JP2007115798A5 - - Google Patents

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Publication number
JP2007115798A5
JP2007115798A5 JP2005303944A JP2005303944A JP2007115798A5 JP 2007115798 A5 JP2007115798 A5 JP 2007115798A5 JP 2005303944 A JP2005303944 A JP 2005303944A JP 2005303944 A JP2005303944 A JP 2005303944A JP 2007115798 A5 JP2007115798 A5 JP 2007115798A5
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JP
Japan
Prior art keywords
carbon nanotube
embedded
pad
tip
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005303944A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007115798A (ja
JP4855757B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005303944A priority Critical patent/JP4855757B2/ja
Priority claimed from JP2005303944A external-priority patent/JP4855757B2/ja
Publication of JP2007115798A publication Critical patent/JP2007115798A/ja
Publication of JP2007115798A5 publication Critical patent/JP2007115798A5/ja
Application granted granted Critical
Publication of JP4855757B2 publication Critical patent/JP4855757B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2005303944A 2005-10-19 2005-10-19 カーボンナノチューブパッド及び電子デバイス Expired - Fee Related JP4855757B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005303944A JP4855757B2 (ja) 2005-10-19 2005-10-19 カーボンナノチューブパッド及び電子デバイス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005303944A JP4855757B2 (ja) 2005-10-19 2005-10-19 カーボンナノチューブパッド及び電子デバイス

Publications (3)

Publication Number Publication Date
JP2007115798A JP2007115798A (ja) 2007-05-10
JP2007115798A5 true JP2007115798A5 (enExample) 2008-09-11
JP4855757B2 JP4855757B2 (ja) 2012-01-18

Family

ID=38097732

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005303944A Expired - Fee Related JP4855757B2 (ja) 2005-10-19 2005-10-19 カーボンナノチューブパッド及び電子デバイス

Country Status (1)

Country Link
JP (1) JP4855757B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7713858B2 (en) * 2006-03-31 2010-05-11 Intel Corporation Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
JP4635030B2 (ja) * 2007-07-30 2011-02-16 株式会社東芝 構造体、電子装置及び構造体の形成方法
JP4896840B2 (ja) * 2007-09-03 2012-03-14 Ｓｍｋ株式会社 微細コネクタコンタクトの製造方法
EP2197782B1 (en) * 2007-09-12 2020-03-04 Smoltek AB Connecting and bonding adjacent layers with nanostructures
US8350160B2 (en) 2008-08-25 2013-01-08 Kabushiki Kaisha Toshiba Structure, electronic device, and method for fabricating a structure
JP5649494B2 (ja) * 2011-03-24 2015-01-07 株式会社東芝 半導体基板、その製造方法、および電子装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002082130A (ja) * 2000-09-06 2002-03-22 Hitachi Ltd 半導体素子検査装置及びその製造方法
JP4212258B2 (ja) * 2001-05-02 2009-01-21 富士通株式会社 集積回路装置及び集積回路装置製造方法
JP3948377B2 (ja) * 2002-09-12 2007-07-25 株式会社豊田中央研究所 圧接型半導体装置
US7518247B2 (en) * 2002-11-29 2009-04-14 Nec Corporation Semiconductor device and its manufacturing method
JP4689218B2 (ja) * 2003-09-12 2011-05-25 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4723195B2 (ja) * 2004-03-05 2011-07-13 株式会社オクテック プローブの製造方法
JP2005272271A (ja) * 2004-03-26 2005-10-06 Nippon Telegr & Teleph Corp <Ntt> カーボンナノチューブの製造方法及び半導体装置の製造方法

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