JP2010001543A5 - - Google Patents
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- Publication number
- JP2010001543A5 JP2010001543A5 JP2008162725A JP2008162725A JP2010001543A5 JP 2010001543 A5 JP2010001543 A5 JP 2010001543A5 JP 2008162725 A JP2008162725 A JP 2008162725A JP 2008162725 A JP2008162725 A JP 2008162725A JP 2010001543 A5 JP2010001543 A5 JP 2010001543A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- copper film
- copper
- layer
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 20
- 239000010949 copper Substances 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 239000007789 gas Substances 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 238000000059 patterning Methods 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims 2
- 230000001678 irradiating effect Effects 0.000 claims 2
- 229920000647 polyepoxide Polymers 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 229920006122 polyamide resin Polymers 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008162725A JP2010001543A (ja) | 2008-06-23 | 2008-06-23 | 銅膜形成方法及び配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008162725A JP2010001543A (ja) | 2008-06-23 | 2008-06-23 | 銅膜形成方法及び配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010001543A JP2010001543A (ja) | 2010-01-07 |
| JP2010001543A5 true JP2010001543A5 (https=) | 2011-05-12 |
Family
ID=41583485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008162725A Pending JP2010001543A (ja) | 2008-06-23 | 2008-06-23 | 銅膜形成方法及び配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2010001543A (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5721254B2 (ja) * | 2010-09-17 | 2015-05-20 | 国立大学法人大阪大学 | 誘電体基材表面の触媒フリー金属化方法及び金属膜付き誘電体基材 |
| US20180315680A1 (en) * | 2015-11-11 | 2018-11-01 | Nhk Spring Co., Ltd. | Laminate and method of manufacturing laminate |
| WO2018101404A1 (ja) * | 2016-12-02 | 2018-06-07 | 株式会社アルバック | 配線基板の加工方法 |
| KR101842447B1 (ko) * | 2017-04-06 | 2018-05-14 | 주식회사 피엔에스테크놀로지 | 저온경화형 폴리이미드 전구체 조성물 |
| EP4276880B1 (fr) * | 2022-05-10 | 2025-02-19 | Rubattel et Weyermann S.A. | Procédé de modification de l état de surface d'une pièce par bombardement ionique |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006057059A (ja) * | 2004-08-23 | 2006-03-02 | Fuji Photo Film Co Ltd | 表面導電性材料の製造方法 |
| JP2007150221A (ja) * | 2005-10-27 | 2007-06-14 | Fujitsu Ltd | 多層回路基板およびその製造方法 |
| JP4825578B2 (ja) * | 2006-05-15 | 2011-11-30 | 新光電気工業株式会社 | 無電解めっき方法 |
-
2008
- 2008-06-23 JP JP2008162725A patent/JP2010001543A/ja active Pending
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