AU2003293034A1 - Trans-thermoelectric device - Google Patents

Trans-thermoelectric device

Info

Publication number
AU2003293034A1
AU2003293034A1 AU2003293034A AU2003293034A AU2003293034A1 AU 2003293034 A1 AU2003293034 A1 AU 2003293034A1 AU 2003293034 A AU2003293034 A AU 2003293034A AU 2003293034 A AU2003293034 A AU 2003293034A AU 2003293034 A1 AU2003293034 A1 AU 2003293034A1
Authority
AU
Australia
Prior art keywords
trans
thermoelectric device
thermoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003293034A
Other languages
English (en)
Inventor
Pratima Addepalli
Randy Alley
Thomas Colpitts
Kip Coonley
Brooks O'quinn
Michael Puchan
Edward Siivola
Rama Venkatasubramanian
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RTI International Inc
Original Assignee
QUINN BROOKS O
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by QUINN BROOKS O filed Critical QUINN BROOKS O
Publication of AU2003293034A1 publication Critical patent/AU2003293034A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Control Of Temperature (AREA)
AU2003293034A 2002-11-25 2003-11-25 Trans-thermoelectric device Abandoned AU2003293034A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US42875302P 2002-11-25 2002-11-25
US60/428,753 2002-11-25
PCT/US2003/037633 WO2004049463A1 (en) 2002-11-25 2003-11-25 Trans-thermoelectric device

Publications (1)

Publication Number Publication Date
AU2003293034A1 true AU2003293034A1 (en) 2004-06-18

Family

ID=32393453

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003293034A Abandoned AU2003293034A1 (en) 2002-11-25 2003-11-25 Trans-thermoelectric device

Country Status (6)

Country Link
US (1) US7838760B2 (https=)
EP (1) EP1579512A4 (https=)
JP (1) JP2006507690A (https=)
KR (1) KR20050116362A (https=)
AU (1) AU2003293034A1 (https=)
WO (1) WO2004049463A1 (https=)

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US20090199887A1 (en) * 2008-02-08 2009-08-13 North Carolina State University And Nextreme Thermal Solutions, Inc. Methods of forming thermoelectric devices including epitaxial thermoelectric elements of different conductivity types on a same substrate and related structures
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US8525016B2 (en) 2009-04-02 2013-09-03 Nextreme Thermal Solutions, Inc. Thermoelectric devices including thermoelectric elements having off-set metal pads and related structures, methods, and systems
US9601677B2 (en) 2010-03-15 2017-03-21 Laird Durham, Inc. Thermoelectric (TE) devices/structures including thermoelectric elements with exposed major surfaces
US9476617B2 (en) * 2010-10-04 2016-10-25 Basf Se Thermoelectric modules for an exhaust system
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CN103918095B (zh) * 2011-09-08 2017-03-22 耶德研究和发展有限公司 效率增强的热电装置
WO2013052823A1 (en) 2011-10-07 2013-04-11 Gentherm Incorporated Thermoelectric device controls and methods
US9989267B2 (en) 2012-02-10 2018-06-05 Gentherm Incorporated Moisture abatement in heating operation of climate controlled systems
US9506675B1 (en) 2013-09-23 2016-11-29 Geoffrey O. Campbell Thermoelectric coolers with asymmetric conductance
US9662962B2 (en) 2013-11-05 2017-05-30 Gentherm Incorporated Vehicle headliner assembly for zonal comfort
JP6269352B2 (ja) * 2013-12-16 2018-01-31 住友電気工業株式会社 熱電材料、熱電モジュール、光センサおよび熱電材料の製造方法
KR102252584B1 (ko) 2014-02-14 2021-05-14 젠썸 인코포레이티드 전도식 대류식 기온 제어 조립체
US10634396B2 (en) 2014-05-23 2020-04-28 Laird Thermal Systems, Inc. Thermoelectric heating/cooling devices including resistive heaters
US11033058B2 (en) 2014-11-14 2021-06-15 Gentherm Incorporated Heating and cooling technologies
US11639816B2 (en) 2014-11-14 2023-05-02 Gentherm Incorporated Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system
US11857004B2 (en) 2014-11-14 2024-01-02 Gentherm Incorporated Heating and cooling technologies
US12181351B2 (en) 2018-02-28 2024-12-31 Arthur Beckman Thermopile assembly providing a massive electrical series of wire thermocouple elements
US11289756B2 (en) * 2018-05-18 2022-03-29 The Johns Hopkins University Active thermal management of battery cells via thermoelectrics
US11223004B2 (en) 2018-07-30 2022-01-11 Gentherm Incorporated Thermoelectric device having a polymeric coating
CN121230238A (zh) 2018-11-30 2025-12-30 金瑟姆股份公司 热电调节系统和方法
US11152557B2 (en) 2019-02-20 2021-10-19 Gentherm Incorporated Thermoelectric module with integrated printed circuit board
EP4026176A4 (en) 2019-09-04 2023-09-13 LG Innotek Co., Ltd. Thermoelectric module
CN111739881B (zh) * 2020-08-03 2020-11-20 上海南麟集成电路有限公司 一种基于mems热电堆的可见光收发集成器件及其制作方法
US12552223B2 (en) 2021-03-18 2026-02-17 Gentherm Incorporated Optimal control of convective thermal devices
US12611909B2 (en) 2021-03-18 2026-04-28 Gentherm Incorporated Preconditioning surfaces using intelligent thermal effectors
KR102532925B1 (ko) 2021-05-04 2023-05-19 주식회사 이노와이어리스 무선 이어폰의 오디오 품질 측정 시스템
US12119285B2 (en) * 2021-09-03 2024-10-15 Microsoft Technology Licensing, Llc Image sensor with actively cooled sensor array
CN116692763B (zh) * 2023-04-23 2026-04-17 东南大学 一种基于mems热桥器件的热三级管

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Also Published As

Publication number Publication date
EP1579512A1 (en) 2005-09-28
US20060225773A1 (en) 2006-10-12
US7838760B2 (en) 2010-11-23
WO2004049463B1 (en) 2004-09-10
WO2004049463A1 (en) 2004-06-10
JP2006507690A (ja) 2006-03-02
KR20050116362A (ko) 2005-12-12
EP1579512A4 (en) 2008-11-19

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase