KR20050116362A - 트랜스 열전 소자 - Google Patents

트랜스 열전 소자 Download PDF

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Publication number
KR20050116362A
KR20050116362A KR1020057009357A KR20057009357A KR20050116362A KR 20050116362 A KR20050116362 A KR 20050116362A KR 1020057009357 A KR1020057009357 A KR 1020057009357A KR 20057009357 A KR20057009357 A KR 20057009357A KR 20050116362 A KR20050116362 A KR 20050116362A
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KR
South Korea
Prior art keywords
legs
temperature
unipolar
couple
thermoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020057009357A
Other languages
English (en)
Korean (ko)
Inventor
라마 벤카타수브라마니안
킵 쿤리
에드워드 시볼라
마이클 푸찬
랜디 알리
프라티마 애드팔리
브룩스 오쿠인
토마스 콜피츠
Original Assignee
넥스트림 써멀 솔루션즈, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 넥스트림 써멀 솔루션즈, 인크. filed Critical 넥스트림 써멀 솔루션즈, 인크.
Publication of KR20050116362A publication Critical patent/KR20050116362A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Control Of Temperature (AREA)
KR1020057009357A 2002-11-25 2003-11-25 트랜스 열전 소자 Withdrawn KR20050116362A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US42875302P 2002-11-25 2002-11-25
US60/428,753 2002-11-25

Publications (1)

Publication Number Publication Date
KR20050116362A true KR20050116362A (ko) 2005-12-12

Family

ID=32393453

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057009357A Withdrawn KR20050116362A (ko) 2002-11-25 2003-11-25 트랜스 열전 소자

Country Status (6)

Country Link
US (1) US7838760B2 (https=)
EP (1) EP1579512A4 (https=)
JP (1) JP2006507690A (https=)
KR (1) KR20050116362A (https=)
AU (1) AU2003293034A1 (https=)
WO (1) WO2004049463A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220151080A (ko) 2021-05-04 2022-11-14 주식회사 이노와이어리스 무선 이어폰의 오디오 품질 측정 시스템

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004049463A1 (en) 2002-11-25 2004-06-10 Nextreme Thermal Solutions Trans-thermoelectric device
WO2005124881A1 (ja) * 2004-06-22 2005-12-29 Aruze Corp. 熱電変換素子
US7868242B2 (en) 2004-07-01 2011-01-11 Universal Entertainment Corporation Thermoelectric conversion module
US7587901B2 (en) 2004-12-20 2009-09-15 Amerigon Incorporated Control system for thermal module in vehicle
EP1796182A1 (en) * 2005-12-09 2007-06-13 Corning SAS Thermoelectric device
US20080087316A1 (en) 2006-10-12 2008-04-17 Masa Inaba Thermoelectric device with internal sensor
EP2102564B1 (en) 2007-01-10 2015-09-02 Gentherm Incorporated Thermoelectric device
US7877827B2 (en) 2007-09-10 2011-02-01 Amerigon Incorporated Operational control schemes for ventilated seat or bed assemblies
KR101779870B1 (ko) 2008-02-01 2017-10-10 젠썸 인코포레이티드 열전 소자용 응결 센서 및 습도 센서
US20090199887A1 (en) * 2008-02-08 2009-08-13 North Carolina State University And Nextreme Thermal Solutions, Inc. Methods of forming thermoelectric devices including epitaxial thermoelectric elements of different conductivity types on a same substrate and related structures
US20090205696A1 (en) * 2008-02-15 2009-08-20 Nextreme Thermal Solutions, Inc. Thermoelectric Heat Pumps Providing Active Thermal Barriers and Related Devices and Methods
CN101566506B (zh) * 2008-04-22 2013-07-03 中国计量学院 一种基于微型桥谐振器的薄膜热电变换器的结构及制作方法
JP5997899B2 (ja) 2008-07-18 2016-09-28 ジェンサーム インコーポレイテッドＧｅｎｔｈｅｒｍ Ｉｎｃｏｒｐｏｒａｔｅｄ 空調されるベッドアセンブリ
US8525016B2 (en) 2009-04-02 2013-09-03 Nextreme Thermal Solutions, Inc. Thermoelectric devices including thermoelectric elements having off-set metal pads and related structures, methods, and systems
US9601677B2 (en) 2010-03-15 2017-03-21 Laird Durham, Inc. Thermoelectric (TE) devices/structures including thermoelectric elements with exposed major surfaces
US9476617B2 (en) * 2010-10-04 2016-10-25 Basf Se Thermoelectric modules for an exhaust system
GB2484486A (en) * 2010-10-12 2012-04-18 Oclaro Technology Ltd Component Temperature Control
CN103918095B (zh) * 2011-09-08 2017-03-22 耶德研究和发展有限公司 效率增强的热电装置
WO2013052823A1 (en) 2011-10-07 2013-04-11 Gentherm Incorporated Thermoelectric device controls and methods
US9989267B2 (en) 2012-02-10 2018-06-05 Gentherm Incorporated Moisture abatement in heating operation of climate controlled systems
US9506675B1 (en) 2013-09-23 2016-11-29 Geoffrey O. Campbell Thermoelectric coolers with asymmetric conductance
US9662962B2 (en) 2013-11-05 2017-05-30 Gentherm Incorporated Vehicle headliner assembly for zonal comfort
JP6269352B2 (ja) * 2013-12-16 2018-01-31 住友電気工業株式会社 熱電材料、熱電モジュール、光センサおよび熱電材料の製造方法
KR102252584B1 (ko) 2014-02-14 2021-05-14 젠썸 인코포레이티드 전도식 대류식 기온 제어 조립체
US10634396B2 (en) 2014-05-23 2020-04-28 Laird Thermal Systems, Inc. Thermoelectric heating/cooling devices including resistive heaters
US11033058B2 (en) 2014-11-14 2021-06-15 Gentherm Incorporated Heating and cooling technologies
US11639816B2 (en) 2014-11-14 2023-05-02 Gentherm Incorporated Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system
US11857004B2 (en) 2014-11-14 2024-01-02 Gentherm Incorporated Heating and cooling technologies
US12181351B2 (en) 2018-02-28 2024-12-31 Arthur Beckman Thermopile assembly providing a massive electrical series of wire thermocouple elements
US11289756B2 (en) * 2018-05-18 2022-03-29 The Johns Hopkins University Active thermal management of battery cells via thermoelectrics
US11223004B2 (en) 2018-07-30 2022-01-11 Gentherm Incorporated Thermoelectric device having a polymeric coating
CN121230238A (zh) 2018-11-30 2025-12-30 金瑟姆股份公司 热电调节系统和方法
US11152557B2 (en) 2019-02-20 2021-10-19 Gentherm Incorporated Thermoelectric module with integrated printed circuit board
EP4026176A4 (en) 2019-09-04 2023-09-13 LG Innotek Co., Ltd. Thermoelectric module
CN111739881B (zh) * 2020-08-03 2020-11-20 上海南麟集成电路有限公司 一种基于mems热电堆的可见光收发集成器件及其制作方法
US12552223B2 (en) 2021-03-18 2026-02-17 Gentherm Incorporated Optimal control of convective thermal devices
US12611909B2 (en) 2021-03-18 2026-04-28 Gentherm Incorporated Preconditioning surfaces using intelligent thermal effectors
US12119285B2 (en) * 2021-09-03 2024-10-15 Microsoft Technology Licensing, Llc Image sensor with actively cooled sensor array
CN116692763B (zh) * 2023-04-23 2026-04-17 东南大学 一种基于mems热桥器件的热三级管

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615870A (en) * 1968-09-04 1971-10-26 Rca Corp Thermoelement array connecting apparatus
JPS63253677A (ja) * 1987-04-10 1988-10-20 Nippon Inter Electronics Corp 多層熱電変換装置
US5228923A (en) 1991-12-13 1993-07-20 Implemed, Inc. Cylindrical thermoelectric cells
US5415699A (en) * 1993-01-12 1995-05-16 Massachusetts Institute Of Technology Superlattice structures particularly suitable for use as thermoelectric cooling materials
US5837929A (en) * 1994-07-05 1998-11-17 Mantron, Inc. Microelectronic thermoelectric device and systems incorporating such device
JPH08125237A (ja) 1994-10-28 1996-05-17 Aisin Seiki Co Ltd 熱電素子
DE69735589T2 (de) 1996-05-28 2007-01-04 Matsushita Electric Works, Ltd., Kadoma Herstellungsverfahren für einen thermoelektrischen modul
JPH1070315A (ja) * 1996-08-26 1998-03-10 Osaka Gas Co Ltd 熱電材料の製造方法
US6300150B1 (en) 1997-03-31 2001-10-09 Research Triangle Institute Thin-film thermoelectric device and fabrication method of same
US5936193A (en) 1997-05-09 1999-08-10 Parise; Ronald J. Nighttime solar cell
JPH11121816A (ja) * 1997-10-21 1999-04-30 Morikkusu Kk 熱電モジュールユニット
US6100463A (en) * 1997-11-18 2000-08-08 The Boeing Company Method for making advanced thermoelectric devices
US6586835B1 (en) 1998-08-31 2003-07-01 Micron Technology, Inc. Compact system module with built-in thermoelectric cooling
IT1309710B1 (it) * 1999-02-19 2002-01-30 Pastorino Giorgio Dispositivo termoelettrico a stato solido
US6282907B1 (en) * 1999-12-09 2001-09-04 International Business Machines Corporation Thermoelectric cooling apparatus and method for maximizing energy transport
US6563039B2 (en) * 2000-01-19 2003-05-13 California Institute Of Technology Thermoelectric unicouple used for power generation
US6505468B2 (en) * 2000-03-21 2003-01-14 Research Triangle Institute Cascade cryogenic thermoelectric cooler for cryogenic and room temperature applications
JP2002111080A (ja) * 2000-09-29 2002-04-12 Matsushita Electric Works Ltd ペルチェモジュール及びその製造方法
WO2002029908A1 (en) * 2000-10-04 2002-04-11 Leonardo Technologies, Inc. Thermoelectric generators
JP3613237B2 (ja) * 2000-12-01 2005-01-26 ヤマハ株式会社 熱電モジュール
US6608250B2 (en) * 2000-12-07 2003-08-19 International Business Machines Corporation Enhanced interface thermoelectric coolers using etched thermoelectric material tips
JP2004534386A (ja) 2001-04-09 2004-11-11 リサーチ・トライアングル・インスティチュート Ｄｎａゲノムチップ、プロテオームチップ、熱光スイッチング回路および赤外線タグ用薄膜熱電加熱冷却装置
US6800933B1 (en) 2001-04-23 2004-10-05 Advanced Micro Devices, Inc. Integrated circuit cooling device
US7342169B2 (en) * 2001-10-05 2008-03-11 Nextreme Thermal Solutions Phonon-blocking, electron-transmitting low-dimensional structures
AU2003230920A1 (en) * 2002-04-15 2003-11-03 Nextreme Thermal Solutions, Inc. Thermoelectric device utilizing double-sided peltier junctions and method of making the device
US6679064B2 (en) 2002-05-13 2004-01-20 Taiwan Semiconductor Manufacturing Co., Ltd Wafer transfer system with temperature control apparatus
WO2004049463A1 (en) 2002-11-25 2004-06-10 Nextreme Thermal Solutions Trans-thermoelectric device
EP1756881A4 (en) 2003-12-11 2011-03-09 Nextreme Thermal Solutions THERMOELECTRIC THIN FILM ELEMENTS FOR CURRENT CONVERSION AND COOLING
JP4446809B2 (ja) * 2004-06-18 2010-04-07 株式会社ニフコ ロック機構
US8063298B2 (en) 2004-10-22 2011-11-22 Nextreme Thermal Solutions, Inc. Methods of forming embedded thermoelectric coolers with adjacent thermally conductive fields
US7523617B2 (en) 2004-10-22 2009-04-28 Nextreme Thermal Solutions, Inc. Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics
WO2006110858A2 (en) 2005-04-12 2006-10-19 Nextreme Thermal Solutions Methods of forming thermoelectric devices including superlattice structures and related devices
WO2007002342A2 (en) 2005-06-22 2007-01-04 Nextreme Thermal Solutions Methods of forming thermoelectric devices including electrically insulating matrixes between conductive traces and related structures
US8623687B2 (en) 2005-06-22 2014-01-07 Nextreme Thermal Solutions, Inc. Methods of forming thermoelectric devices including conductive posts and/or different solder materials and related methods and structures
WO2007103249A2 (en) 2006-03-03 2007-09-13 Nextreme Thermal Solutions Methods of forming thermoelectric devices using islands of thermoelectric material and related structures

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220151080A (ko) 2021-05-04 2022-11-14 주식회사 이노와이어리스 무선 이어폰의 오디오 품질 측정 시스템

Also Published As

Publication number Publication date
EP1579512A1 (en) 2005-09-28
US20060225773A1 (en) 2006-10-12
US7838760B2 (en) 2010-11-23
AU2003293034A1 (en) 2004-06-18
WO2004049463B1 (en) 2004-09-10
WO2004049463A1 (en) 2004-06-10
JP2006507690A (ja) 2006-03-02
EP1579512A4 (en) 2008-11-19

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20050524

Patent event code: PA01051R01D

Comment text: International Patent Application

N231 Notification of change of applicant
PN2301 Change of applicant

Patent event date: 20050811

Comment text: Notification of Change of Applicant

Patent event code: PN23011R01D

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid