JP2007012031A5 - - Google Patents
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- Publication number
- JP2007012031A5 JP2007012031A5 JP2006132147A JP2006132147A JP2007012031A5 JP 2007012031 A5 JP2007012031 A5 JP 2007012031A5 JP 2006132147 A JP2006132147 A JP 2006132147A JP 2006132147 A JP2006132147 A JP 2006132147A JP 2007012031 A5 JP2007012031 A5 JP 2007012031A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- antenna
- laser
- manufacturing
- element layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 42
- 238000000034 method Methods 0.000 claims 27
- 238000004519 manufacturing process Methods 0.000 claims 19
- 239000002245 particle Substances 0.000 claims 15
- 239000004065 semiconductor Substances 0.000 claims 13
- 239000012530 fluid Substances 0.000 claims 12
- 239000010408 film Substances 0.000 claims 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 8
- 239000010949 copper Substances 0.000 claims 8
- 230000001678 irradiating effect Effects 0.000 claims 8
- 229910001316 Ag alloy Inorganic materials 0.000 claims 6
- 229910001020 Au alloy Inorganic materials 0.000 claims 6
- 239000004332 silver Substances 0.000 claims 6
- 239000010409 thin film Substances 0.000 claims 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 4
- 229910003437 indium oxide Inorganic materials 0.000 claims 4
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims 4
- 238000007789 sealing Methods 0.000 claims 4
- 229910000679 solder Inorganic materials 0.000 claims 4
- 229910052802 copper Inorganic materials 0.000 claims 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 238000007598 dipping method Methods 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims 2
- 238000005498 polishing Methods 0.000 claims 2
- 238000007650 screen-printing Methods 0.000 claims 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 238000004528 spin coating Methods 0.000 claims 2
- 239000011787 zinc oxide Substances 0.000 claims 2
- 238000005229 chemical vapour deposition Methods 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006132147A JP5030470B2 (ja) | 2005-05-31 | 2006-05-11 | 半導体装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005158462 | 2005-05-31 | ||
| JP2005158462 | 2005-05-31 | ||
| JP2006132147A JP5030470B2 (ja) | 2005-05-31 | 2006-05-11 | 半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007012031A JP2007012031A (ja) | 2007-01-18 |
| JP2007012031A5 true JP2007012031A5 (https=) | 2009-03-26 |
| JP5030470B2 JP5030470B2 (ja) | 2012-09-19 |
Family
ID=37750369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006132147A Expired - Fee Related JP5030470B2 (ja) | 2005-05-31 | 2006-05-11 | 半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5030470B2 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5268395B2 (ja) | 2007-03-26 | 2013-08-21 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| KR101119033B1 (ko) | 2009-03-16 | 2012-03-13 | 에스아이디주식회사 | 금속박막을 이용한 패턴 형성 방법 및 이를 이용한 응용소자 |
| KR101468318B1 (ko) * | 2013-07-02 | 2014-12-10 | 주식회사 에이스테크놀로지 | 전도성 패턴 형성 방법 |
| KR101562026B1 (ko) | 2014-05-20 | 2015-10-20 | 주식회사 다이나트론 | 금속분말입자를 포함한 전도성 잉크를 이용한 사출물의 금속패턴 제조방법 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4080613B2 (ja) * | 1998-10-21 | 2008-04-23 | 大日本印刷株式会社 | 非接触型ｉｃカード用アンテナコイルのパターン決定方法 |
| US6203952B1 (en) * | 1999-01-14 | 2001-03-20 | 3M Innovative Properties Company | Imaged article on polymeric substrate |
| JP2002026327A (ja) * | 2000-06-30 | 2002-01-25 | Seiko Epson Corp | 分割体の作製方法 |
| DE10063696A1 (de) * | 2000-12-20 | 2002-07-18 | Siemens Ag | Verfahren zur Herstellung eines Gehäuses eines mobilen Kommunikations-Endgerätes, Gehäuse und mobiles Kommunikations-Endgerät |
| JP4323813B2 (ja) * | 2003-01-14 | 2009-09-02 | キヤノン株式会社 | 基板の製造方法 |
| JP2004220304A (ja) * | 2003-01-15 | 2004-08-05 | Toppan Printing Co Ltd | 無線タグ用アンテナの形成方法および無線タグ |
| JP4566578B2 (ja) * | 2003-02-24 | 2010-10-20 | 株式会社半導体エネルギー研究所 | 薄膜集積回路の作製方法 |
-
2006
- 2006-05-11 JP JP2006132147A patent/JP5030470B2/ja not_active Expired - Fee Related
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