JP2006507690A5 - - Google Patents
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- Publication number
- JP2006507690A5 JP2006507690A5 JP2004555717A JP2004555717A JP2006507690A5 JP 2006507690 A5 JP2006507690 A5 JP 2006507690A5 JP 2004555717 A JP2004555717 A JP 2004555717A JP 2004555717 A JP2004555717 A JP 2004555717A JP 2006507690 A5 JP2006507690 A5 JP 2006507690A5
- Authority
- JP
- Japan
- Prior art keywords
- thermoelectric device
- legs
- unipolar
- pair
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims 10
- 238000000034 method Methods 0.000 claims 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 5
- 229910002665 PbTe Inorganic materials 0.000 claims 4
- 238000006243 chemical reaction Methods 0.000 claims 4
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical compound [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 claims 4
- 239000012530 fluid Substances 0.000 claims 3
- 239000011810 insulating material Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 238000001816 cooling Methods 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 239000002096 quantum dot Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US42875302P | 2002-11-25 | 2002-11-25 | |
| PCT/US2003/037633 WO2004049463A1 (en) | 2002-11-25 | 2003-11-25 | Trans-thermoelectric device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006507690A JP2006507690A (ja) | 2006-03-02 |
| JP2006507690A5 true JP2006507690A5 (https=) | 2007-01-25 |
Family
ID=32393453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004555717A Pending JP2006507690A (ja) | 2002-11-25 | 2003-11-25 | トランス熱電装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7838760B2 (https=) |
| EP (1) | EP1579512A4 (https=) |
| JP (1) | JP2006507690A (https=) |
| KR (1) | KR20050116362A (https=) |
| AU (1) | AU2003293034A1 (https=) |
| WO (1) | WO2004049463A1 (https=) |
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004049463A1 (en) | 2002-11-25 | 2004-06-10 | Nextreme Thermal Solutions | Trans-thermoelectric device |
| WO2005124881A1 (ja) * | 2004-06-22 | 2005-12-29 | Aruze Corp. | 熱電変換素子 |
| US7868242B2 (en) | 2004-07-01 | 2011-01-11 | Universal Entertainment Corporation | Thermoelectric conversion module |
| US7587901B2 (en) | 2004-12-20 | 2009-09-15 | Amerigon Incorporated | Control system for thermal module in vehicle |
| EP1796182A1 (en) * | 2005-12-09 | 2007-06-13 | Corning SAS | Thermoelectric device |
| US20080087316A1 (en) | 2006-10-12 | 2008-04-17 | Masa Inaba | Thermoelectric device with internal sensor |
| EP2102564B1 (en) | 2007-01-10 | 2015-09-02 | Gentherm Incorporated | Thermoelectric device |
| US7877827B2 (en) | 2007-09-10 | 2011-02-01 | Amerigon Incorporated | Operational control schemes for ventilated seat or bed assemblies |
| KR101779870B1 (ko) | 2008-02-01 | 2017-10-10 | 젠썸 인코포레이티드 | 열전 소자용 응결 센서 및 습도 센서 |
| US20090199887A1 (en) * | 2008-02-08 | 2009-08-13 | North Carolina State University And Nextreme Thermal Solutions, Inc. | Methods of forming thermoelectric devices including epitaxial thermoelectric elements of different conductivity types on a same substrate and related structures |
| US20090205696A1 (en) * | 2008-02-15 | 2009-08-20 | Nextreme Thermal Solutions, Inc. | Thermoelectric Heat Pumps Providing Active Thermal Barriers and Related Devices and Methods |
| CN101566506B (zh) * | 2008-04-22 | 2013-07-03 | 中国计量学院 | 一种基于微型桥谐振器的薄膜热电变换器的结构及制作方法 |
| JP5997899B2 (ja) | 2008-07-18 | 2016-09-28 | ジェンサーム インコーポレイテッドGentherm Incorporated | 空調されるベッドアセンブリ |
| US8525016B2 (en) | 2009-04-02 | 2013-09-03 | Nextreme Thermal Solutions, Inc. | Thermoelectric devices including thermoelectric elements having off-set metal pads and related structures, methods, and systems |
| US9601677B2 (en) | 2010-03-15 | 2017-03-21 | Laird Durham, Inc. | Thermoelectric (TE) devices/structures including thermoelectric elements with exposed major surfaces |
| US9476617B2 (en) * | 2010-10-04 | 2016-10-25 | Basf Se | Thermoelectric modules for an exhaust system |
| GB2484486A (en) * | 2010-10-12 | 2012-04-18 | Oclaro Technology Ltd | Component Temperature Control |
| CN103918095B (zh) * | 2011-09-08 | 2017-03-22 | 耶德研究和发展有限公司 | 效率增强的热电装置 |
| WO2013052823A1 (en) | 2011-10-07 | 2013-04-11 | Gentherm Incorporated | Thermoelectric device controls and methods |
| US9989267B2 (en) | 2012-02-10 | 2018-06-05 | Gentherm Incorporated | Moisture abatement in heating operation of climate controlled systems |
| US9506675B1 (en) | 2013-09-23 | 2016-11-29 | Geoffrey O. Campbell | Thermoelectric coolers with asymmetric conductance |
| US9662962B2 (en) | 2013-11-05 | 2017-05-30 | Gentherm Incorporated | Vehicle headliner assembly for zonal comfort |
| JP6269352B2 (ja) * | 2013-12-16 | 2018-01-31 | 住友電気工業株式会社 | 熱電材料、熱電モジュール、光センサおよび熱電材料の製造方法 |
| KR102252584B1 (ko) | 2014-02-14 | 2021-05-14 | 젠썸 인코포레이티드 | 전도식 대류식 기온 제어 조립체 |
| US10634396B2 (en) | 2014-05-23 | 2020-04-28 | Laird Thermal Systems, Inc. | Thermoelectric heating/cooling devices including resistive heaters |
| US11033058B2 (en) | 2014-11-14 | 2021-06-15 | Gentherm Incorporated | Heating and cooling technologies |
| US11639816B2 (en) | 2014-11-14 | 2023-05-02 | Gentherm Incorporated | Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system |
| US11857004B2 (en) | 2014-11-14 | 2024-01-02 | Gentherm Incorporated | Heating and cooling technologies |
| US12181351B2 (en) | 2018-02-28 | 2024-12-31 | Arthur Beckman | Thermopile assembly providing a massive electrical series of wire thermocouple elements |
| US11289756B2 (en) * | 2018-05-18 | 2022-03-29 | The Johns Hopkins University | Active thermal management of battery cells via thermoelectrics |
| US11223004B2 (en) | 2018-07-30 | 2022-01-11 | Gentherm Incorporated | Thermoelectric device having a polymeric coating |
| CN121230238A (zh) | 2018-11-30 | 2025-12-30 | 金瑟姆股份公司 | 热电调节系统和方法 |
| US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
| EP4026176A4 (en) | 2019-09-04 | 2023-09-13 | LG Innotek Co., Ltd. | Thermoelectric module |
| CN111739881B (zh) * | 2020-08-03 | 2020-11-20 | 上海南麟集成电路有限公司 | 一种基于mems热电堆的可见光收发集成器件及其制作方法 |
| US12552223B2 (en) | 2021-03-18 | 2026-02-17 | Gentherm Incorporated | Optimal control of convective thermal devices |
| US12611909B2 (en) | 2021-03-18 | 2026-04-28 | Gentherm Incorporated | Preconditioning surfaces using intelligent thermal effectors |
| KR102532925B1 (ko) | 2021-05-04 | 2023-05-19 | 주식회사 이노와이어리스 | 무선 이어폰의 오디오 품질 측정 시스템 |
| US12119285B2 (en) * | 2021-09-03 | 2024-10-15 | Microsoft Technology Licensing, Llc | Image sensor with actively cooled sensor array |
| CN116692763B (zh) * | 2023-04-23 | 2026-04-17 | 东南大学 | 一种基于mems热桥器件的热三级管 |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US3615870A (en) * | 1968-09-04 | 1971-10-26 | Rca Corp | Thermoelement array connecting apparatus |
| JPS63253677A (ja) * | 1987-04-10 | 1988-10-20 | Nippon Inter Electronics Corp | 多層熱電変換装置 |
| US5228923A (en) | 1991-12-13 | 1993-07-20 | Implemed, Inc. | Cylindrical thermoelectric cells |
| US5415699A (en) * | 1993-01-12 | 1995-05-16 | Massachusetts Institute Of Technology | Superlattice structures particularly suitable for use as thermoelectric cooling materials |
| US5837929A (en) * | 1994-07-05 | 1998-11-17 | Mantron, Inc. | Microelectronic thermoelectric device and systems incorporating such device |
| JPH08125237A (ja) | 1994-10-28 | 1996-05-17 | Aisin Seiki Co Ltd | 熱電素子 |
| DE69735589T2 (de) | 1996-05-28 | 2007-01-04 | Matsushita Electric Works, Ltd., Kadoma | Herstellungsverfahren für einen thermoelektrischen modul |
| JPH1070315A (ja) * | 1996-08-26 | 1998-03-10 | Osaka Gas Co Ltd | 熱電材料の製造方法 |
| US6300150B1 (en) | 1997-03-31 | 2001-10-09 | Research Triangle Institute | Thin-film thermoelectric device and fabrication method of same |
| US5936193A (en) | 1997-05-09 | 1999-08-10 | Parise; Ronald J. | Nighttime solar cell |
| JPH11121816A (ja) * | 1997-10-21 | 1999-04-30 | Morikkusu Kk | 熱電モジュールユニット |
| US6100463A (en) * | 1997-11-18 | 2000-08-08 | The Boeing Company | Method for making advanced thermoelectric devices |
| US6586835B1 (en) | 1998-08-31 | 2003-07-01 | Micron Technology, Inc. | Compact system module with built-in thermoelectric cooling |
| IT1309710B1 (it) * | 1999-02-19 | 2002-01-30 | Pastorino Giorgio | Dispositivo termoelettrico a stato solido |
| US6282907B1 (en) * | 1999-12-09 | 2001-09-04 | International Business Machines Corporation | Thermoelectric cooling apparatus and method for maximizing energy transport |
| US6563039B2 (en) * | 2000-01-19 | 2003-05-13 | California Institute Of Technology | Thermoelectric unicouple used for power generation |
| US6505468B2 (en) * | 2000-03-21 | 2003-01-14 | Research Triangle Institute | Cascade cryogenic thermoelectric cooler for cryogenic and room temperature applications |
| JP2002111080A (ja) * | 2000-09-29 | 2002-04-12 | Matsushita Electric Works Ltd | ペルチェモジュール及びその製造方法 |
| WO2002029908A1 (en) * | 2000-10-04 | 2002-04-11 | Leonardo Technologies, Inc. | Thermoelectric generators |
| JP3613237B2 (ja) * | 2000-12-01 | 2005-01-26 | ヤマハ株式会社 | 熱電モジュール |
| US6608250B2 (en) * | 2000-12-07 | 2003-08-19 | International Business Machines Corporation | Enhanced interface thermoelectric coolers using etched thermoelectric material tips |
| JP2004534386A (ja) | 2001-04-09 | 2004-11-11 | リサーチ・トライアングル・インスティチュート | Dnaゲノムチップ、プロテオームチップ、熱光スイッチング回路および赤外線タグ用薄膜熱電加熱冷却装置 |
| US6800933B1 (en) | 2001-04-23 | 2004-10-05 | Advanced Micro Devices, Inc. | Integrated circuit cooling device |
| US7342169B2 (en) * | 2001-10-05 | 2008-03-11 | Nextreme Thermal Solutions | Phonon-blocking, electron-transmitting low-dimensional structures |
| AU2003230920A1 (en) * | 2002-04-15 | 2003-11-03 | Nextreme Thermal Solutions, Inc. | Thermoelectric device utilizing double-sided peltier junctions and method of making the device |
| US6679064B2 (en) | 2002-05-13 | 2004-01-20 | Taiwan Semiconductor Manufacturing Co., Ltd | Wafer transfer system with temperature control apparatus |
| WO2004049463A1 (en) | 2002-11-25 | 2004-06-10 | Nextreme Thermal Solutions | Trans-thermoelectric device |
| EP1756881A4 (en) | 2003-12-11 | 2011-03-09 | Nextreme Thermal Solutions | THERMOELECTRIC THIN FILM ELEMENTS FOR CURRENT CONVERSION AND COOLING |
| JP4446809B2 (ja) * | 2004-06-18 | 2010-04-07 | 株式会社ニフコ | ロック機構 |
| US8063298B2 (en) | 2004-10-22 | 2011-11-22 | Nextreme Thermal Solutions, Inc. | Methods of forming embedded thermoelectric coolers with adjacent thermally conductive fields |
| US7523617B2 (en) | 2004-10-22 | 2009-04-28 | Nextreme Thermal Solutions, Inc. | Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics |
| WO2006110858A2 (en) | 2005-04-12 | 2006-10-19 | Nextreme Thermal Solutions | Methods of forming thermoelectric devices including superlattice structures and related devices |
| WO2007002342A2 (en) | 2005-06-22 | 2007-01-04 | Nextreme Thermal Solutions | Methods of forming thermoelectric devices including electrically insulating matrixes between conductive traces and related structures |
| US8623687B2 (en) | 2005-06-22 | 2014-01-07 | Nextreme Thermal Solutions, Inc. | Methods of forming thermoelectric devices including conductive posts and/or different solder materials and related methods and structures |
| WO2007103249A2 (en) | 2006-03-03 | 2007-09-13 | Nextreme Thermal Solutions | Methods of forming thermoelectric devices using islands of thermoelectric material and related structures |
-
2003
- 2003-11-25 WO PCT/US2003/037633 patent/WO2004049463A1/en not_active Ceased
- 2003-11-25 JP JP2004555717A patent/JP2006507690A/ja active Pending
- 2003-11-25 AU AU2003293034A patent/AU2003293034A1/en not_active Abandoned
- 2003-11-25 KR KR1020057009357A patent/KR20050116362A/ko not_active Withdrawn
- 2003-11-25 EP EP03790025A patent/EP1579512A4/en not_active Withdrawn
- 2003-11-25 US US10/536,463 patent/US7838760B2/en not_active Expired - Fee Related
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