JP2007067179A - 半導体ウエーハの鏡面研磨方法及び鏡面研磨システム - Google Patents

半導体ウエーハの鏡面研磨方法及び鏡面研磨システム Download PDF

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Publication number
JP2007067179A
JP2007067179A JP2005251410A JP2005251410A JP2007067179A JP 2007067179 A JP2007067179 A JP 2007067179A JP 2005251410 A JP2005251410 A JP 2005251410A JP 2005251410 A JP2005251410 A JP 2005251410A JP 2007067179 A JP2007067179 A JP 2007067179A
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JP
Japan
Prior art keywords
polishing
wafer
mirror
rough
semiconductor wafer
Prior art date
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Application number
JP2005251410A
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English (en)
Japanese (ja)
Inventor
Hiromasa Hashimoto
浩昌 橋本
Hisashi Masumura
寿 桝村
Koji Kitagawa
幸司 北川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
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Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Priority to JP2005251410A priority Critical patent/JP2007067179A/ja
Priority to PCT/JP2006/316301 priority patent/WO2007026556A1/fr
Publication of JP2007067179A publication Critical patent/JP2007067179A/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2005251410A 2005-08-31 2005-08-31 半導体ウエーハの鏡面研磨方法及び鏡面研磨システム Pending JP2007067179A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005251410A JP2007067179A (ja) 2005-08-31 2005-08-31 半導体ウエーハの鏡面研磨方法及び鏡面研磨システム
PCT/JP2006/316301 WO2007026556A1 (fr) 2005-08-31 2006-08-21 Procédé et système de brillantage d’une plaquette semi-conductrice

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005251410A JP2007067179A (ja) 2005-08-31 2005-08-31 半導体ウエーハの鏡面研磨方法及び鏡面研磨システム

Publications (1)

Publication Number Publication Date
JP2007067179A true JP2007067179A (ja) 2007-03-15

Family

ID=37808655

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005251410A Pending JP2007067179A (ja) 2005-08-31 2005-08-31 半導体ウエーハの鏡面研磨方法及び鏡面研磨システム

Country Status (2)

Country Link
JP (1) JP2007067179A (fr)
WO (1) WO2007026556A1 (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007335876A (ja) * 2006-06-14 2007-12-27 Inopla Inc 半導体ウェーハ研磨装置
JP2011187956A (ja) * 2010-03-10 2011-09-22 Siltronic Ag 半導体ウェハの研磨方法
WO2012147279A1 (fr) * 2011-04-26 2012-11-01 信越半導体株式会社 Plaquette à semi-conducteurs et son procédé de fabrication
DE112011100598T5 (de) 2010-02-19 2013-01-31 Shin-Etsu Handotai Co., Ltd. Polierkopf und Poliervorrichtung
CN104942698A (zh) * 2014-03-31 2015-09-30 株式会社荏原制作所 研磨装置及研磨方法
JP2015193065A (ja) * 2014-03-31 2015-11-05 株式会社荏原製作所 研磨装置および研磨方法
WO2017082161A1 (fr) * 2015-11-13 2017-05-18 株式会社Sumco Procédé et dispositif de polissage de tranche
JP2018051762A (ja) * 2018-01-05 2018-04-05 株式会社荏原製作所 研磨装置および研磨方法
US10424484B2 (en) 2015-01-23 2019-09-24 Shin-Etsu Handotai Co., Ltd. Method for manufacturing a bonded SOI wafer

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6336893B2 (ja) * 2014-11-11 2018-06-06 株式会社荏原製作所 研磨装置

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09254028A (ja) * 1996-03-25 1997-09-30 Ebara Corp ポリッシング装置のプッシャー
JP2000094312A (ja) * 1998-09-29 2000-04-04 Ebara Corp ポリッシング装置
JP2000315665A (ja) * 1999-04-29 2000-11-14 Ebara Corp 研磨方法及び装置
JP2000323552A (ja) * 1999-05-14 2000-11-24 Super Silicon Kenkyusho:Kk ウエハローダ
JP2001135604A (ja) * 1999-08-20 2001-05-18 Ebara Corp ポリッシング装置
WO2002075798A1 (fr) * 2001-03-16 2002-09-26 Shin-Etsu Handotai Co.,Ltd. Eau et procede de stockage d'une tranche de silicium
JP2004154928A (ja) * 2002-10-17 2004-06-03 Ebara Corp 研磨状態監視装置、ポリッシング装置、及び研磨方法
JP2004209588A (ja) * 2002-12-27 2004-07-29 Ebara Corp 研磨装置及び研磨方法
JP2005046924A (ja) * 2003-07-30 2005-02-24 Komatsu Electronic Metals Co Ltd 研磨装置および研磨方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000208453A (ja) * 1999-01-14 2000-07-28 Hitachi Cable Ltd 半導体結晶ウエハの研磨方法
JP2002289562A (ja) * 2001-03-27 2002-10-04 Mitsubishi Materials Silicon Corp 半導体ウェーハの製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09254028A (ja) * 1996-03-25 1997-09-30 Ebara Corp ポリッシング装置のプッシャー
JP2000094312A (ja) * 1998-09-29 2000-04-04 Ebara Corp ポリッシング装置
JP2000315665A (ja) * 1999-04-29 2000-11-14 Ebara Corp 研磨方法及び装置
JP2000323552A (ja) * 1999-05-14 2000-11-24 Super Silicon Kenkyusho:Kk ウエハローダ
JP2001135604A (ja) * 1999-08-20 2001-05-18 Ebara Corp ポリッシング装置
WO2002075798A1 (fr) * 2001-03-16 2002-09-26 Shin-Etsu Handotai Co.,Ltd. Eau et procede de stockage d'une tranche de silicium
JP2004154928A (ja) * 2002-10-17 2004-06-03 Ebara Corp 研磨状態監視装置、ポリッシング装置、及び研磨方法
JP2004209588A (ja) * 2002-12-27 2004-07-29 Ebara Corp 研磨装置及び研磨方法
JP2005046924A (ja) * 2003-07-30 2005-02-24 Komatsu Electronic Metals Co Ltd 研磨装置および研磨方法

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007335876A (ja) * 2006-06-14 2007-12-27 Inopla Inc 半導体ウェーハ研磨装置
US9278425B2 (en) 2010-02-19 2016-03-08 Shin-Etsu Handotai Co., Ltd. Polishing head and polishing apparatus
DE112011100598B4 (de) 2010-02-19 2023-08-03 Shin-Etsu Handotai Co., Ltd. Polierkopf und Poliervorrichtung
DE112011100598T5 (de) 2010-02-19 2013-01-31 Shin-Etsu Handotai Co., Ltd. Polierkopf und Poliervorrichtung
JP2011187956A (ja) * 2010-03-10 2011-09-22 Siltronic Ag 半導体ウェハの研磨方法
JP2012231005A (ja) * 2011-04-26 2012-11-22 Shin Etsu Handotai Co Ltd 半導体ウェーハ及びその製造方法
US9076750B2 (en) 2011-04-26 2015-07-07 Shin-Etsu Handotai Co., Ltd. Semiconductor wafer and manufacturing method thereof
WO2012147279A1 (fr) * 2011-04-26 2012-11-01 信越半導体株式会社 Plaquette à semi-conducteurs et son procédé de fabrication
CN104942698A (zh) * 2014-03-31 2015-09-30 株式会社荏原制作所 研磨装置及研磨方法
KR20150113875A (ko) * 2014-03-31 2015-10-08 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
JP2015193065A (ja) * 2014-03-31 2015-11-05 株式会社荏原製作所 研磨装置および研磨方法
KR102323430B1 (ko) * 2014-03-31 2021-11-09 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
US10424484B2 (en) 2015-01-23 2019-09-24 Shin-Etsu Handotai Co., Ltd. Method for manufacturing a bonded SOI wafer
WO2017082161A1 (fr) * 2015-11-13 2017-05-18 株式会社Sumco Procédé et dispositif de polissage de tranche
JP2018051762A (ja) * 2018-01-05 2018-04-05 株式会社荏原製作所 研磨装置および研磨方法

Also Published As

Publication number Publication date
WO2007026556A1 (fr) 2007-03-08

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