JP2007046132A - 高炉出銑孔充填用マッド材 - Google Patents
高炉出銑孔充填用マッド材 Download PDFInfo
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- JP2007046132A JP2007046132A JP2005233748A JP2005233748A JP2007046132A JP 2007046132 A JP2007046132 A JP 2007046132A JP 2005233748 A JP2005233748 A JP 2005233748A JP 2005233748 A JP2005233748 A JP 2005233748A JP 2007046132 A JP2007046132 A JP 2007046132A
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Abstract
【解決手段】耐火原料と熱可塑性炭素質バインダーとを主材とし、前記耐火原料の3〜50質量%をシュンガイト鉱石とする。シュンガイト鉱石は、化学成分値でC:20〜50質量%およびSiO2:40〜70質量%を含むものを使用する。これにより均一かつ十分なSiCボンドを形成することで、長時間出銑が可能でかつ開孔性を有する。
【選択図】なし
Description
Claims (2)
- 耐火原料と熱可塑性炭素質バインダーとを主材とし、前記耐火原料の3〜50質量%をシュンガイト鉱石とした高炉出銑孔充填用マッド材。
- シュンガイト鉱石が、化学成分値でC:20〜50質量%およびSiO2:40〜70質量%を含む請求項1記載の高炉出銑孔充填用マッド材。
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JP2005233748A JP4669346B2 (ja) | 2005-08-11 | 2005-08-11 | 高炉出銑孔充填用マッド材 |
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JP2005233748A JP4669346B2 (ja) | 2005-08-11 | 2005-08-11 | 高炉出銑孔充填用マッド材 |
Publications (3)
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JP2007046132A true JP2007046132A (ja) | 2007-02-22 |
JP2007046132A5 JP2007046132A5 (ja) | 2008-05-01 |
JP4669346B2 JP4669346B2 (ja) | 2011-04-13 |
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JP2005233748A Expired - Fee Related JP4669346B2 (ja) | 2005-08-11 | 2005-08-11 | 高炉出銑孔充填用マッド材 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1973095A2 (en) | 2007-02-26 | 2008-09-24 | Sony Corporation | Image processing system, information processing apparatus, image processing method and program |
TWI712576B (zh) * | 2018-03-22 | 2020-12-11 | 日商黑崎播磨股份有限公司 | 堵泥 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0733539A (ja) * | 1993-07-16 | 1995-02-03 | Shinagawa Refract Co Ltd | 高炉出銑口閉塞材 |
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2005
- 2005-08-11 JP JP2005233748A patent/JP4669346B2/ja not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0733539A (ja) * | 1993-07-16 | 1995-02-03 | Shinagawa Refract Co Ltd | 高炉出銑口閉塞材 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1973095A2 (en) | 2007-02-26 | 2008-09-24 | Sony Corporation | Image processing system, information processing apparatus, image processing method and program |
TWI712576B (zh) * | 2018-03-22 | 2020-12-11 | 日商黑崎播磨股份有限公司 | 堵泥 |
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JP4669346B2 (ja) | 2011-04-13 |
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