JP2007095879A5 - - Google Patents

Claims (2)

A processing chamber for processing the substrate;
A substrate holder for holding the substrate and carrying it into the processing chamber;
A standby chamber in which the substrate holder waits for loading into the processing chamber;
A circulation path for circulating an inert gas in the standby chamber;
A circulation path opening and closing valve that is installed in the circulation path and opens and closes the circulation path;
An inert gas supply path for supplying the inert gas to the circulation path;
A clean air supply path for supplying clean air to the circulation path;
Wherein the beauty Oyo said inert gas from the circulation passage clean air or a discharge passage for discharging the inert gas or the clean air, and a discharge passage opening and closing valve for opening and closing the discharge passage is provided in the discharge passage,
A bypass passage installed in the discharge passage and bypassing the discharge passage on-off valve;
A substrate processing apparatus comprising: When processing the substrate placed on the substrate holder in the processing chamber, the inert gas is supplied from the inert gas supply path to the circulation path, and the substrate holder waits for loading into the processing chamber. While circulating the atmosphere of the standby chamber through the circulation path, the discharge path on / off valve installed in the discharge path is closed, and the atmosphere in the standby chamber is changed from the bypass path bypassing the discharge path on / off valve installed in the discharge path. A method of manufacturing a semiconductor integrated circuit device, comprising: discharging.