JP2007022075A - 層構造体及びその製造方法 - Google Patents

層構造体及びその製造方法 Download PDF

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Publication number
JP2007022075A
JP2007022075A JP2006165140A JP2006165140A JP2007022075A JP 2007022075 A JP2007022075 A JP 2007022075A JP 2006165140 A JP2006165140 A JP 2006165140A JP 2006165140 A JP2006165140 A JP 2006165140A JP 2007022075 A JP2007022075 A JP 2007022075A
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Japan
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thin film
clay
layer
layer structure
film layer
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JP2006165140A
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Japanese (ja)
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JP2007022075A5 (enExample
Inventor
Hideyasu Tanaka
秀康 田中
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Asahi Kasei Corp
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Asahi Kasei Corp
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Priority to JP2006165140A priority Critical patent/JP2007022075A/ja
Publication of JP2007022075A publication Critical patent/JP2007022075A/ja
Publication of JP2007022075A5 publication Critical patent/JP2007022075A5/ja
Pending legal-status Critical Current

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JP2006165140A 2005-06-14 2006-06-14 層構造体及びその製造方法 Pending JP2007022075A (ja)

Priority Applications (1)

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JP2006165140A JP2007022075A (ja) 2005-06-14 2006-06-14 層構造体及びその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005173744 2005-06-14
JP2006165140A JP2007022075A (ja) 2005-06-14 2006-06-14 層構造体及びその製造方法

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JP2007022075A true JP2007022075A (ja) 2007-02-01
JP2007022075A5 JP2007022075A5 (enExample) 2009-03-26

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JP2006165140A Pending JP2007022075A (ja) 2005-06-14 2006-06-14 層構造体及びその製造方法

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Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007065644A (ja) * 2005-08-03 2007-03-15 Asahi Kasei Corp ディスプレイ用基板及びディスプレイ並びにそれらの製造方法
JP2010152470A (ja) * 2008-12-24 2010-07-08 Meiden Software Corp 健康管理システム、通信端末、健康管理方法およびプログラム
WO2011077741A1 (ja) * 2009-12-24 2011-06-30 株式会社巴川製紙所 粘土膜複合体
US20110185948A1 (en) * 2008-08-29 2011-08-04 National Institute Of Advanced Industrial Science And Technology Process for producing silicon oxide thin film or silicon oxynitride compound thin film and thin film obtained by the process
WO2011125602A1 (ja) * 2010-03-31 2011-10-13 リンテック株式会社 成形体、その製造方法、電子デバイス用部材及び電子デバイス
WO2012137527A1 (ja) * 2011-04-04 2012-10-11 株式会社村田製作所 フレキシブル配線板
JP2012240358A (ja) * 2011-05-23 2012-12-10 Samsung Yokohama Research Institute Co Ltd 電子デバイス用バリアフィルム
KR20130067211A (ko) * 2011-12-13 2013-06-21 삼성전자주식회사 다층 박막 어셈블리 및 이를 포함하는 전자소자용 배리어 필름
US8771834B2 (en) 2010-09-21 2014-07-08 Lintec Corporation Formed body, production method thereof, electronic device member and electronic device
US8846200B2 (en) 2010-09-21 2014-09-30 Lintec Corporation Gas-barrier film, process for producing same, member for electronic device, and electronic device
US8865810B2 (en) 2009-03-26 2014-10-21 Lintec Corporation Formed article, method for producing same, electronic device member, and electronic device
JP5609885B2 (ja) * 2009-10-05 2014-10-22 コニカミノルタ株式会社 ガスバリア性フィルム、ガスバリア性フィルムの製造方法、該ガスバリア性フィルムを有する有機光電変換素子及び該有機光電変換素子を有する太陽電池
WO2014175023A1 (ja) * 2013-04-23 2014-10-30 コニカミノルタ株式会社 機能性フィルムの製造方法
US8999497B2 (en) 2011-12-13 2015-04-07 Samsung Electronics Co., Ltd. Barrier film for electronic device and method of manufacturing the same
US9340869B2 (en) 2008-08-19 2016-05-17 Lintec Corporation Formed article, method for producing the same, electronic device member, and electronic device
US9346242B2 (en) 2011-12-13 2016-05-24 Samsung Electronics Co., Ltd. Multi-layer thin film assembly and barrier film for electronic device including the same
US9365922B2 (en) 2009-05-22 2016-06-14 Lintec Corporation Formed article, method of producing same, electronic device member, and electronic device
US9556513B2 (en) 2010-08-20 2017-01-31 Lintec Corporation Molding, production method therefor, part for electronic devices and electronic device
US9807071B2 (en) 2012-10-31 2017-10-31 Sony Corporation Information processing apparatus, information processing system, information processing method and computer program

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007065644A (ja) * 2005-08-03 2007-03-15 Asahi Kasei Corp ディスプレイ用基板及びディスプレイ並びにそれらの製造方法
US9340869B2 (en) 2008-08-19 2016-05-17 Lintec Corporation Formed article, method for producing the same, electronic device member, and electronic device
US8673070B2 (en) * 2008-08-29 2014-03-18 National Institute Of Advanced Industrial Science And Technology Process for producing silicon oxide thin film or silicon oxynitride compound thin film and thin film obtained by the process
US20110185948A1 (en) * 2008-08-29 2011-08-04 National Institute Of Advanced Industrial Science And Technology Process for producing silicon oxide thin film or silicon oxynitride compound thin film and thin film obtained by the process
JP2010152470A (ja) * 2008-12-24 2010-07-08 Meiden Software Corp 健康管理システム、通信端末、健康管理方法およびプログラム
US8865810B2 (en) 2009-03-26 2014-10-21 Lintec Corporation Formed article, method for producing same, electronic device member, and electronic device
US9365922B2 (en) 2009-05-22 2016-06-14 Lintec Corporation Formed article, method of producing same, electronic device member, and electronic device
JP5609885B2 (ja) * 2009-10-05 2014-10-22 コニカミノルタ株式会社 ガスバリア性フィルム、ガスバリア性フィルムの製造方法、該ガスバリア性フィルムを有する有機光電変換素子及び該有機光電変換素子を有する太陽電池
WO2011077741A1 (ja) * 2009-12-24 2011-06-30 株式会社巴川製紙所 粘土膜複合体
JP2011131450A (ja) * 2009-12-24 2011-07-07 Tomoegawa Paper Co Ltd 粘土膜複合体
JP2011213907A (ja) * 2010-03-31 2011-10-27 Lintec Corp 成形体、その製造方法、電子デバイス用部材及び電子デバイス
US9540519B2 (en) 2010-03-31 2017-01-10 Lintec Corporation Formed article, method for producing same, electronic device member, and electronic device
WO2011125602A1 (ja) * 2010-03-31 2011-10-13 リンテック株式会社 成形体、その製造方法、電子デバイス用部材及び電子デバイス
US9556513B2 (en) 2010-08-20 2017-01-31 Lintec Corporation Molding, production method therefor, part for electronic devices and electronic device
US8771834B2 (en) 2010-09-21 2014-07-08 Lintec Corporation Formed body, production method thereof, electronic device member and electronic device
US8846200B2 (en) 2010-09-21 2014-09-30 Lintec Corporation Gas-barrier film, process for producing same, member for electronic device, and electronic device
WO2012137527A1 (ja) * 2011-04-04 2012-10-11 株式会社村田製作所 フレキシブル配線板
JP2012240358A (ja) * 2011-05-23 2012-12-10 Samsung Yokohama Research Institute Co Ltd 電子デバイス用バリアフィルム
KR20130067211A (ko) * 2011-12-13 2013-06-21 삼성전자주식회사 다층 박막 어셈블리 및 이를 포함하는 전자소자용 배리어 필름
US9346242B2 (en) 2011-12-13 2016-05-24 Samsung Electronics Co., Ltd. Multi-layer thin film assembly and barrier film for electronic device including the same
US8999497B2 (en) 2011-12-13 2015-04-07 Samsung Electronics Co., Ltd. Barrier film for electronic device and method of manufacturing the same
JP2013123818A (ja) * 2011-12-13 2013-06-24 Samsung Yokohama Research Institute Co Ltd 積層膜及び電子デバイス用バリアフィルム
KR102098361B1 (ko) * 2011-12-13 2020-04-08 삼성전자주식회사 다층 박막 어셈블리 및 이를 포함하는 전자소자용 배리어 필름
US9807071B2 (en) 2012-10-31 2017-10-31 Sony Corporation Information processing apparatus, information processing system, information processing method and computer program
WO2014175023A1 (ja) * 2013-04-23 2014-10-30 コニカミノルタ株式会社 機能性フィルムの製造方法

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