JP2006528834A5 - - Google Patents

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Publication number
JP2006528834A5
JP2006528834A5 JP2006520643A JP2006520643A JP2006528834A5 JP 2006528834 A5 JP2006528834 A5 JP 2006528834A5 JP 2006520643 A JP2006520643 A JP 2006520643A JP 2006520643 A JP2006520643 A JP 2006520643A JP 2006528834 A5 JP2006528834 A5 JP 2006528834A5
Authority
JP
Japan
Prior art keywords
coating material
optoelectronic
optoelectronic chip
substrate
providing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2006520643A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006528834A (ja
Filing date
Publication date
Priority claimed from US10/725,566 external-priority patent/US7178235B2/en
Application filed filed Critical
Priority claimed from PCT/CA2004/001408 external-priority patent/WO2005010580A1/en
Publication of JP2006528834A publication Critical patent/JP2006528834A/ja
Publication of JP2006528834A5 publication Critical patent/JP2006528834A5/ja
Ceased legal-status Critical Current

Links

JP2006520643A 2003-07-24 2004-07-26 カプセル化された光パッケージ Ceased JP2006528834A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US62590603A 2003-07-24 2003-07-24
US10/725,566 US7178235B2 (en) 2003-12-03 2003-12-03 Method of manufacturing an optoelectronic package
PCT/CA2004/001408 WO2005010580A1 (en) 2003-07-24 2004-07-26 Encapsulated optical package

Publications (2)

Publication Number Publication Date
JP2006528834A JP2006528834A (ja) 2006-12-21
JP2006528834A5 true JP2006528834A5 (https=) 2007-09-13

Family

ID=34108155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006520643A Ceased JP2006528834A (ja) 2003-07-24 2004-07-26 カプセル化された光パッケージ

Country Status (6)

Country Link
US (1) US7820462B2 (https=)
EP (1) EP1654572B1 (https=)
JP (1) JP2006528834A (https=)
AT (1) ATE549651T1 (https=)
CA (1) CA2569265C (https=)
WO (1) WO2005010580A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7200295B2 (en) * 2004-12-07 2007-04-03 Reflex Photonics, Inc. Optically enabled hybrid semiconductor package
US7482610B2 (en) * 2005-01-13 2009-01-27 Massachusetts Institute Of Technology Vertical-cavity enhanced resonant thermal emitter
DE102005036824A1 (de) * 2005-08-04 2007-03-29 Siemens Ag Chipmodul zum Einbau in Sensorchipkarten für fluidische Anwendungen sowie Verfahren zur Herstellung eines derartigen Chipmoduls
JP4699155B2 (ja) * 2005-09-29 2011-06-08 日本電信電話株式会社 光モジュール
TWI325618B (en) * 2007-01-02 2010-06-01 Chipmos Technologies Inc Film type package for fingerprint sensor
JP4553026B2 (ja) * 2008-03-27 2010-09-29 富士ゼロックス株式会社 光伝送装置
GB0902569D0 (en) 2009-02-16 2009-04-01 Univ Southampton An optical device
JP5526738B2 (ja) * 2009-11-27 2014-06-18 株式会社リコー 発光装置、マルチビーム光源装置、マルチビーム走査装置及び画像形成装置
JP6036463B2 (ja) * 2013-03-26 2016-11-30 日立金属株式会社 光モジュール、光通信機器、および光伝送装置
US20150030281A1 (en) * 2013-07-25 2015-01-29 Avago Technologies General IP (Singapore) Pte, Ltd. Methods and apparatuses for preventing an optics system of an optical communications module from being damaged or moved out of alignment by external forces
WO2018152647A1 (en) * 2017-02-24 2018-08-30 Reflex Photonics Inc. Wirebonding for side-packaged optical engine

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4130343A (en) * 1977-02-22 1978-12-19 Bell Telephone Laboratories, Incorporated Coupling arrangements between a light-emitting diode and an optical fiber waveguide and between an optical fiber waveguide and a semiconductor optical detector
US4819041A (en) 1983-12-30 1989-04-04 Amp Incorporated Surface mounted integrated circuit chip package and method for making same
NL8702493A (nl) * 1986-10-31 1988-05-16 Seiko Epson Corp Optisch opnamemedium en werkwijze voor het vervaardigen daarvan.
JPH02209785A (ja) * 1989-02-09 1990-08-21 Sony Corp 光半導体装置
EP0466950B1 (en) * 1990-07-16 1998-10-07 Nitto Denko Corporation Method for producing an epoxy resin composition for use in molding photosemiconductor
JP2542746B2 (ja) * 1991-03-04 1996-10-09 ローム株式会社 レ―ザダイオ―ド
US5313365A (en) 1992-06-30 1994-05-17 Motorola, Inc. Encapsulated electronic package
US6054716A (en) * 1997-01-10 2000-04-25 Rohm Co., Ltd. Semiconductor light emitting device having a protecting device
JP3087676B2 (ja) 1997-02-13 2000-09-11 日本電気株式会社 ゲル状樹脂を用いた光結合系及び実装構造
US6583444B2 (en) 1997-02-18 2003-06-24 Tessera, Inc. Semiconductor packages having light-sensitive chips
JPH11119064A (ja) * 1997-10-17 1999-04-30 Fujitsu Ltd 光伝送端末装置
JP3355122B2 (ja) 1998-01-08 2002-12-09 富士通株式会社 光モジュールの封止方法
JP2000110176A (ja) 1998-10-02 2000-04-18 Fujitsu Ltd 光モジュール及びその製造方法
AU2653299A (en) 1998-11-25 2000-06-13 Act Micro Devices Optoelectronic module and method of making same
WO2001015348A1 (en) 1999-08-25 2001-03-01 Hamamatsu Photonics K.K. Optical receiver and method of support and arrangement thereof
US6629209B1 (en) * 1999-11-09 2003-09-30 International Business Machines Corporation Cache coherency protocol permitting sharing of a locked data granule
JP4045710B2 (ja) * 1999-12-16 2008-02-13 松下電器産業株式会社 半導体発光装置の製造方法
FR2807168B1 (fr) 2000-03-29 2002-11-29 Commissariat Energie Atomique Procede et dispositif d'alignement passif de fibres optiques et de composants optoelectroniques
US6709170B2 (en) 2001-01-08 2004-03-23 Optical Communications Products, Inc. Plastic encapsulation of optoelectronic devices for optical coupling
US6921920B2 (en) 2001-08-31 2005-07-26 Smith & Nephew, Inc. Solid-state light source
US6874950B2 (en) 2002-12-17 2005-04-05 International Business Machines Corporation Devices and methods for side-coupling optical fibers to optoelectronic components

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