JP2007059892A5 - - Google Patents

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Publication number
JP2007059892A5
JP2007059892A5 JP2006202485A JP2006202485A JP2007059892A5 JP 2007059892 A5 JP2007059892 A5 JP 2007059892A5 JP 2006202485 A JP2006202485 A JP 2006202485A JP 2006202485 A JP2006202485 A JP 2006202485A JP 2007059892 A5 JP2007059892 A5 JP 2007059892A5
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JP
Japan
Prior art keywords
copper foil
heat treatment
treatment step
copper
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006202485A
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English (en)
Japanese (ja)
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JP4781930B2 (ja
JP2007059892A (ja
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Priority to JP2006202485A priority Critical patent/JP4781930B2/ja
Priority claimed from JP2006202485A external-priority patent/JP4781930B2/ja
Publication of JP2007059892A publication Critical patent/JP2007059892A/ja
Publication of JP2007059892A5 publication Critical patent/JP2007059892A5/ja
Application granted granted Critical
Publication of JP4781930B2 publication Critical patent/JP4781930B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006202485A 2005-07-27 2006-07-25 高屈曲性フレキシブル銅張積層板の製造方法 Active JP4781930B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006202485A JP4781930B2 (ja) 2005-07-27 2006-07-25 高屈曲性フレキシブル銅張積層板の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005217064 2005-07-27
JP2005217064 2005-07-27
JP2006202485A JP4781930B2 (ja) 2005-07-27 2006-07-25 高屈曲性フレキシブル銅張積層板の製造方法

Publications (3)

Publication Number Publication Date
JP2007059892A JP2007059892A (ja) 2007-03-08
JP2007059892A5 true JP2007059892A5 (https=) 2009-04-16
JP4781930B2 JP4781930B2 (ja) 2011-09-28

Family

ID=37923054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006202485A Active JP4781930B2 (ja) 2005-07-27 2006-07-25 高屈曲性フレキシブル銅張積層板の製造方法

Country Status (1)

Country Link
JP (1) JP4781930B2 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100006575A (ko) * 2007-06-08 2010-01-19 미쓰이 긴조꾸 고교 가부시키가이샤 전자 부품 실장용 적층 필름, 전자 부품 실장용 필름 캐리어 테이프 및 반도체 장치
JP4477665B2 (ja) * 2007-12-10 2010-06-09 古河電気工業株式会社 電解銅箔および配線板
WO2010004988A1 (ja) * 2008-07-07 2010-01-14 古河電気工業株式会社 電解銅箔および銅張積層板
JP2010280191A (ja) * 2009-06-08 2010-12-16 Hitachi Cable Ltd 熱処理用銅箔、熱処理用銅箔の製造方法およびフレキシブルプリント配線板
JP2012156469A (ja) * 2011-01-28 2012-08-16 Nippon Steel Chem Co Ltd フレキシブル回路基板
JP5940010B2 (ja) * 2012-03-28 2016-06-29 古河電気工業株式会社 表面粗化処理銅箔及びその製造方法、並びに回路基板
JP6344914B2 (ja) * 2013-12-27 2018-06-20 新日鉄住金化学株式会社 フレキシブル銅張積層板及びフレキシブル回路基板
US11279323B2 (en) * 2016-07-12 2022-03-22 Dai Nippon Printing Co., Ltd. Patterned conductor, sheet with conductor, heating plate, vehicle, and manufacturing method of patterned conductor
JP6578419B2 (ja) * 2018-06-25 2019-09-18 日鉄ケミカル＆マテリアル株式会社 銅張積層板の製造方法
JP6732065B2 (ja) * 2019-02-20 2020-07-29 日鉄ケミカル＆マテリアル株式会社 フレキシブル銅張積層板及びフレキシブル回路基板
CN115179638B (zh) * 2022-06-29 2024-02-27 厦门爱谱生电子科技有限公司 一种柔性覆铜板的制作方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3768104B2 (ja) * 2001-01-22 2006-04-19 ソニーケミカル株式会社 フレキシブルプリント基板
JP4789398B2 (ja) * 2003-03-28 2011-10-12 三井化学株式会社 ポリイミド組成物およびポリイミド金属積層板
JP4174676B2 (ja) * 2004-05-07 2008-11-05 信越化学工業株式会社 フレキシブル銅張積層板の製造方法

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