JP2007039567A5 - - Google Patents

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Publication number
JP2007039567A5
JP2007039567A5 JP2005225980A JP2005225980A JP2007039567A5 JP 2007039567 A5 JP2007039567 A5 JP 2007039567A5 JP 2005225980 A JP2005225980 A JP 2005225980A JP 2005225980 A JP2005225980 A JP 2005225980A JP 2007039567 A5 JP2007039567 A5 JP 2007039567A5
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JP
Japan
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weight
parts
composite molded
frequency electronic
matrix
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Pending
Application number
JP2005225980A
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English (en)
Japanese (ja)
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JP2007039567A (ja
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Priority to JP2005225980A priority Critical patent/JP2007039567A/ja
Priority claimed from JP2005225980A external-priority patent/JP2007039567A/ja
Publication of JP2007039567A publication Critical patent/JP2007039567A/ja
Publication of JP2007039567A5 publication Critical patent/JP2007039567A5/ja
Pending legal-status Critical Current

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JP2005225980A 2005-08-03 2005-08-03 高周波電子部品用複合成形体及び高周波電子部品用複合成形体製造用組成物 Pending JP2007039567A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005225980A JP2007039567A (ja) 2005-08-03 2005-08-03 高周波電子部品用複合成形体及び高周波電子部品用複合成形体製造用組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005225980A JP2007039567A (ja) 2005-08-03 2005-08-03 高周波電子部品用複合成形体及び高周波電子部品用複合成形体製造用組成物

Publications (2)

Publication Number Publication Date
JP2007039567A JP2007039567A (ja) 2007-02-15
JP2007039567A5 true JP2007039567A5 (https=) 2008-10-23

Family

ID=37797858

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005225980A Pending JP2007039567A (ja) 2005-08-03 2005-08-03 高周波電子部品用複合成形体及び高周波電子部品用複合成形体製造用組成物

Country Status (1)

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JP (1) JP2007039567A (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007040925A1 (de) * 2007-08-30 2009-03-05 Bayer Materialscience Ag Thermoplastische Zusammensetzungen mit geringer Trübung
JP5221088B2 (ja) * 2007-09-12 2013-06-26 株式会社クラレ 透明導電膜およびその製造方法
JP2011042030A (ja) * 2007-12-18 2011-03-03 Taisei Plas Co Ltd 金属と被着物の接合体、及びその製造方法
CN102171770B (zh) * 2008-08-08 2014-07-09 Pp-梅德有限公司 聚合物成型体和电路板装备以及它们的制造方法
JP2011018636A (ja) * 2009-06-09 2011-01-27 Fujifilm Corp 導電性組成物、並びに透明導電膜、表示素子及び集積型太陽電池
KR20120092600A (ko) * 2009-09-30 2012-08-21 스미또모 베이크라이트 가부시키가이샤 도전 접속 재료, 단자간 접속 방법 및 접속 단자의 제조 방법
JP5623758B2 (ja) * 2010-02-23 2014-11-12 帝人株式会社 ポリエチレンナフタレート組成物およびそれを用いた成形品
EP2553007A4 (en) * 2010-03-26 2014-11-19 Univ Hawaii NANOMATERALLY REINFORCED RESINS AND RELATED MATERIALS
JP2012062453A (ja) * 2010-09-18 2012-03-29 Sekisui Chem Co Ltd 成形体及びその製造方法
JP5686436B2 (ja) * 2011-03-31 2015-03-18 リンテック株式会社 粘着剤組成物及び粘着シート
JP6592268B2 (ja) * 2015-04-01 2019-10-16 株式会社日本触媒 導電性材料及びそれを用いた熱電変換素子、熱電変換装置
KR101962936B1 (ko) * 2016-03-24 2019-03-28 (주)유니드 유무기 복합소재의 박막기판
WO2018012445A1 (ja) * 2016-07-15 2018-01-18 パナソニックIpマネジメント株式会社 金属張積層板及びプリント配線板
US20200017266A1 (en) * 2018-07-12 2020-01-16 Advantek, Inc. Carbon nanotubes in carrier tape, cover tape and static shielding bags
JP6976366B2 (ja) * 2020-02-14 2021-12-08 ポリプラスチックス株式会社 ポリアリーレンサルファイド樹脂組成物
CN112118670A (zh) * 2020-09-01 2020-12-22 安徽美邦树脂科技有限公司 一种透明柔性pvb复合结构高频传输线及其制备方法
CN112291935A (zh) * 2020-10-20 2021-01-29 深圳爱彼电路股份有限公司 一种超小尺寸与超薄高频电路板制作方法
CN115806772A (zh) * 2022-12-23 2023-03-17 深圳市艾力邦科技有限公司 一种电子产品专用高黏耐高温的导热胶及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7060241B2 (en) * 2001-03-26 2006-06-13 Eikos, Inc. Coatings comprising carbon nanotubes and methods for forming same
JP2003277581A (ja) * 2002-03-25 2003-10-02 Toray Ind Inc 精密部品成形用エポキシ樹脂組成物及び精密部品
JP2004075706A (ja) * 2002-08-09 2004-03-11 Sekisui Chem Co Ltd 樹脂シート
WO2005015574A1 (en) * 2003-08-08 2005-02-17 General Electric Company Electrically conductive compositions comprising carbon nanotubes and method of manufacture thereof
JP4836581B2 (ja) * 2004-02-04 2011-12-14 大阪瓦斯株式会社 GHz帯域電子部品用樹脂組成物及びGHz帯域電子部品

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