JP2006523310A - 高速コネクタ - Google Patents

高速コネクタ Download PDF

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Publication number
JP2006523310A
JP2006523310A JP2006508868A JP2006508868A JP2006523310A JP 2006523310 A JP2006523310 A JP 2006523310A JP 2006508868 A JP2006508868 A JP 2006508868A JP 2006508868 A JP2006508868 A JP 2006508868A JP 2006523310 A JP2006523310 A JP 2006523310A
Authority
JP
Japan
Prior art keywords
assembly
dut
contact
ridge
clamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006508868A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006523310A5 (https=
Inventor
シンシャイマー・ロジャー
ウィリアムズ・ディ．・エバン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xandex Inc
Original Assignee
Xandex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xandex Inc filed Critical Xandex Inc
Publication of JP2006523310A publication Critical patent/JP2006523310A/ja
Publication of JP2006523310A5 publication Critical patent/JP2006523310A5/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2006508868A 2003-03-04 2004-02-25 高速コネクタ Pending JP2006523310A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US45219603P 2003-03-04 2003-03-04
US10/725,966 US6833696B2 (en) 2003-03-04 2003-12-01 Methods and apparatus for creating a high speed connection between a device under test and automatic test equipment
PCT/US2004/005858 WO2004079865A2 (en) 2003-03-04 2004-02-25 High speed connector

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006329101A Division JP2007129245A (ja) 2003-03-04 2006-12-06 高速コネクタ

Publications (2)

Publication Number Publication Date
JP2006523310A true JP2006523310A (ja) 2006-10-12
JP2006523310A5 JP2006523310A5 (https=) 2007-02-01

Family

ID=32930682

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2006508868A Pending JP2006523310A (ja) 2003-03-04 2004-02-25 高速コネクタ
JP2006329101A Pending JP2007129245A (ja) 2003-03-04 2006-12-06 高速コネクタ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2006329101A Pending JP2007129245A (ja) 2003-03-04 2006-12-06 高速コネクタ

Country Status (3)

Country Link
US (5) US6833696B2 (https=)
JP (2) JP2006523310A (https=)
WO (1) WO2004079865A2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007129245A (ja) * 2003-03-04 2007-05-24 Xandex Inc 高速コネクタ
KR101912710B1 (ko) 2017-10-20 2018-12-28 주식회사 오킨스전자 낮은 삽입력을 가지는 커넥터

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050159050A1 (en) * 2003-06-05 2005-07-21 Hiroyuki Hama Device interface apparatus
US20060236495A1 (en) * 2005-04-25 2006-10-26 Romi Mayder Method and apparatus for non-contact cleaning of electronics
US7161347B1 (en) * 2005-07-08 2007-01-09 Credence Systems Corporation Test head for semiconductor integrated circuit tester
US7147499B1 (en) * 2005-10-19 2006-12-12 Verigy Ipco Zero insertion force printed circuit assembly connector system and method
US20070176615A1 (en) * 2006-01-27 2007-08-02 Xandex, Inc. Active probe contact array management
US7459921B2 (en) * 2006-05-31 2008-12-02 Verigy (Singapore) Pte. Ltd. Method and apparatus for a paddle board probe card
US20080139014A1 (en) * 2006-12-08 2008-06-12 Verigy (Singapore) Pte. Ltd. Interconnect assemblies, and methods of forming interconnects
KR100962501B1 (ko) * 2007-12-20 2010-06-14 (주)케미텍 반도체 시험용 커넥터 어셈블리
TWI511217B (zh) * 2008-11-25 2015-12-01 Advantest Corp 測試電子電路至受測裝置之介面及利用此介面之方法與裝置
US8373432B2 (en) * 2009-04-09 2013-02-12 Teradyne Inc. Automated test equipment employing test signal transmission channel with embedded series isolation resistors
KR100951919B1 (ko) 2009-11-23 2010-04-09 (주)케미텍 반도체 시험용 커넥터 어셈블리
US8872532B2 (en) * 2009-12-31 2014-10-28 Formfactor, Inc. Wafer test cassette system
WO2012057799A1 (en) * 2010-10-29 2012-05-03 Advantest (Singapore) Pte Ltd Tester having an application specific electronics module, and systems and methods that incorporate or use same
US8749261B2 (en) * 2011-02-11 2014-06-10 Micron Technology, Inc. Interfaces having a plurality of connector assemblies
CN103782182B (zh) 2011-07-12 2016-08-24 英泰斯特股份有限公司 驳接测试头与外围设备的方法与装置
US10451652B2 (en) 2014-07-16 2019-10-22 Teradyne, Inc. Coaxial structure for transmission of signals in test equipment
US10145893B2 (en) 2016-12-25 2018-12-04 Nuvoton Technology Corporation Resolving automated test equipment (ATE) timing constraint violations
US10972192B2 (en) 2018-05-11 2021-04-06 Teradyne, Inc. Handler change kit for a test system
CN111257717A (zh) * 2020-03-03 2020-06-09 李鑫 一种pin二极管用检测装置
US11604219B2 (en) 2020-12-15 2023-03-14 Teradyne, Inc. Automatic test equipement having fiber optic connections to remote servers
US11862901B2 (en) 2020-12-15 2024-01-02 Teradyne, Inc. Interposer
US11855376B2 (en) 2021-03-24 2023-12-26 Teradyne, Inc. Coaxial contact having an open-curve shape
US12046787B2 (en) 2021-05-14 2024-07-23 Teradyne, Inc. Waveguide connector for connecting first and second waveguides, where the connector includes a male part, a female part and a self-alignment feature and a test system formed therefrom

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4527942A (en) 1982-08-25 1985-07-09 Intest Corporation Electronic test head positioner for test systems
US4613193A (en) * 1984-08-13 1986-09-23 Tritec, Inc. Board-operated electrical connector for printed circuit boards
US4911643A (en) * 1988-10-11 1990-03-27 Beta Phase, Inc. High density and high signal integrity connector
US4969824A (en) * 1989-07-28 1990-11-13 Amp Incorporated Electrical connector
JPH04109645A (ja) * 1990-08-30 1992-04-10 Sumitomo Electric Ind Ltd 半導体プロービング試験装置
JPH04109646A (ja) * 1990-08-30 1992-04-10 Sumitomo Electric Ind Ltd 半導体プロービング試験装置
US5092781A (en) * 1990-11-08 1992-03-03 Amp Incorporated Electrical connector using shape memory alloy coil springs
US5068601A (en) 1991-02-11 1991-11-26 Credence Systems Corporation Dual function cam-ring system for DUT board parallel electrical inter-connection and prober/handler docking
KR100248569B1 (ko) * 1993-12-22 2000-03-15 히가시 데쓰로 프로우브장치
TW273635B (https=) * 1994-09-01 1996-04-01 Aesop
TW298686B (https=) * 1995-04-25 1997-02-21 Hitachi Ltd
US5552701A (en) 1995-05-15 1996-09-03 Hewlett-Packard Company Docking system for an electronic circuit tester
SG55211A1 (en) * 1995-07-05 1998-12-21 Tokyo Electron Ltd Testing apparatus
US5679018A (en) * 1996-04-17 1997-10-21 Molex Incorporated Circuit card connector utilizing flexible film circuitry
US5861759A (en) * 1997-01-29 1999-01-19 Tokyo Electron Limited Automatic probe card planarization system
US5923180A (en) 1997-02-04 1999-07-13 Hewlett-Packard Company Compliant wafer prober docking adapter
US6004142A (en) * 1997-03-04 1999-12-21 Micron Technology, Inc. Interposer converter to allow single-sided contact to circuit modules
US5986447A (en) * 1997-05-23 1999-11-16 Credence Systems Corporation Test head structure for integrated circuit tester
US6040691A (en) * 1997-05-23 2000-03-21 Credence Systems Corporation Test head for integrated circuit tester arranging tester component circuit boards on three dimensions
US6064195A (en) * 1998-05-11 2000-05-16 R-Tec Corporation Test probe positioning device
DE19931337A1 (de) * 1998-07-09 2000-01-27 Advantest Corp Befestigungsvorrichtung für Halbleiter-Bauelemente
DE10039336C2 (de) * 2000-08-04 2003-12-11 Infineon Technologies Ag Verfahren zum Testen von Halbleiterschaltungen und Testvorrichtung zur Durchführung des Verfahrens
US6762612B2 (en) * 2001-06-20 2004-07-13 Advantest Corp. Probe contact system having planarity adjustment mechanism
US6833696B2 (en) * 2003-03-04 2004-12-21 Xandex, Inc. Methods and apparatus for creating a high speed connection between a device under test and automatic test equipment
US7068056B1 (en) * 2005-07-18 2006-06-27 Texas Instruments Incorporated System and method for the probing of a wafer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007129245A (ja) * 2003-03-04 2007-05-24 Xandex Inc 高速コネクタ
KR101912710B1 (ko) 2017-10-20 2018-12-28 주식회사 오킨스전자 낮은 삽입력을 가지는 커넥터

Also Published As

Publication number Publication date
WO2004079865A3 (en) 2005-02-03
US6963211B2 (en) 2005-11-08
US7358754B2 (en) 2008-04-15
US20060244471A1 (en) 2006-11-02
US20050264311A1 (en) 2005-12-01
US6833696B2 (en) 2004-12-21
US20070126439A1 (en) 2007-06-07
JP2007129245A (ja) 2007-05-24
US20040174174A1 (en) 2004-09-09
US20050046411A1 (en) 2005-03-03
WO2004079865A2 (en) 2004-09-16
WO2004079865A8 (en) 2005-10-06
US7078890B2 (en) 2006-07-18
WO2004079865B1 (en) 2005-03-24

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