JP4553026B2 - 光伝送装置 - Google Patents
光伝送装置 Download PDFInfo
- Publication number
- JP4553026B2 JP4553026B2 JP2008082649A JP2008082649A JP4553026B2 JP 4553026 B2 JP4553026 B2 JP 4553026B2 JP 2008082649 A JP2008082649 A JP 2008082649A JP 2008082649 A JP2008082649 A JP 2008082649A JP 4553026 B2 JP4553026 B2 JP 4553026B2
- Authority
- JP
- Japan
- Prior art keywords
- optical waveguide
- optical
- conductive film
- reference potential
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003287 optical effect Effects 0.000 title claims description 139
- 230000005540 biological transmission Effects 0.000 title claims description 34
- 239000000758 substrate Substances 0.000 claims description 24
- 238000005253 cladding Methods 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 2
- 230000004048 modification Effects 0.000 description 15
- 238000012986 modification Methods 0.000 description 15
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Description
また、複数の導波コアは、互いに平行に配置されていなくてもよい。
また、本実施形態では、クラッド部22の他端面22Dから光が入出射される構成について説明したが、図16及び図17示すように、他端面22Dについても入出射面22Bと45度の角度が構成されるようにしてミラー面24を構成し、ミラー面24で光路変換を行って、入出射面22Bから光を入出射させる構成としてもよい。また、その際入出射面22Bに入射させる発光素子、入出射面22Bから出射する光を受光する受光素子を配置してもよい。
次に、第2実施形態について説明する。第2実施形態については、第1実施形態と同一の部分については同一の符号を付して、その詳細な説明は省略する。
20 光導波路デバイス
22 クラッド部
22C 一端面
24 ミラー面
25 光導波路コア
27 導電性膜
30 発光素子
34 発光部
40 受光素子
44 受光部
50 基板
52 サブマウント
54 基準電位パッド
55 接続ワイヤ
56 導電性部材
70 光伝送装置
70 光導波路デバイス
71 光導波路デバイス
72 クラッド部
73 光導波路コア
75 ミラー部材
75A ミラー面
76 連結部材
78 カバー
Claims (1)
- 光を導く光導波路コアと、
前記光導波路コアを包囲するクラッド部と、
前記クラッド部の端面に構成され、前記光導波路コアを通過する光の光路を変換させるミラー面と、
前記ミラー面を覆うように形成された導電性膜と、
を有する光導波路デバイスと、
前記光導波路デバイスを搭載する基板と、
所定電位が確保された基準電位部材と、
前記導電性膜と前記基準電位部材とを電気的に接続する接続部材と、
を備え、
前記基準電位部材は前記基板上に配置され前記光導波路デバイスを上部に搭載するマウント部材として構成され、
前記接続部材は前記導電性膜と前記基準電位部材の両方に接触するように配置された導電性物質を含んで構成され、
前記クラッド部の前記光導波路コアの長手方向に沿った側面には、面取り形状にカットされた傾斜面が構成され、
前記導電性膜は、前記ミラー面から延長されて前記クラッド部の前記傾斜面、及び前記傾斜面と連続される上面の一部まで形成されている、光伝送装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008082649A JP4553026B2 (ja) | 2008-03-27 | 2008-03-27 | 光伝送装置 |
US12/211,913 US20090245716A1 (en) | 2008-03-27 | 2008-09-17 | Optical communication device |
EP08016472A EP2105774A1 (en) | 2008-03-27 | 2008-09-18 | Optical communication device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008082649A JP4553026B2 (ja) | 2008-03-27 | 2008-03-27 | 光伝送装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009237216A JP2009237216A (ja) | 2009-10-15 |
JP4553026B2 true JP4553026B2 (ja) | 2010-09-29 |
Family
ID=40823330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008082649A Expired - Fee Related JP4553026B2 (ja) | 2008-03-27 | 2008-03-27 | 光伝送装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20090245716A1 (ja) |
EP (1) | EP2105774A1 (ja) |
JP (1) | JP4553026B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011203458A (ja) * | 2010-03-25 | 2011-10-13 | Sumitomo Electric Ind Ltd | 発光モジュール |
DE102018129346A1 (de) * | 2018-11-21 | 2020-05-28 | Osram Opto Semiconductors Gmbh | Halbleiterlaser und herstellungsverfahren für einen halbleiterlaser |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004145250A (ja) * | 2002-08-27 | 2004-05-20 | Sharp Corp | 双方向光通信モジュール |
JP2008020721A (ja) * | 2006-07-13 | 2008-01-31 | Fuji Xerox Co Ltd | 並列光送受信装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE461491B (sv) * | 1987-12-02 | 1990-02-19 | Asea Ab | Monolitisk optokopplare |
US5125054A (en) * | 1991-07-25 | 1992-06-23 | Motorola, Inc. | Laminated polymer optical waveguide interface and method of making same |
US5610472A (en) * | 1994-10-25 | 1997-03-11 | Osram Sylvania Inc. | Lamp assembly with resilient connector for locating and cushioning neon lamp |
CA2153345C (en) * | 1994-12-15 | 2000-01-11 | Robert William Filas | Low polarization sensitivity gold mirrors on silica |
JP3538078B2 (ja) * | 1999-08-17 | 2004-06-14 | Nec液晶テクノロジー株式会社 | 液晶表示装置 |
JP2001356228A (ja) | 2000-06-15 | 2001-12-26 | Furukawa Electric Co Ltd:The | 光導波路デバイス |
JP3758526B2 (ja) * | 2000-08-10 | 2006-03-22 | シャープ株式会社 | 双方向光通信器および双方向光通信装置並びに双方向光通信器の組み立て方法 |
US6442307B1 (en) * | 2000-11-03 | 2002-08-27 | Lucent Technologies Inc. | Solder-packaged optical MEMs device and method for making the same |
JP4066665B2 (ja) * | 2002-02-08 | 2008-03-26 | 住友電気工業株式会社 | パラレル送受信モジュール |
JP4036008B2 (ja) * | 2002-02-13 | 2008-01-23 | 住友電気工業株式会社 | パラレル送受信モジュール |
JP3850743B2 (ja) * | 2002-03-07 | 2006-11-29 | シャープ株式会社 | 光通信モジュール、および光ファイバと光通信モジュールとの光学的結合構造 |
JP2004271921A (ja) * | 2003-03-10 | 2004-09-30 | Matsushita Electric Ind Co Ltd | 双方向光モジュール及び光伝送装置 |
CA2569265C (en) * | 2003-07-24 | 2012-10-09 | Reflex Photonique Inc./Reflex Photonics Inc. | Encapsulated optical package |
JP2007193007A (ja) * | 2006-01-18 | 2007-08-02 | Hitachi Cable Ltd | 光モジュール |
JP4915303B2 (ja) * | 2007-07-13 | 2012-04-11 | 富士ゼロックス株式会社 | 光導波路の製造方法及び光モジュールの製造方法 |
-
2008
- 2008-03-27 JP JP2008082649A patent/JP4553026B2/ja not_active Expired - Fee Related
- 2008-09-17 US US12/211,913 patent/US20090245716A1/en not_active Abandoned
- 2008-09-18 EP EP08016472A patent/EP2105774A1/en not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004145250A (ja) * | 2002-08-27 | 2004-05-20 | Sharp Corp | 双方向光通信モジュール |
JP2008020721A (ja) * | 2006-07-13 | 2008-01-31 | Fuji Xerox Co Ltd | 並列光送受信装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2009237216A (ja) | 2009-10-15 |
EP2105774A1 (en) | 2009-09-30 |
US20090245716A1 (en) | 2009-10-01 |
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