JP2006507690A - トランス熱電装置 - Google Patents

トランス熱電装置 Download PDF

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Publication number
JP2006507690A
JP2006507690A JP2004555717A JP2004555717A JP2006507690A JP 2006507690 A JP2006507690 A JP 2006507690A JP 2004555717 A JP2004555717 A JP 2004555717A JP 2004555717 A JP2004555717 A JP 2004555717A JP 2006507690 A JP2006507690 A JP 2006507690A
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JP
Japan
Prior art keywords
thermoelectric device
legs
unipolar
temperature
pair
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Pending
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JP2004555717A
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English (en)
Japanese (ja)
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JP2006507690A5 (https=
Inventor
ヴェンカタスブラマニアン，ラマ
クーンリー，キップ
シーヴォラ，エドワード
プチャン，マイケル
アリー，ランディ
アデパリ，プラティマ
オクイン，ブルックス
コルピッツ，トーマス
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ネクストリーム・サーマル・ソリューションズ
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Publication of JP2006507690A publication Critical patent/JP2006507690A/ja
Publication of JP2006507690A5 publication Critical patent/JP2006507690A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Control Of Temperature (AREA)
JP2004555717A 2002-11-25 2003-11-25 トランス熱電装置 Pending JP2006507690A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US42875302P 2002-11-25 2002-11-25
PCT/US2003/037633 WO2004049463A1 (en) 2002-11-25 2003-11-25 Trans-thermoelectric device

Publications (2)

Publication Number Publication Date
JP2006507690A true JP2006507690A (ja) 2006-03-02
JP2006507690A5 JP2006507690A5 (https=) 2007-01-25

Family

ID=32393453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004555717A Pending JP2006507690A (ja) 2002-11-25 2003-11-25 トランス熱電装置

Country Status (6)

Country Link
US (1) US7838760B2 (https=)
EP (1) EP1579512A4 (https=)
JP (1) JP2006507690A (https=)
KR (1) KR20050116362A (https=)
AU (1) AU2003293034A1 (https=)
WO (1) WO2004049463A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015135939A (ja) * 2013-12-16 2015-07-27 住友電気工業株式会社 熱電材料、熱電モジュール、光センサおよび熱電材料の製造方法
JP2022547108A (ja) * 2019-09-04 2022-11-10 エルジー イノテック カンパニー リミテッド 熱電モジュール

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WO2004049463A1 (en) 2002-11-25 2004-06-10 Nextreme Thermal Solutions Trans-thermoelectric device
WO2005124881A1 (ja) * 2004-06-22 2005-12-29 Aruze Corp. 熱電変換素子
US7868242B2 (en) 2004-07-01 2011-01-11 Universal Entertainment Corporation Thermoelectric conversion module
US7587901B2 (en) 2004-12-20 2009-09-15 Amerigon Incorporated Control system for thermal module in vehicle
EP1796182A1 (en) * 2005-12-09 2007-06-13 Corning SAS Thermoelectric device
US20080087316A1 (en) 2006-10-12 2008-04-17 Masa Inaba Thermoelectric device with internal sensor
EP2102564B1 (en) 2007-01-10 2015-09-02 Gentherm Incorporated Thermoelectric device
US7877827B2 (en) 2007-09-10 2011-02-01 Amerigon Incorporated Operational control schemes for ventilated seat or bed assemblies
KR101779870B1 (ko) 2008-02-01 2017-10-10 젠썸 인코포레이티드 열전 소자용 응결 센서 및 습도 센서
US20090199887A1 (en) * 2008-02-08 2009-08-13 North Carolina State University And Nextreme Thermal Solutions, Inc. Methods of forming thermoelectric devices including epitaxial thermoelectric elements of different conductivity types on a same substrate and related structures
US20090205696A1 (en) * 2008-02-15 2009-08-20 Nextreme Thermal Solutions, Inc. Thermoelectric Heat Pumps Providing Active Thermal Barriers and Related Devices and Methods
CN101566506B (zh) * 2008-04-22 2013-07-03 中国计量学院 一种基于微型桥谐振器的薄膜热电变换器的结构及制作方法
JP5997899B2 (ja) 2008-07-18 2016-09-28 ジェンサーム インコーポレイテッドＧｅｎｔｈｅｒｍ Ｉｎｃｏｒｐｏｒａｔｅｄ 空調されるベッドアセンブリ
US8525016B2 (en) 2009-04-02 2013-09-03 Nextreme Thermal Solutions, Inc. Thermoelectric devices including thermoelectric elements having off-set metal pads and related structures, methods, and systems
US9601677B2 (en) 2010-03-15 2017-03-21 Laird Durham, Inc. Thermoelectric (TE) devices/structures including thermoelectric elements with exposed major surfaces
US9476617B2 (en) * 2010-10-04 2016-10-25 Basf Se Thermoelectric modules for an exhaust system
GB2484486A (en) * 2010-10-12 2012-04-18 Oclaro Technology Ltd Component Temperature Control
CN103918095B (zh) * 2011-09-08 2017-03-22 耶德研究和发展有限公司 效率增强的热电装置
WO2013052823A1 (en) 2011-10-07 2013-04-11 Gentherm Incorporated Thermoelectric device controls and methods
US9989267B2 (en) 2012-02-10 2018-06-05 Gentherm Incorporated Moisture abatement in heating operation of climate controlled systems
US9506675B1 (en) 2013-09-23 2016-11-29 Geoffrey O. Campbell Thermoelectric coolers with asymmetric conductance
US9662962B2 (en) 2013-11-05 2017-05-30 Gentherm Incorporated Vehicle headliner assembly for zonal comfort
KR102252584B1 (ko) 2014-02-14 2021-05-14 젠썸 인코포레이티드 전도식 대류식 기온 제어 조립체
US10634396B2 (en) 2014-05-23 2020-04-28 Laird Thermal Systems, Inc. Thermoelectric heating/cooling devices including resistive heaters
US11033058B2 (en) 2014-11-14 2021-06-15 Gentherm Incorporated Heating and cooling technologies
US11639816B2 (en) 2014-11-14 2023-05-02 Gentherm Incorporated Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system
US11857004B2 (en) 2014-11-14 2024-01-02 Gentherm Incorporated Heating and cooling technologies
US12181351B2 (en) 2018-02-28 2024-12-31 Arthur Beckman Thermopile assembly providing a massive electrical series of wire thermocouple elements
US11289756B2 (en) * 2018-05-18 2022-03-29 The Johns Hopkins University Active thermal management of battery cells via thermoelectrics
US11223004B2 (en) 2018-07-30 2022-01-11 Gentherm Incorporated Thermoelectric device having a polymeric coating
CN121230238A (zh) 2018-11-30 2025-12-30 金瑟姆股份公司 热电调节系统和方法
US11152557B2 (en) 2019-02-20 2021-10-19 Gentherm Incorporated Thermoelectric module with integrated printed circuit board
CN111739881B (zh) * 2020-08-03 2020-11-20 上海南麟集成电路有限公司 一种基于mems热电堆的可见光收发集成器件及其制作方法
US12552223B2 (en) 2021-03-18 2026-02-17 Gentherm Incorporated Optimal control of convective thermal devices
US12611909B2 (en) 2021-03-18 2026-04-28 Gentherm Incorporated Preconditioning surfaces using intelligent thermal effectors
KR102532925B1 (ko) 2021-05-04 2023-05-19 주식회사 이노와이어리스 무선 이어폰의 오디오 품질 측정 시스템
US12119285B2 (en) * 2021-09-03 2024-10-15 Microsoft Technology Licensing, Llc Image sensor with actively cooled sensor array
CN116692763B (zh) * 2023-04-23 2026-04-17 东南大学 一种基于mems热桥器件的热三级管

Citations (11)

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US3615870A (en) * 1968-09-04 1971-10-26 Rca Corp Thermoelement array connecting apparatus
JPS63253677A (ja) * 1987-04-10 1988-10-20 Nippon Inter Electronics Corp 多層熱電変換装置
JPH08125237A (ja) * 1994-10-28 1996-05-17 Aisin Seiki Co Ltd 熱電素子
JPH1070315A (ja) * 1996-08-26 1998-03-10 Osaka Gas Co Ltd 熱電材料の製造方法
US6300150B1 (en) * 1997-03-31 2001-10-09 Research Triangle Institute Thin-film thermoelectric device and fabrication method of same
JP2002111080A (ja) * 2000-09-29 2002-04-12 Matsushita Electric Works Ltd ペルチェモジュール及びその製造方法
US20020046762A1 (en) * 2000-10-04 2002-04-25 Andrea Rossi Thermoelectric generators
US20020092557A1 (en) * 2000-12-07 2002-07-18 Ibm Corporation Enhanced interface thermoelectric coolers with all-metal tips
JP2002232028A (ja) * 2000-12-01 2002-08-16 Yamaha Corp 熱電モジュール
JP2002537658A (ja) * 1999-02-19 2002-11-05 ペルテク エッセ エレ エレ 固体熱電装置
US20030209014A1 (en) * 2002-05-13 2003-11-13 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer transfer system with temperature control apparatus

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WO2007002342A2 (en) 2005-06-22 2007-01-04 Nextreme Thermal Solutions Methods of forming thermoelectric devices including electrically insulating matrixes between conductive traces and related structures
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615870A (en) * 1968-09-04 1971-10-26 Rca Corp Thermoelement array connecting apparatus
JPS63253677A (ja) * 1987-04-10 1988-10-20 Nippon Inter Electronics Corp 多層熱電変換装置
JPH08125237A (ja) * 1994-10-28 1996-05-17 Aisin Seiki Co Ltd 熱電素子
JPH1070315A (ja) * 1996-08-26 1998-03-10 Osaka Gas Co Ltd 熱電材料の製造方法
US6300150B1 (en) * 1997-03-31 2001-10-09 Research Triangle Institute Thin-film thermoelectric device and fabrication method of same
JP2002537658A (ja) * 1999-02-19 2002-11-05 ペルテク エッセ エレ エレ 固体熱電装置
JP2002111080A (ja) * 2000-09-29 2002-04-12 Matsushita Electric Works Ltd ペルチェモジュール及びその製造方法
US20020046762A1 (en) * 2000-10-04 2002-04-25 Andrea Rossi Thermoelectric generators
JP2002232028A (ja) * 2000-12-01 2002-08-16 Yamaha Corp 熱電モジュール
US20020092557A1 (en) * 2000-12-07 2002-07-18 Ibm Corporation Enhanced interface thermoelectric coolers with all-metal tips
US20030209014A1 (en) * 2002-05-13 2003-11-13 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer transfer system with temperature control apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015135939A (ja) * 2013-12-16 2015-07-27 住友電気工業株式会社 熱電材料、熱電モジュール、光センサおよび熱電材料の製造方法
JP2022547108A (ja) * 2019-09-04 2022-11-10 エルジー イノテック カンパニー リミテッド 熱電モジュール
JP7625585B2 (ja) 2019-09-04 2025-02-03 エルジー イノテック カンパニー リミテッド 熱電モジュール

Also Published As

Publication number Publication date
EP1579512A1 (en) 2005-09-28
US20060225773A1 (en) 2006-10-12
US7838760B2 (en) 2010-11-23
AU2003293034A1 (en) 2004-06-18
WO2004049463B1 (en) 2004-09-10
WO2004049463A1 (en) 2004-06-10
KR20050116362A (ko) 2005-12-12
EP1579512A4 (en) 2008-11-19

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