JP2011258664A5 - - Google Patents
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- Publication number
- JP2011258664A5 JP2011258664A5 JP2010130422A JP2010130422A JP2011258664A5 JP 2011258664 A5 JP2011258664 A5 JP 2011258664A5 JP 2010130422 A JP2010130422 A JP 2010130422A JP 2010130422 A JP2010130422 A JP 2010130422A JP 2011258664 A5 JP2011258664 A5 JP 2011258664A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- tin
- forming
- titanium
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010130422A JP5498864B2 (ja) | 2010-06-07 | 2010-06-07 | 配線基板及び配線基板の製造方法 |
| US13/153,590 US8664536B2 (en) | 2010-06-07 | 2011-06-06 | Wiring substrate and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010130422A JP5498864B2 (ja) | 2010-06-07 | 2010-06-07 | 配線基板及び配線基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011258664A JP2011258664A (ja) | 2011-12-22 |
| JP2011258664A5 true JP2011258664A5 (https=) | 2013-05-16 |
| JP5498864B2 JP5498864B2 (ja) | 2014-05-21 |
Family
ID=45063591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010130422A Active JP5498864B2 (ja) | 2010-06-07 | 2010-06-07 | 配線基板及び配線基板の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8664536B2 (https=) |
| JP (1) | JP5498864B2 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5608430B2 (ja) * | 2010-06-07 | 2014-10-15 | 新光電気工業株式会社 | 配線基板及び配線基板の製造方法 |
| JP2012212867A (ja) * | 2011-03-30 | 2012-11-01 | Ibiden Co Ltd | プリント配線板及びその製造方法 |
| WO2017100752A2 (en) * | 2015-12-11 | 2017-06-15 | Thin Film Electronics Asa | Electronic device having a plated antenna and/or trace, and methods of making and using the same |
| JP6696567B2 (ja) * | 2016-05-16 | 2020-05-20 | 株式会社村田製作所 | セラミック電子部品 |
| CN111293072B (zh) * | 2018-12-10 | 2023-06-20 | 联华电子股份有限公司 | 半导体元件及其制作方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006261167A (ja) * | 2005-03-15 | 2006-09-28 | Murata Mfg Co Ltd | 配線基板およびその製造方法 |
| JP5082253B2 (ja) * | 2006-02-10 | 2012-11-28 | 大日本印刷株式会社 | 受動素子内蔵配線基板およびその製造方法 |
| JP5231733B2 (ja) * | 2006-11-27 | 2013-07-10 | パナソニック株式会社 | 貫通孔配線構造およびその形成方法 |
| JP2009238957A (ja) * | 2008-03-26 | 2009-10-15 | Panasonic Electric Works Co Ltd | 基板へのビアの形成方法 |
| JP5343245B2 (ja) * | 2008-05-15 | 2013-11-13 | 新光電気工業株式会社 | シリコンインターポーザの製造方法 |
| JP2010050116A (ja) * | 2008-08-19 | 2010-03-04 | Fcm Kk | 多層積層回路基板 |
| US7741148B1 (en) * | 2008-12-10 | 2010-06-22 | Stats Chippac, Ltd. | Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support |
| US8248803B2 (en) * | 2010-03-31 | 2012-08-21 | Hong Kong Applied Science and Technology Research Institute Company Limited | Semiconductor package and method of manufacturing the same |
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2010
- 2010-06-07 JP JP2010130422A patent/JP5498864B2/ja active Active
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2011
- 2011-06-06 US US13/153,590 patent/US8664536B2/en active Active