法
FI125958B (en) * 2013-05-10 2016-04-29 Murata Manufacturing Co Improved safe measuring box
CH708708A1 (de) * 2013-10-03 2015-04-15 Kistler Holding Ag Messelement zum Messen eines Drucks und Druckmesssensor.
DE102014101700A1 (de) 2014-02-12 2015-08-13 Vega Grieshaber Kg Druckmesszelle
DE102014117911A1 (de) * 2014-12-04 2016-06-09 Endress + Hauser Gmbh + Co. Kg Druckmesszelle
JP6922788B2 (ja) * 2018-03-05 2021-08-18 三菱電機株式会社 半導体圧力センサ

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FI78784C (fi) * 1988-01-18 1989-09-11 Vaisala Oy Tryckgivarkonstruktion och foerfarande foer framstaellning daerav.
US4998179A (en) * 1989-02-28 1991-03-05 United Technologies Corporation Capacitive semiconductive sensor with hinged diaphragm for planar movement
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US5369544A (en) * 1993-04-05 1994-11-29 Ford Motor Company Silicon-on-insulator capacitive surface micromachined absolute pressure sensor
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JPH0749278A (ja) 1993-08-05 1995-02-21 Omron Corp 圧力センサ
JPH0875582A (ja) 1994-09-08 1996-03-22 Omron Corp 静電容量型圧力センサ及び圧力測定方法並びに血圧計
US5528452A (en) * 1994-11-22 1996-06-18 Case Western Reserve University Capacitive absolute pressure sensor
JP3114570B2 (ja) * 1995-05-26 2000-12-04 オムロン株式会社 静電容量型圧力センサ
JP2900235B2 (ja) * 1995-07-17 1999-06-02 株式会社山武 静電容量式圧力センサ
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JP4773630B2 (ja) * 2001-05-15 2011-09-14 株式会社デンソー ダイアフラム型半導体装置とその製造方法
JP2006170893A (ja) * 2004-12-17 2006-06-29 Alps Electric Co Ltd 静電容量型圧力センサ
JP5085857B2 (ja) * 2005-09-22 2012-11-28 Ｔｏｗａ株式会社 切断装置及び切断方法

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