JP2007027309A - ウェーハの加工方法 - Google Patents
ウェーハの加工方法 Download PDFInfo
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- JP2007027309A JP2007027309A JP2005205538A JP2005205538A JP2007027309A JP 2007027309 A JP2007027309 A JP 2007027309A JP 2005205538 A JP2005205538 A JP 2005205538A JP 2005205538 A JP2005205538 A JP 2005205538A JP 2007027309 A JP2007027309 A JP 2007027309A
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- 238000000034 method Methods 0.000 title claims description 20
- 230000002093 peripheral effect Effects 0.000 claims abstract description 13
- 230000001681 protective effect Effects 0.000 claims description 32
- 230000003014 reinforcing effect Effects 0.000 claims description 20
- 238000003672 processing method Methods 0.000 claims 5
- 235000012431 wafers Nutrition 0.000 abstract 9
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 238000004544 sputter deposition Methods 0.000 description 7
- 230000006837 decompression Effects 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 3
- 230000005284 excitation Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- -1 argon ions Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
Abstract
【解決手段】デバイス領域とデバイス領域を囲繞する外周余剰領域とが表面に形成されたウェーハWの表面側を研削装置2の保持テーブル20にて保持してウェーハWの裏面のうちデバイス領域に相当する領域を研削し凹部W3を形成して凹部W3の外周側にリング状補強部W4を形成し、凹部W3に保護テープを貼着した後に、ウェーハWの分割を行う分割装置のチャックテーブルにて保護テープ側を保持してウェーハを個々のデバイスに分割する。デバイス領域の厚さが極めて薄くなったとしても、リング状補強部W4によってデバイス領域が外周側から補強された状態となっているため、裏面研削後のウェーハWを研削装置の保持テーブルから容易に取り外すことができ、後続する工程及び工程間のウェーハの搬送におけるウェーハの取り扱いが容易となる。
【選択図】図3
Description
Wa:表面
W1:デバイス領域
S:ストリート D:デバイス
W2:外周余剰領域
Wb:裏面
W3:凹部
W4:リング状補強部
N:ノッチ
B:ビアホール
T:保護テープ
1:保護部材
2:研削装置
20:チャックテーブル 21:研削手段 22:スピンドル 23:研削ホイール
24:研削砥石
3:減圧成膜装置
31:チャンバー 32:保持部 33:励磁部材 34:スパッタ源
35:高周波電源 36:導入口 37:減圧口
4:金属膜
5:切削装置
50:チャックテーブル 51:切削ブレード
6:残材
Claims (5)
- 複数のデバイスがストリートによって区画されて形成されたデバイス領域と、該デバイス領域を囲繞する外周余剰領域とが表面に形成されたウェーハの加工方法であって、
ウェーハの表面側を研削装置の保持テーブルにて保持し、該ウェーハの裏面のうち該デバイス領域に相当する領域を研削して凹部を形成し、該凹部の外周側にリング状補強部を形成する裏面研削工程と、
該凹部に保護テープを貼着する保護テープ貼着工程と、
ウェーハの分割を行う分割装置のチャックテーブルにて該保護テープ側を保持してウェーハを個々のデバイスに分割する分割工程と
から少なくとも構成されるウェーハの加工方法。 - 前記チャックテーブルは、前記凹部の径に対応した外径を有する請求項1に記載のウェーハの加工方法。
- 前記裏面研削工程の後であって前記保護テープ貼着工程の前に、該裏面研削工程後のウェーハのデバイス領域または裏面に追加加工を施す追加加工工程が遂行される
請求項1または2に記載のウェーハの加工方法。 - 前記追加加工工程は、前記リング状補強部が形成されたウェーハの裏面に膜を形成する膜形成工程である請求項3に記載のウェーハの加工方法。
- 前記追加加工工程は、前記リング状補強部が形成されたウェーハにビアホールを形成するビアホール形成工程である請求項3に記載のウェーハの加工方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005205538A JP4791772B2 (ja) | 2005-07-14 | 2005-07-14 | ウェーハの加工方法 |
DE102006032458.7A DE102006032458B4 (de) | 2005-07-14 | 2006-07-13 | Waferbearbeitungsverfahren |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005205538A JP4791772B2 (ja) | 2005-07-14 | 2005-07-14 | ウェーハの加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007027309A true JP2007027309A (ja) | 2007-02-01 |
JP4791772B2 JP4791772B2 (ja) | 2011-10-12 |
Family
ID=37575897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005205538A Active JP4791772B2 (ja) | 2005-07-14 | 2005-07-14 | ウェーハの加工方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4791772B2 (ja) |
DE (1) | DE102006032458B4 (ja) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007287881A (ja) * | 2006-04-14 | 2007-11-01 | Micronics Japan Co Ltd | プローバ |
JP2009105298A (ja) * | 2007-10-25 | 2009-05-14 | Disco Abrasive Syst Ltd | 半導体デバイスの製造方法 |
JP2009158536A (ja) * | 2007-12-25 | 2009-07-16 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2010062345A (ja) * | 2008-09-04 | 2010-03-18 | Fuji Electric Systems Co Ltd | 半導体装置の製造方法および半導体装置の製造装置 |
JP2010093005A (ja) * | 2008-10-07 | 2010-04-22 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2010123806A (ja) * | 2008-11-20 | 2010-06-03 | Lintec Corp | 支持装置、支持方法、ダイシング装置、およびダイシング方法 |
JP2010186972A (ja) * | 2009-02-13 | 2010-08-26 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2011061137A (ja) * | 2009-09-14 | 2011-03-24 | Disco Abrasive Syst Ltd | ウエーハの加工方法及び環状凸部除去装置 |
JP2012043824A (ja) * | 2010-08-12 | 2012-03-01 | Disco Abrasive Syst Ltd | ウエーハの加工方法及び保護部材 |
JP2012059985A (ja) * | 2010-09-10 | 2012-03-22 | Disco Abrasive Syst Ltd | ウェーハの加工方法 |
KR101359063B1 (ko) | 2008-01-11 | 2014-02-05 | 가부시기가이샤 디스코 | 적층 디바이스의 제조 방법 |
JP2018082115A (ja) * | 2016-11-18 | 2018-05-24 | 株式会社ディスコ | 被加工物の加工方法 |
JP2018113394A (ja) * | 2017-01-13 | 2018-07-19 | 株式会社ディスコ | ウェーハの加工方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6385131B2 (ja) * | 2014-05-13 | 2018-09-05 | 株式会社ディスコ | ウェーハの加工方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003332271A (ja) * | 2002-05-15 | 2003-11-21 | Renesas Technology Corp | 半導体ウエハおよび半導体装置の製造方法 |
JP2004158537A (ja) * | 2002-11-05 | 2004-06-03 | Shinko Electric Ind Co Ltd | 半導体装置及びその製造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004319885A (ja) | 2003-04-18 | 2004-11-11 | Disco Abrasive Syst Ltd | チャックテーブル及び半導体ウェーハの研削方法 |
-
2005
- 2005-07-14 JP JP2005205538A patent/JP4791772B2/ja active Active
-
2006
- 2006-07-13 DE DE102006032458.7A patent/DE102006032458B4/de active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003332271A (ja) * | 2002-05-15 | 2003-11-21 | Renesas Technology Corp | 半導体ウエハおよび半導体装置の製造方法 |
JP2004158537A (ja) * | 2002-11-05 | 2004-06-03 | Shinko Electric Ind Co Ltd | 半導体装置及びその製造方法 |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007287881A (ja) * | 2006-04-14 | 2007-11-01 | Micronics Japan Co Ltd | プローバ |
JP2009105298A (ja) * | 2007-10-25 | 2009-05-14 | Disco Abrasive Syst Ltd | 半導体デバイスの製造方法 |
JP2009158536A (ja) * | 2007-12-25 | 2009-07-16 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
KR101359063B1 (ko) | 2008-01-11 | 2014-02-05 | 가부시기가이샤 디스코 | 적층 디바이스의 제조 방법 |
JP2010062345A (ja) * | 2008-09-04 | 2010-03-18 | Fuji Electric Systems Co Ltd | 半導体装置の製造方法および半導体装置の製造装置 |
JP2010093005A (ja) * | 2008-10-07 | 2010-04-22 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2010123806A (ja) * | 2008-11-20 | 2010-06-03 | Lintec Corp | 支持装置、支持方法、ダイシング装置、およびダイシング方法 |
JP2010186972A (ja) * | 2009-02-13 | 2010-08-26 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2011061137A (ja) * | 2009-09-14 | 2011-03-24 | Disco Abrasive Syst Ltd | ウエーハの加工方法及び環状凸部除去装置 |
JP2012043824A (ja) * | 2010-08-12 | 2012-03-01 | Disco Abrasive Syst Ltd | ウエーハの加工方法及び保護部材 |
JP2012059985A (ja) * | 2010-09-10 | 2012-03-22 | Disco Abrasive Syst Ltd | ウェーハの加工方法 |
JP2018082115A (ja) * | 2016-11-18 | 2018-05-24 | 株式会社ディスコ | 被加工物の加工方法 |
JP2018113394A (ja) * | 2017-01-13 | 2018-07-19 | 株式会社ディスコ | ウェーハの加工方法 |
Also Published As
Publication number | Publication date |
---|---|
JP4791772B2 (ja) | 2011-10-12 |
DE102006032458A1 (de) | 2007-01-25 |
DE102006032458B4 (de) | 2022-11-03 |
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