JP2007022075A5 - - Google Patents
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- Publication number
- JP2007022075A5 JP2007022075A5 JP2006165140A JP2006165140A JP2007022075A5 JP 2007022075 A5 JP2007022075 A5 JP 2007022075A5 JP 2006165140 A JP2006165140 A JP 2006165140A JP 2006165140 A JP2006165140 A JP 2006165140A JP 2007022075 A5 JP2007022075 A5 JP 2007022075A5
- Authority
- JP
- Japan
- Prior art keywords
- layer structure
- clay
- layer
- structure according
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000010409 thin film Substances 0.000 claims description 18
- 239000004927 clay Substances 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 239000010408 film Substances 0.000 claims description 7
- 229910010272 inorganic material Inorganic materials 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 238000007740 vapor deposition Methods 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000010894 electron beam technology Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 claims description 2
- 238000005245 sintering Methods 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 238000002230 thermal chemical vapour deposition Methods 0.000 claims description 2
- 239000007789 gas Substances 0.000 claims 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 3
- 230000004888 barrier function Effects 0.000 claims 3
- 150000002484 inorganic compounds Chemical class 0.000 claims 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 claims 2
- 229910052901 montmorillonite Inorganic materials 0.000 claims 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 229910052910 alkali metal silicate Inorganic materials 0.000 claims 1
- 150000004703 alkoxides Chemical class 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- VNSBYDPZHCQWNB-UHFFFAOYSA-N calcium;aluminum;dioxido(oxo)silane;sodium;hydrate Chemical compound O.[Na].[Al].[Ca+2].[O-][Si]([O-])=O VNSBYDPZHCQWNB-UHFFFAOYSA-N 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 229910000271 hectorite Inorganic materials 0.000 claims 1
- KWLMIXQRALPRBC-UHFFFAOYSA-L hectorite Chemical compound [Li+].[OH-].[OH-].[Na+].[Mg+2].O1[Si]2([O-])O[Si]1([O-])O[Si]([O-])(O1)O[Si]1([O-])O2 KWLMIXQRALPRBC-UHFFFAOYSA-L 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000010445 mica Substances 0.000 claims 1
- 229910052618 mica group Inorganic materials 0.000 claims 1
- 229910000273 nontronite Inorganic materials 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 229920001709 polysilazane Polymers 0.000 claims 1
- 229910000275 saponite Inorganic materials 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
- -1 stevensite Inorganic materials 0.000 claims 1
- 238000002834 transmittance Methods 0.000 claims 1
- 229910052902 vermiculite Inorganic materials 0.000 claims 1
- 239000010455 vermiculite Substances 0.000 claims 1
- 235000019354 vermiculite Nutrition 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006165140A JP2007022075A (ja) | 2005-06-14 | 2006-06-14 | 層構造体及びその製造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005173744 | 2005-06-14 | ||
| JP2006165140A JP2007022075A (ja) | 2005-06-14 | 2006-06-14 | 層構造体及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007022075A JP2007022075A (ja) | 2007-02-01 |
| JP2007022075A5 true JP2007022075A5 (enExample) | 2009-03-26 |
Family
ID=37783442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006165140A Pending JP2007022075A (ja) | 2005-06-14 | 2006-06-14 | 層構造体及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007022075A (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007065644A (ja) * | 2005-08-03 | 2007-03-15 | Asahi Kasei Corp | ディスプレイ用基板及びディスプレイ並びにそれらの製造方法 |
| DE112009002023T5 (de) | 2008-08-19 | 2011-06-30 | Lintec Corp. | Geformter Gegenstand, Verfahren zur Herstellung desselben, elektronisches Vorrichtungsteil und elektronische Vorrichtung |
| WO2010024378A1 (ja) * | 2008-08-29 | 2010-03-04 | 独立行政法人産業技術総合研究所 | 酸化ケイ素薄膜または酸窒化ケイ素化合物薄膜の製造方法およびこの方法で得られる薄膜 |
| JP2010152470A (ja) * | 2008-12-24 | 2010-07-08 | Meiden Software Corp | 健康管理システム、通信端末、健康管理方法およびプログラム |
| JP5379530B2 (ja) | 2009-03-26 | 2013-12-25 | リンテック株式会社 | 成形体、その製造方法、電子デバイス用部材および電子デバイス |
| WO2010134609A1 (ja) | 2009-05-22 | 2010-11-25 | リンテック株式会社 | 成形体、その製造方法、電子デバイス用部材および電子デバイス |
| JP5563289B2 (ja) * | 2009-12-24 | 2014-07-30 | 株式会社巴川製紙所 | 粘土膜複合体 |
| WO2011043315A1 (ja) * | 2009-10-05 | 2011-04-14 | コニカミノルタホールディングス株式会社 | ガスバリア性フィルム、ガスバリア性フィルムの製造方法、該ガスバリア性フィルムを有する有機光電変換素子及び該有機光電変換素子を有する太陽電池 |
| JP5697230B2 (ja) | 2010-03-31 | 2015-04-08 | リンテック株式会社 | 成形体、その製造方法、電子デバイス用部材及び電子デバイス |
| JP5750441B2 (ja) | 2010-08-20 | 2015-07-22 | リンテック株式会社 | 成形体、その製造方法、電子デバイス用部材及び電子デバイス |
| TWI457235B (zh) | 2010-09-21 | 2014-10-21 | Lintec Corp | A gas barrier film, a manufacturing method thereof, an electronic device element, and an electronic device |
| TWI535561B (zh) | 2010-09-21 | 2016-06-01 | 琳得科股份有限公司 | A molded body, a manufacturing method thereof, an electronic device element, and an electronic device |
| WO2012137527A1 (ja) * | 2011-04-04 | 2012-10-11 | 株式会社村田製作所 | フレキシブル配線板 |
| JP5735857B2 (ja) * | 2011-05-23 | 2015-06-17 | 株式会社サムスン日本研究所 | 電子デバイス用バリアフィルム |
| US8999497B2 (en) | 2011-12-13 | 2015-04-07 | Samsung Electronics Co., Ltd. | Barrier film for electronic device and method of manufacturing the same |
| JP5938758B2 (ja) * | 2011-12-13 | 2016-06-22 | 三星電子株式会社Samsung Electronics Co.,Ltd. | 積層膜及び電子デバイス用バリアフィルム |
| US9346242B2 (en) | 2011-12-13 | 2016-05-24 | Samsung Electronics Co., Ltd. | Multi-layer thin film assembly and barrier film for electronic device including the same |
| JP2014090372A (ja) | 2012-10-31 | 2014-05-15 | Sony Corp | 情報処理装置、情報処理システム、情報処理方法及びコンピュータプログラム |
| JP2016128211A (ja) * | 2013-04-23 | 2016-07-14 | コニカミノルタ株式会社 | 機能性フィルムの製造方法 |
-
2006
- 2006-06-14 JP JP2006165140A patent/JP2007022075A/ja active Pending
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