JP2006523310A5 - - Google Patents

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Publication number
JP2006523310A5
JP2006523310A5 JP2006508868A JP2006508868A JP2006523310A5 JP 2006523310 A5 JP2006523310 A5 JP 2006523310A5 JP 2006508868 A JP2006508868 A JP 2006508868A JP 2006508868 A JP2006508868 A JP 2006508868A JP 2006523310 A5 JP2006523310 A5 JP 2006523310A5
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JP
Japan
Prior art keywords
assembly
contact
circuit board
mechanical alignment
alignment feature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006508868A
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English (en)
Japanese (ja)
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JP2006523310A (ja
Filing date
Publication date
Priority claimed from US10/725,966 external-priority patent/US6833696B2/en
Application filed filed Critical
Publication of JP2006523310A publication Critical patent/JP2006523310A/ja
Publication of JP2006523310A5 publication Critical patent/JP2006523310A5/ja
Pending legal-status Critical Current

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JP2006508868A 2003-03-04 2004-02-25 高速コネクタ Pending JP2006523310A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US45219603P 2003-03-04 2003-03-04
US10/725,966 US6833696B2 (en) 2003-03-04 2003-12-01 Methods and apparatus for creating a high speed connection between a device under test and automatic test equipment
PCT/US2004/005858 WO2004079865A2 (en) 2003-03-04 2004-02-25 High speed connector

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006329101A Division JP2007129245A (ja) 2003-03-04 2006-12-06 高速コネクタ

Publications (2)

Publication Number Publication Date
JP2006523310A JP2006523310A (ja) 2006-10-12
JP2006523310A5 true JP2006523310A5 (https=) 2007-02-01

Family

ID=32930682

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2006508868A Pending JP2006523310A (ja) 2003-03-04 2004-02-25 高速コネクタ
JP2006329101A Pending JP2007129245A (ja) 2003-03-04 2006-12-06 高速コネクタ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2006329101A Pending JP2007129245A (ja) 2003-03-04 2006-12-06 高速コネクタ

Country Status (3)

Country Link
US (5) US6833696B2 (https=)
JP (2) JP2006523310A (https=)
WO (1) WO2004079865A2 (https=)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6833696B2 (en) * 2003-03-04 2004-12-21 Xandex, Inc. Methods and apparatus for creating a high speed connection between a device under test and automatic test equipment
US20050159050A1 (en) * 2003-06-05 2005-07-21 Hiroyuki Hama Device interface apparatus
US20060236495A1 (en) * 2005-04-25 2006-10-26 Romi Mayder Method and apparatus for non-contact cleaning of electronics
US7161347B1 (en) * 2005-07-08 2007-01-09 Credence Systems Corporation Test head for semiconductor integrated circuit tester
US7147499B1 (en) * 2005-10-19 2006-12-12 Verigy Ipco Zero insertion force printed circuit assembly connector system and method
US20070176615A1 (en) * 2006-01-27 2007-08-02 Xandex, Inc. Active probe contact array management
US7459921B2 (en) * 2006-05-31 2008-12-02 Verigy (Singapore) Pte. Ltd. Method and apparatus for a paddle board probe card
US20080139014A1 (en) * 2006-12-08 2008-06-12 Verigy (Singapore) Pte. Ltd. Interconnect assemblies, and methods of forming interconnects
KR100962501B1 (ko) * 2007-12-20 2010-06-14 (주)케미텍 반도체 시험용 커넥터 어셈블리
TWI511217B (zh) * 2008-11-25 2015-12-01 Advantest Corp 測試電子電路至受測裝置之介面及利用此介面之方法與裝置
US8373432B2 (en) * 2009-04-09 2013-02-12 Teradyne Inc. Automated test equipment employing test signal transmission channel with embedded series isolation resistors
KR100951919B1 (ko) 2009-11-23 2010-04-09 (주)케미텍 반도체 시험용 커넥터 어셈블리
US8872532B2 (en) * 2009-12-31 2014-10-28 Formfactor, Inc. Wafer test cassette system
WO2012057799A1 (en) * 2010-10-29 2012-05-03 Advantest (Singapore) Pte Ltd Tester having an application specific electronics module, and systems and methods that incorporate or use same
US8749261B2 (en) * 2011-02-11 2014-06-10 Micron Technology, Inc. Interfaces having a plurality of connector assemblies
CN103782182B (zh) 2011-07-12 2016-08-24 英泰斯特股份有限公司 驳接测试头与外围设备的方法与装置
US10451652B2 (en) 2014-07-16 2019-10-22 Teradyne, Inc. Coaxial structure for transmission of signals in test equipment
US10145893B2 (en) 2016-12-25 2018-12-04 Nuvoton Technology Corporation Resolving automated test equipment (ATE) timing constraint violations
KR101912710B1 (ko) 2017-10-20 2018-12-28 주식회사 오킨스전자 낮은 삽입력을 가지는 커넥터
US10972192B2 (en) 2018-05-11 2021-04-06 Teradyne, Inc. Handler change kit for a test system
CN111257717A (zh) * 2020-03-03 2020-06-09 李鑫 一种pin二极管用检测装置
US11604219B2 (en) 2020-12-15 2023-03-14 Teradyne, Inc. Automatic test equipement having fiber optic connections to remote servers
US11862901B2 (en) 2020-12-15 2024-01-02 Teradyne, Inc. Interposer
US11855376B2 (en) 2021-03-24 2023-12-26 Teradyne, Inc. Coaxial contact having an open-curve shape
US12046787B2 (en) 2021-05-14 2024-07-23 Teradyne, Inc. Waveguide connector for connecting first and second waveguides, where the connector includes a male part, a female part and a self-alignment feature and a test system formed therefrom

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Publication number Priority date Publication date Assignee Title
US4527942A (en) 1982-08-25 1985-07-09 Intest Corporation Electronic test head positioner for test systems
US4613193A (en) * 1984-08-13 1986-09-23 Tritec, Inc. Board-operated electrical connector for printed circuit boards
US4911643A (en) * 1988-10-11 1990-03-27 Beta Phase, Inc. High density and high signal integrity connector
US4969824A (en) * 1989-07-28 1990-11-13 Amp Incorporated Electrical connector
JPH04109645A (ja) * 1990-08-30 1992-04-10 Sumitomo Electric Ind Ltd 半導体プロービング試験装置
JPH04109646A (ja) * 1990-08-30 1992-04-10 Sumitomo Electric Ind Ltd 半導体プロービング試験装置
US5092781A (en) * 1990-11-08 1992-03-03 Amp Incorporated Electrical connector using shape memory alloy coil springs
US5068601A (en) 1991-02-11 1991-11-26 Credence Systems Corporation Dual function cam-ring system for DUT board parallel electrical inter-connection and prober/handler docking
KR100248569B1 (ko) * 1993-12-22 2000-03-15 히가시 데쓰로 프로우브장치
TW273635B (https=) * 1994-09-01 1996-04-01 Aesop
TW298686B (https=) * 1995-04-25 1997-02-21 Hitachi Ltd
US5552701A (en) 1995-05-15 1996-09-03 Hewlett-Packard Company Docking system for an electronic circuit tester
SG55211A1 (en) * 1995-07-05 1998-12-21 Tokyo Electron Ltd Testing apparatus
US5679018A (en) * 1996-04-17 1997-10-21 Molex Incorporated Circuit card connector utilizing flexible film circuitry
US5861759A (en) * 1997-01-29 1999-01-19 Tokyo Electron Limited Automatic probe card planarization system
US5923180A (en) 1997-02-04 1999-07-13 Hewlett-Packard Company Compliant wafer prober docking adapter
US6004142A (en) * 1997-03-04 1999-12-21 Micron Technology, Inc. Interposer converter to allow single-sided contact to circuit modules
US5986447A (en) * 1997-05-23 1999-11-16 Credence Systems Corporation Test head structure for integrated circuit tester
US6040691A (en) * 1997-05-23 2000-03-21 Credence Systems Corporation Test head for integrated circuit tester arranging tester component circuit boards on three dimensions
US6064195A (en) * 1998-05-11 2000-05-16 R-Tec Corporation Test probe positioning device
DE19931337A1 (de) * 1998-07-09 2000-01-27 Advantest Corp Befestigungsvorrichtung für Halbleiter-Bauelemente
DE10039336C2 (de) * 2000-08-04 2003-12-11 Infineon Technologies Ag Verfahren zum Testen von Halbleiterschaltungen und Testvorrichtung zur Durchführung des Verfahrens
US6762612B2 (en) * 2001-06-20 2004-07-13 Advantest Corp. Probe contact system having planarity adjustment mechanism
US6833696B2 (en) * 2003-03-04 2004-12-21 Xandex, Inc. Methods and apparatus for creating a high speed connection between a device under test and automatic test equipment
US7068056B1 (en) * 2005-07-18 2006-06-27 Texas Instruments Incorporated System and method for the probing of a wafer

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