JP2007012850A5 - - Google Patents

Download PDF

Info

Publication number
JP2007012850A5
JP2007012850A5 JP2005191310A JP2005191310A JP2007012850A5 JP 2007012850 A5 JP2007012850 A5 JP 2007012850A5 JP 2005191310 A JP2005191310 A JP 2005191310A JP 2005191310 A JP2005191310 A JP 2005191310A JP 2007012850 A5 JP2007012850 A5 JP 2007012850A5
Authority
JP
Japan
Prior art keywords
circuit board
pad electrode
sealing body
electrode
land
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005191310A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007012850A (ja
JP4265578B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2005191310A external-priority patent/JP4265578B2/ja
Priority to JP2005191310A priority Critical patent/JP4265578B2/ja
Priority to EP06012641A priority patent/EP1740029B1/en
Priority to US11/477,166 priority patent/US20070001297A1/en
Priority to CN2006100943735A priority patent/CN1893772B/zh
Priority to KR1020060059144A priority patent/KR100813405B1/ko
Publication of JP2007012850A publication Critical patent/JP2007012850A/ja
Publication of JP2007012850A5 publication Critical patent/JP2007012850A5/ja
Publication of JP4265578B2 publication Critical patent/JP4265578B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2005191310A 2005-06-30 2005-06-30 回路基板 Expired - Fee Related JP4265578B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005191310A JP4265578B2 (ja) 2005-06-30 2005-06-30 回路基板
EP06012641A EP1740029B1 (en) 2005-06-30 2006-06-20 Circuit substrate
US11/477,166 US20070001297A1 (en) 2005-06-30 2006-06-28 Circuit substrate
KR1020060059144A KR100813405B1 (ko) 2005-06-30 2006-06-29 회로 기판
CN2006100943735A CN1893772B (zh) 2005-06-30 2006-06-29 电路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005191310A JP4265578B2 (ja) 2005-06-30 2005-06-30 回路基板

Publications (3)

Publication Number Publication Date
JP2007012850A JP2007012850A (ja) 2007-01-18
JP2007012850A5 true JP2007012850A5 (cg-RX-API-DMAC7.html) 2007-06-07
JP4265578B2 JP4265578B2 (ja) 2009-05-20

Family

ID=36954369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005191310A Expired - Fee Related JP4265578B2 (ja) 2005-06-30 2005-06-30 回路基板

Country Status (5)

Country Link
US (1) US20070001297A1 (cg-RX-API-DMAC7.html)
EP (1) EP1740029B1 (cg-RX-API-DMAC7.html)
JP (1) JP4265578B2 (cg-RX-API-DMAC7.html)
KR (1) KR100813405B1 (cg-RX-API-DMAC7.html)
CN (1) CN1893772B (cg-RX-API-DMAC7.html)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5004654B2 (ja) * 2007-05-16 2012-08-22 パナソニック株式会社 配線基板の接続方法および配線基板構造
JP4927163B2 (ja) * 2007-12-28 2012-05-09 オーナンバ株式会社 端子板回路
CN101494951A (zh) * 2009-02-18 2009-07-29 旭丽电子(广州)有限公司 印刷电路板
US20110075392A1 (en) 2009-09-29 2011-03-31 Astec International Limited Assemblies and Methods for Directly Connecting Integrated Circuits to Electrically Conductive Sheets
JP4825919B1 (ja) 2010-05-31 2011-11-30 株式会社東芝 電子機器
EP2408284A1 (en) * 2010-07-14 2012-01-18 Research In Motion Limited Assembly, and associated method, for forming a solder connection
EP2680301B1 (en) * 2011-02-24 2020-05-06 Murata Manufacturing Co., Ltd. Structure comprising electronic component and mounting body
JP5668837B2 (ja) * 2011-02-24 2015-02-12 株式会社村田製作所 電子部品の実装構造
JP5733401B2 (ja) * 2011-08-10 2015-06-10 富士電機株式会社 半導体装置および半導体装置の製造方法
DE102013215588A1 (de) * 2013-08-07 2015-02-12 Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg Leiterplattenanordnung, Steuervorrichtung für ein Kühlerlüftermodul und Verfahren
JP2015035531A (ja) * 2013-08-09 2015-02-19 キヤノン株式会社 回路基板及び電子機器
JP6311568B2 (ja) * 2014-10-21 2018-04-18 株式会社デンソー 電子装置
JP6352149B2 (ja) * 2014-10-31 2018-07-04 カルソニックカンセイ株式会社 電子部品の実装構造
CN204408283U (zh) * 2015-02-15 2015-06-17 华为技术有限公司 一种功率放大器的功率管连接结构及功率放大器
JP2022025389A (ja) * 2020-07-29 2022-02-10 Fdk株式会社 部品実装基板
JP7286608B2 (ja) * 2020-11-30 2023-06-05 株式会社タムラ製作所 プリント回路基板の製造方法
EP4231788A4 (en) * 2021-12-29 2024-01-10 Contemporary Amperex Technology Co., Limited CIRCUIT BOARD, BATTERY MODULE, BATTERY PACK AND ELECTRICAL DEVICE

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2528000B2 (de) * 1975-06-24 1979-12-20 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zur Herstellung einer Lötfläche relativ großer Abmessungen
US5842275A (en) * 1995-09-05 1998-12-01 Ford Motor Company Reflow soldering to mounting pads with vent channels to avoid skewing
US6069323A (en) * 1997-01-21 2000-05-30 Dell Usa, L.P. Pad with indentations surface mount
JP3639505B2 (ja) * 2000-06-30 2005-04-20 インターナショナル・ビジネス・マシーンズ・コーポレーション プリント配線基板及び半導体装置
JP4923336B2 (ja) * 2001-04-10 2012-04-25 日本電気株式会社 回路基板及び該回路基板を用いた電子機器
US6414246B1 (en) * 2001-04-16 2002-07-02 Tyco Electronics Corporation Printed circuit board (PCB)
JP2005340684A (ja) * 2004-05-31 2005-12-08 Calsonic Kansei Corp 基板への電子素子の取付構造

Similar Documents

Publication Publication Date Title
JP2007012850A5 (cg-RX-API-DMAC7.html)
TW200711068A (en) Semiconductor device and method for making the same, circuit board and method for making the same
JP2011014451A5 (cg-RX-API-DMAC7.html)
TW200802760A (en) Flip chip MLP with folded heat sink
JP2007087850A5 (cg-RX-API-DMAC7.html)
EP1534054A3 (en) Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus
JP2007267113A5 (cg-RX-API-DMAC7.html)
JP2009130196A5 (cg-RX-API-DMAC7.html)
JP2009532912A5 (cg-RX-API-DMAC7.html)
US9245829B2 (en) Substrate structure, method of mounting semiconductor chip, and solid state relay
JP2009141169A5 (cg-RX-API-DMAC7.html)
EP2034809A3 (en) Electronic device including printed circuit board and electronic element mounted on the printed circuit board
JP2006210852A (ja) 表面実装型回路部品を実装する回路基板及びその製造方法
WO2006114267A3 (en) Electronic component and electronic configuration
EP1727407A3 (en) Wired circuit board
TW200644191A (en) Semiconductor device
TW200715321A (en) Electronic component and lead unit for electronic component
WO2009031586A1 (ja) 回路基板及び回路基板の製造方法
TWI315967B (cg-RX-API-DMAC7.html)
TW200636706A (en) Functional device packaging module and mounting method of functional device packaging module
JP2011254050A5 (ja) プリント基板の製造方法及びプリント基板
JP2008147317A5 (cg-RX-API-DMAC7.html)
TW200735737A (en) Electronic component mounting method
CN201438791U (zh) 焊接件
JP2013162295A5 (cg-RX-API-DMAC7.html)