JP2000340641A5 - - Google Patents

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Publication number
JP2000340641A5
JP2000340641A5 JP1999148547A JP14854799A JP2000340641A5 JP 2000340641 A5 JP2000340641 A5 JP 2000340641A5 JP 1999148547 A JP1999148547 A JP 1999148547A JP 14854799 A JP14854799 A JP 14854799A JP 2000340641 A5 JP2000340641 A5 JP 2000340641A5
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JP
Japan
Prior art keywords
cassette
inert gas
port
gas supply
opened
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1999148547A
Other languages
Japanese (ja)
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JP4308975B2 (en
JP2000340641A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP14854799A priority Critical patent/JP4308975B2/en
Priority claimed from JP14854799A external-priority patent/JP4308975B2/en
Publication of JP2000340641A publication Critical patent/JP2000340641A/en
Publication of JP2000340641A5 publication Critical patent/JP2000340641A5/ja
Application granted granted Critical
Publication of JP4308975B2 publication Critical patent/JP4308975B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【特許請求の範囲】
【請求項1】ウェーハが装填される密閉式カセットを受載するカセット棚を具備する基板処理装置に於いて、前記密閉式カセットの前面の開口部を蓋するカセット蓋が設けられ、前記密閉式カセットの底板に不活性ガス流入ポートとカセット内雰囲気流出ポートが設けられ、前記カセット棚に不活性ガス供給ポートとカセット内雰囲気排出ポートが設けられ、前記カセットがカセット棚に受載された状態で、前記不活性ガス流入ポートと前記不活性ガス供給ポートが嵌合可能とし、前記カセット内雰囲気流出ポートと前記カセット内雰囲気排出ポートが嵌合可能とし、前記カセットのカセット蓋が開かれ、前記開口部が開口した状態で、前記不活性ガス供給ポートから前記カセット内へ不活性ガスを供するよう前記不活性ガス供給ポートに不活性ガス供給源が接続されたことを特徴とする基板処理装置。
[Claims]
1. In a substrate processing apparatus including a cassette shelf for receiving a closed cassette on which a wafer is loaded, a cassette lid for covering an opening on the front surface of the closed cassette is provided, and the closed type is provided. An inert gas inflow port and an atmosphere outflow port in the cassette are provided on the bottom plate of the cassette, an inert gas supply port and an atmosphere discharge port in the cassette are provided on the cassette shelf, and the cassette is placed on the cassette shelf. The inert gas inflow port and the inert gas supply port can be fitted, the atmosphere outflow port in the cassette and the atmosphere discharge port in the cassette can be fitted, the cassette lid of the cassette is opened, and the opening is opened. in a state in which parts are opened, the substrate processing apparatus, characterized in that the inert gas supply port inert gas supply source is connected to supply feed the inert gas from the inert gas supply port into the cassette ..

JP14854799A 1999-05-27 1999-05-27 Substrate processing apparatus, substrate processing method, and semiconductor element forming method Expired - Lifetime JP4308975B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14854799A JP4308975B2 (en) 1999-05-27 1999-05-27 Substrate processing apparatus, substrate processing method, and semiconductor element forming method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14854799A JP4308975B2 (en) 1999-05-27 1999-05-27 Substrate processing apparatus, substrate processing method, and semiconductor element forming method

Publications (3)

Publication Number Publication Date
JP2000340641A JP2000340641A (en) 2000-12-08
JP2000340641A5 true JP2000340641A5 (en) 2006-07-06
JP4308975B2 JP4308975B2 (en) 2009-08-05

Family

ID=15455212

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14854799A Expired - Lifetime JP4308975B2 (en) 1999-05-27 1999-05-27 Substrate processing apparatus, substrate processing method, and semiconductor element forming method

Country Status (1)

Country Link
JP (1) JP4308975B2 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003007813A (en) * 2001-06-20 2003-01-10 Nec Corp Storing box for semiconductor wafer, carrying device, carrying method and storage house
KR20030009763A (en) * 2001-07-24 2003-02-05 삼성전자주식회사 Custody apparatus of wafer
JP2003197468A (en) 2001-10-19 2003-07-11 Nec Tokin Toyama Ltd Solid electrolytic capacitor and manufacturing method therefor
CN101506087B (en) * 2006-06-19 2011-09-21 诚实公司 System for purging reticle storage
JP4670808B2 (en) * 2006-12-22 2011-04-13 ムラテックオートメーション株式会社 Container transport system and measuring container
JP2010041015A (en) * 2008-08-05 2010-02-18 Kondo Kogyo Kk Storage shelf for semiconductor wafer housing container
JP5381054B2 (en) * 2008-12-02 2014-01-08 シンフォニアテクノロジー株式会社 Load port
KR100904999B1 (en) 2008-12-29 2009-06-26 (주)서울산업기술 Sampling carrier
WO2013001482A1 (en) 2011-06-28 2013-01-03 Dynamic Micro Systems Semiconductor stocker systems and methods.
JP5598728B2 (en) * 2011-12-22 2014-10-01 株式会社ダイフク Inert gas injection device
US9878353B2 (en) * 2012-08-21 2018-01-30 Murata Machinery, Ltd Stocker provided with purging functionality, stocker unit, and method for supplying cleaning gas
JP5984030B2 (en) * 2013-03-05 2016-09-06 村田機械株式会社 Measuring unit and purge gas flow rate measuring method
JP6106501B2 (en) 2013-04-12 2017-04-05 東京エレクトロン株式会社 How to manage the atmosphere in the storage container
JP6403431B2 (en) 2013-06-28 2018-10-10 株式会社Kokusai Electric Substrate processing apparatus, flow rate monitoring method, semiconductor device manufacturing method, and flow rate monitoring program
CN105940487B (en) * 2014-02-07 2018-12-04 村田机械株式会社 Purification device and purification method
JP6414525B2 (en) * 2015-09-02 2018-10-31 株式会社ダイフク Storage facilities
JP6817757B2 (en) 2016-09-16 2021-01-20 東京エレクトロン株式会社 Substrate processing equipment and substrate transfer method
KR102206194B1 (en) 2017-09-26 2021-01-22 가부시키가이샤 코쿠사이 엘렉트릭 Substrate processing apparatus and method of manufacturing semiconductor device

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