JP2007095879A5 - - Google Patents

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Publication number
JP2007095879A5
JP2007095879A5 JP2005281426A JP2005281426A JP2007095879A5 JP 2007095879 A5 JP2007095879 A5 JP 2007095879A5 JP 2005281426 A JP2005281426 A JP 2005281426A JP 2005281426 A JP2005281426 A JP 2005281426A JP 2007095879 A5 JP2007095879 A5 JP 2007095879A5
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JP
Japan
Prior art keywords
path
inert gas
circulation path
discharge
substrate
Prior art date
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Pending
Application number
JP2005281426A
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English (en)
Japanese (ja)
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JP2007095879A (ja
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Publication date
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Priority to JP2005281426A priority Critical patent/JP2007095879A/ja
Priority claimed from JP2005281426A external-priority patent/JP2007095879A/ja
Publication of JP2007095879A publication Critical patent/JP2007095879A/ja
Publication of JP2007095879A5 publication Critical patent/JP2007095879A5/ja
Pending legal-status Critical Current

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JP2005281426A 2005-09-28 2005-09-28 基板処理装置 Pending JP2007095879A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005281426A JP2007095879A (ja) 2005-09-28 2005-09-28 基板処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005281426A JP2007095879A (ja) 2005-09-28 2005-09-28 基板処理装置

Publications (2)

Publication Number Publication Date
JP2007095879A JP2007095879A (ja) 2007-04-12
JP2007095879A5 true JP2007095879A5 (enrdf_load_stackoverflow) 2008-10-23

Family

ID=37981231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005281426A Pending JP2007095879A (ja) 2005-09-28 2005-09-28 基板処理装置

Country Status (1)

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JP (1) JP2007095879A (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4684310B2 (ja) * 2007-08-14 2011-05-18 株式会社日立国際電気 基板処理装置
US8443484B2 (en) 2007-08-14 2013-05-21 Hitachi Kokusai Electric Inc. Substrate processing apparatus
JP5796972B2 (ja) * 2010-06-14 2015-10-21 株式会社日立国際電気 基板処理装置
JP2014067979A (ja) * 2012-09-27 2014-04-17 Hitachi Kokusai Electric Inc 基板処理装置、基板処理方法及び半導体装置の製造方法
JP6992283B2 (ja) * 2017-05-31 2022-01-13 Tdk株式会社 Ｅｆｅｍ及びｅｆｅｍへの乾燥空気の導入方法
TWI709163B (zh) 2017-09-26 2020-11-01 日商國際電氣股份有限公司 基板處理裝置、半導體裝置之製造方法及程式
JP6876020B2 (ja) 2018-07-27 2021-05-26 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置および半導体装置の製造方法並びにプログラム
KR102582276B1 (ko) * 2019-12-19 2023-09-25 주식회사 원익아이피에스 기판처리장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06177054A (ja) * 1992-12-01 1994-06-24 Shinko Electric Co Ltd 縦型半導体製造装置における主室のガス置換方法、及びその装置
JP3330166B2 (ja) * 1992-12-04 2002-09-30 東京エレクトロン株式会社 処理装置
JP3372581B2 (ja) * 1993-01-21 2003-02-04 東京エレクトロン株式会社 処理装置
JP3402713B2 (ja) * 1993-12-10 2003-05-06 東京エレクトロン株式会社 熱処理装置
JP4876322B2 (ja) * 2001-03-30 2012-02-15 東京エレクトロン株式会社 ロードロック室、その排気方法及び熱処理装置

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