JP2007095879A5 - - Google Patents

Download PDF

Info

Publication number
JP2007095879A5
JP2007095879A5 JP2005281426A JP2005281426A JP2007095879A5 JP 2007095879 A5 JP2007095879 A5 JP 2007095879A5 JP 2005281426 A JP2005281426 A JP 2005281426A JP 2005281426 A JP2005281426 A JP 2005281426A JP 2007095879 A5 JP2007095879 A5 JP 2007095879A5
Authority
JP
Japan
Prior art keywords
path
inert gas
circulation path
discharge
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005281426A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007095879A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005281426A priority Critical patent/JP2007095879A/ja
Priority claimed from JP2005281426A external-priority patent/JP2007095879A/ja
Publication of JP2007095879A publication Critical patent/JP2007095879A/ja
Publication of JP2007095879A5 publication Critical patent/JP2007095879A5/ja
Pending legal-status Critical Current

Links

JP2005281426A 2005-09-28 2005-09-28 基板処理装置 Pending JP2007095879A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005281426A JP2007095879A (ja) 2005-09-28 2005-09-28 基板処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005281426A JP2007095879A (ja) 2005-09-28 2005-09-28 基板処理装置

Publications (2)

Publication Number Publication Date
JP2007095879A JP2007095879A (ja) 2007-04-12
JP2007095879A5 true JP2007095879A5 (enrdf_load_stackoverflow) 2008-10-23

Family

ID=37981231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005281426A Pending JP2007095879A (ja) 2005-09-28 2005-09-28 基板処理装置

Country Status (1)

Country Link
JP (1) JP2007095879A (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4684310B2 (ja) * 2007-08-14 2011-05-18 株式会社日立国際電気 基板処理装置
US8443484B2 (en) 2007-08-14 2013-05-21 Hitachi Kokusai Electric Inc. Substrate processing apparatus
JP5796972B2 (ja) 2010-06-14 2015-10-21 株式会社日立国際電気 基板処理装置
JP2014067979A (ja) * 2012-09-27 2014-04-17 Hitachi Kokusai Electric Inc 基板処理装置、基板処理方法及び半導体装置の製造方法
JP6992283B2 (ja) * 2017-05-31 2022-01-13 Tdk株式会社 Efem及びefemへの乾燥空気の導入方法
TWI709163B (zh) 2017-09-26 2020-11-01 日商國際電氣股份有限公司 基板處理裝置、半導體裝置之製造方法及程式
JP6876020B2 (ja) 2018-07-27 2021-05-26 株式会社Kokusai Electric 基板処理装置および半導体装置の製造方法並びにプログラム
KR102582276B1 (ko) * 2019-12-19 2023-09-25 주식회사 원익아이피에스 기판처리장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06177054A (ja) * 1992-12-01 1994-06-24 Shinko Electric Co Ltd 縦型半導体製造装置における主室のガス置換方法、及びその装置
JP3330166B2 (ja) * 1992-12-04 2002-09-30 東京エレクトロン株式会社 処理装置
JP3372581B2 (ja) * 1993-01-21 2003-02-04 東京エレクトロン株式会社 処理装置
JP3402713B2 (ja) * 1993-12-10 2003-05-06 東京エレクトロン株式会社 熱処理装置
JP4876322B2 (ja) * 2001-03-30 2012-02-15 東京エレクトロン株式会社 ロードロック室、その排気方法及び熱処理装置

Similar Documents

Publication Publication Date Title
JP2022050623A (ja) 半導体システムにおける湿度制御
ES2957701T3 (es) Métodos y aparato para el secado de dispositivos electrónicos
TWI392009B (zh) 液體處理裝置、液體處理方法及記憶媒體
TWI389711B (zh) 隔離器
TW201837970A (zh) 基板處理裝置、基板處理方法及記錄媒體
TWI726886B (zh) 基板處理裝置及基板處理方法
TW200834687A (en) Substrate processing apparatus and substrate processing method
JP2007095879A5 (enrdf_load_stackoverflow)
WO2002063065A1 (fr) Dispositif de formation de pellicule mince
TW202501682A (zh) 基板處理裝置及基板處理方法
JP2023001147A (ja) 基板処理装置
JP2015146347A5 (enrdf_load_stackoverflow)
US20200047224A1 (en) Method of removing particles of substrate processing apparatus, and substrate processing apparatus
TWI635559B (zh) 裝載埠的吹淨裝置及其吹淨方法
JP2009283699A5 (enrdf_load_stackoverflow)
TW201529187A (zh) 循環基板容器清洗系統及其方法
TW200703498A (en) Methods for rinsing microelectronic substrates utilizing cool rinse fluid within a gas environment including a drying enhancement substance
US20180279485A1 (en) Reflow soldering apparatus, system and method
ATE455365T1 (de) Flüssigkeitsverarbeitungsvorrichtung
JP2016157802A5 (enrdf_load_stackoverflow)
TW200746267A (en) Heat treatment method, heat treatment device, and storage medium
CN104941957A (zh) 晶圆清洁装置及方法
JP2013030559A5 (enrdf_load_stackoverflow)
JP2003271218A5 (enrdf_load_stackoverflow)
TW200644052A (en) Substrate processing method and manufacturing method of semiconductor device