ATE549651T1 - Siebdruckverfahren verfahren zur verkapselung von optoelektronischen chips - Google Patents
Siebdruckverfahren verfahren zur verkapselung von optoelektronischen chipsInfo
- Publication number
- ATE549651T1 ATE549651T1 AT04738016T AT04738016T ATE549651T1 AT E549651 T1 ATE549651 T1 AT E549651T1 AT 04738016 T AT04738016 T AT 04738016T AT 04738016 T AT04738016 T AT 04738016T AT E549651 T1 ATE549651 T1 AT E549651T1
- Authority
- AT
- Austria
- Prior art keywords
- screen printing
- printing method
- optoelectronic chips
- encapsulating optoelectronic
- encapsulating
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/494—Connecting portions
- H01L2224/4943—Connecting portions the connecting portions being staggered
- H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optical Couplings Of Light Guides (AREA)
- Led Device Packages (AREA)
- Packages (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US62590603A | 2003-07-24 | 2003-07-24 | |
US10/725,566 US7178235B2 (en) | 2003-12-03 | 2003-12-03 | Method of manufacturing an optoelectronic package |
PCT/CA2004/001408 WO2005010580A1 (en) | 2003-07-24 | 2004-07-26 | Encapsulated optical package |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE549651T1 true ATE549651T1 (de) | 2012-03-15 |
Family
ID=34108155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT04738016T ATE549651T1 (de) | 2003-07-24 | 2004-07-26 | Siebdruckverfahren verfahren zur verkapselung von optoelektronischen chips |
Country Status (6)
Country | Link |
---|---|
US (1) | US7820462B2 (de) |
EP (1) | EP1654572B1 (de) |
JP (1) | JP2006528834A (de) |
AT (1) | ATE549651T1 (de) |
CA (1) | CA2569265C (de) |
WO (1) | WO2005010580A1 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7200295B2 (en) * | 2004-12-07 | 2007-04-03 | Reflex Photonics, Inc. | Optically enabled hybrid semiconductor package |
US7482610B2 (en) * | 2005-01-13 | 2009-01-27 | Massachusetts Institute Of Technology | Vertical-cavity enhanced resonant thermal emitter |
DE102005036824A1 (de) * | 2005-08-04 | 2007-03-29 | Siemens Ag | Chipmodul zum Einbau in Sensorchipkarten für fluidische Anwendungen sowie Verfahren zur Herstellung eines derartigen Chipmoduls |
JP4699155B2 (ja) * | 2005-09-29 | 2011-06-08 | 日本電信電話株式会社 | 光モジュール |
TWI325618B (en) * | 2007-01-02 | 2010-06-01 | Chipmos Technologies Inc | Film type package for fingerprint sensor |
JP4553026B2 (ja) * | 2008-03-27 | 2010-09-29 | 富士ゼロックス株式会社 | 光伝送装置 |
GB0902569D0 (en) | 2009-02-16 | 2009-04-01 | Univ Southampton | An optical device |
JP5526738B2 (ja) * | 2009-11-27 | 2014-06-18 | 株式会社リコー | 発光装置、マルチビーム光源装置、マルチビーム走査装置及び画像形成装置 |
JP6036463B2 (ja) * | 2013-03-26 | 2016-11-30 | 日立金属株式会社 | 光モジュール、光通信機器、および光伝送装置 |
US20150030281A1 (en) * | 2013-07-25 | 2015-01-29 | Avago Technologies General IP (Singapore) Pte, Ltd. | Methods and apparatuses for preventing an optics system of an optical communications module from being damaged or moved out of alignment by external forces |
WO2018152647A1 (en) * | 2017-02-24 | 2018-08-30 | Reflex Photonics Inc. | Wirebonding for side-packaged optical engine |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4130343A (en) | 1977-02-22 | 1978-12-19 | Bell Telephone Laboratories, Incorporated | Coupling arrangements between a light-emitting diode and an optical fiber waveguide and between an optical fiber waveguide and a semiconductor optical detector |
US4819041A (en) | 1983-12-30 | 1989-04-04 | Amp Incorporated | Surface mounted integrated circuit chip package and method for making same |
NL8702493A (nl) * | 1986-10-31 | 1988-05-16 | Seiko Epson Corp | Optisch opnamemedium en werkwijze voor het vervaardigen daarvan. |
JPH02209785A (ja) * | 1989-02-09 | 1990-08-21 | Sony Corp | 光半導体装置 |
EP0734074A1 (de) | 1990-07-16 | 1996-09-25 | Nitto Denko Corporation | Photohalbleitervorrichtung |
JP2542746B2 (ja) * | 1991-03-04 | 1996-10-09 | ローム株式会社 | レ―ザダイオ―ド |
US5313365A (en) | 1992-06-30 | 1994-05-17 | Motorola, Inc. | Encapsulated electronic package |
US6054716A (en) | 1997-01-10 | 2000-04-25 | Rohm Co., Ltd. | Semiconductor light emitting device having a protecting device |
JP3087676B2 (ja) | 1997-02-13 | 2000-09-11 | 日本電気株式会社 | ゲル状樹脂を用いた光結合系及び実装構造 |
US6583444B2 (en) | 1997-02-18 | 2003-06-24 | Tessera, Inc. | Semiconductor packages having light-sensitive chips |
JPH11119064A (ja) | 1997-10-17 | 1999-04-30 | Fujitsu Ltd | 光伝送端末装置 |
JP3355122B2 (ja) | 1998-01-08 | 2002-12-09 | 富士通株式会社 | 光モジュールの封止方法 |
JP2000110176A (ja) * | 1998-10-02 | 2000-04-18 | Fujitsu Ltd | 光モジュール及びその製造方法 |
AU2653299A (en) | 1998-11-25 | 2000-06-13 | Act Micro Devices | Optoelectronic module and method of making same |
DE10084933B3 (de) | 1999-08-25 | 2012-01-19 | Hamamatsu Photonics K.K. | Optischer Empfänger sowie zugehörige Haltevorrichtung und zugehöriges Verfahren zum Anordnen |
US6629209B1 (en) * | 1999-11-09 | 2003-09-30 | International Business Machines Corporation | Cache coherency protocol permitting sharing of a locked data granule |
JP4045710B2 (ja) * | 1999-12-16 | 2008-02-13 | 松下電器産業株式会社 | 半導体発光装置の製造方法 |
FR2807168B1 (fr) * | 2000-03-29 | 2002-11-29 | Commissariat Energie Atomique | Procede et dispositif d'alignement passif de fibres optiques et de composants optoelectroniques |
US6709170B2 (en) * | 2001-01-08 | 2004-03-23 | Optical Communications Products, Inc. | Plastic encapsulation of optoelectronic devices for optical coupling |
US6921920B2 (en) | 2001-08-31 | 2005-07-26 | Smith & Nephew, Inc. | Solid-state light source |
US6874950B2 (en) | 2002-12-17 | 2005-04-05 | International Business Machines Corporation | Devices and methods for side-coupling optical fibers to optoelectronic components |
-
2004
- 2004-07-26 AT AT04738016T patent/ATE549651T1/de active
- 2004-07-26 US US11/569,751 patent/US7820462B2/en active Active
- 2004-07-26 EP EP04738016A patent/EP1654572B1/de not_active Expired - Lifetime
- 2004-07-26 WO PCT/CA2004/001408 patent/WO2005010580A1/en active Application Filing
- 2004-07-26 JP JP2006520643A patent/JP2006528834A/ja not_active Ceased
- 2004-07-26 CA CA2569265A patent/CA2569265C/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CA2569265C (en) | 2012-10-09 |
US20080211048A1 (en) | 2008-09-04 |
EP1654572A1 (de) | 2006-05-10 |
JP2006528834A (ja) | 2006-12-21 |
WO2005010580A1 (en) | 2005-02-03 |
EP1654572B1 (de) | 2012-03-14 |
US7820462B2 (en) | 2010-10-26 |
EP1654572A4 (de) | 2009-03-25 |
CA2569265A1 (en) | 2005-02-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2008009575A3 (en) | Method of bonding | |
PH12013500600B1 (en) | Polarizing photochromic devices and methods of making the same | |
ATE549651T1 (de) | Siebdruckverfahren verfahren zur verkapselung von optoelektronischen chips | |
DE60115691D1 (de) | Verfahren zur verwendung von latenten, über-tackifizierten klebstoffen | |
SG149062A1 (en) | Dicing die-bonding film | |
EP1443563A3 (de) | Lichtemittierende Anzeigevorrichtung und Herstellungsverfahren | |
GB0407951D0 (en) | Vehicle glazing | |
TW200613123A (en) | Transparent member, optical device using transparent member and method of manufacturing optical device | |
ATE461499T1 (de) | Datenträger mit kennzeichnungen | |
DE602004006290D1 (de) | Elektrolumineszente vorrichtungen und verfahren | |
ATE301696T1 (de) | Verfahren zum kleben von substraten unter verwendung einer lichtaktivierbaren klebstofffolie | |
ATE453170T1 (de) | Display zur integration in kartenförmige trägermedien | |
ATE421129T1 (de) | Chip karte mit einem grossflächigen modul | |
DE69911320D1 (de) | Klebstoffzusammensetzung zur Verklebung von Halbleiterchips | |
JP2006528834A5 (de) | ||
ATE357061T1 (de) | Optoelektronisches bauelement mit einer leuchtdiode und einer mehrzahl von lichtsensoren | |
DE60213317D1 (de) | Optisches Bauteil mit Handhabungseinrichtung, Verfahren zu dessen Herstellung und Befestigung sowie optisches Modul | |
TW200632445A (en) | Light reflection-diffusion sheet and method for manufacturing the same and display apparatus employing the same | |
FI20002543A0 (fi) | Menetelmä piisirulle integroidun piirin kiinnittämiseksi älytarraan ja menetelmä piikiekon esikäsittelemiseksi | |
EP1202342A3 (de) | Halbleitervorrichtung und Verfahren zu deren Herstellung | |
TW200515062A (en) | Backlight module and light emitting diode | |
ATE254316T1 (de) | Vorrichtung und herstellungsverfahren mit zumindest einem chip auf einem träger | |
DE60223645D1 (de) | Durchsichtiges Substrat mit einer Zeichen enthaltenden Zone sowie Verfahren zur Erzeugung der Zeichen | |
ATE343145T1 (de) | Vorrichtung zum erfassen von in einer phosphorschicht enthaltenen informationen | |
DE50008007D1 (de) | Vorrichtung und verfahren zum beschichten eines optisch lesbaren datenträgers und optischer datenträger |