JP4881919B2 - 熱電素子を有する熱電発電機 - Google Patents
熱電素子を有する熱電発電機 Download PDFInfo
- Publication number
- JP4881919B2 JP4881919B2 JP2008170129A JP2008170129A JP4881919B2 JP 4881919 B2 JP4881919 B2 JP 4881919B2 JP 2008170129 A JP2008170129 A JP 2008170129A JP 2008170129 A JP2008170129 A JP 2008170129A JP 4881919 B2 JP4881919 B2 JP 4881919B2
- Authority
- JP
- Japan
- Prior art keywords
- junction
- thermoelectric
- thermocouple
- temperature
- thermoelectric element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 claims description 60
- 239000004020 conductor Substances 0.000 claims description 28
- 239000013078 crystal Substances 0.000 claims description 2
- 230000007547 defect Effects 0.000 claims description 2
- 239000002800 charge carrier Substances 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 238000005036 potential barrier Methods 0.000 description 5
- 230000005284 excitation Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910002665 PbTe Inorganic materials 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical compound [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 description 2
- 230000005676 thermoelectric effect Effects 0.000 description 2
- 229910002899 Bi2Te3 Inorganic materials 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005421 electrostatic potential Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S10/00—PV power plants; Combinations of PV energy systems with other systems for the generation of electric power
- H02S10/10—PV power plants; Combinations of PV energy systems with other systems for the generation of electric power including a supplementary source of electric power, e.g. hybrid diesel-PV energy systems
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
熱電効果に重要な材料の性質(数式1中の、ゼーベック係数、比抵抗、熱伝導率)は、非常に限られた範囲でのみ相互に依存せず影響を及ぼすことができる。この関係により現在の実現可能の効率はカルノー効率の約10〜20%に限られている。
電流への熱の変換効率がより高くなる。
分類に対応する熱電素子と異なりサーモダイオードは直列に接続することができ、それによる効率損失がない。それによってより簡単に最大の理論効率を達成することができる。
この構造は電子によってのみ機能し、正孔のためのサーモダイオードがないため熱も流れ、それによって効率を低下させる電気導体を介して電流回路を閉じる必要がある。
運転温度はそれぞれの材料に応じて極度に高くすることができる。
類似の太陽電池の簡単な構造
電荷担体の再結合は完全に阻止することができず、それによって効率が低下する。
「熱電圧を発生させるための熱電対と、p側(4)およびn側(5)を有するpn接合(3)とを備える熱電素子と、熱源(9)と、ヒートシンク(10)と、を有する熱電発電機であって、
前記熱電素子は、正のゼーベック係数をもつ第1の材料(1)と、負のゼーベック係数をもつ第2の材料(2)とを有しており、
第1の材料(1)が第1の導体を介して選択的にpn接合(3)のp側(4)と接触し、かつ第2の材料(2)が第2の導体を介して選択的にpn接合(3)のn側(5)と接触しており、
前記熱電対が熱源(9)とヒートシンク(10)とに熱的に接続されており、かつ前記熱電圧が前記第1および第2の導体を介してpn接合(3)を電気的に逆方向へ極性化し、
熱源(9)およびヒートシンク(10)はそれぞれpn接合(3)のp側(4)およびn側(5)から空間的に分離されていることを特徴とする熱電発電機」
である。
電子正孔対の発生によりドーピングによって付与されるよりも多くの電荷担体を発生させることができる。それによってより高い出力密度と効率を達成することができる。
1.電流への温度差の直接変換用の熱電発電機。このコンセプトによって、発生してもそれ以外は利用されないままになり得る残熱を利用することができる。
としたものであるが、ここで採用している熱電素子は、これを適用できる他の大きい分野として、以下の2つがある:
2.熱電冷却器:電流の流れによって一方の端部は高温になり、他方の端部は低温になる。この効果は能動的冷却(低い温度の達成または熱の排出)に使用することができる。
3.効率的な受動的冷却のために、たとえば空気調節装置または(パワー)エレクトロニクスに利用できる増幅された熱伝導率。
2 第2の材料
3 pn接合
4 p側
5 n側
6 電気導体
7 電気導体
8 ダイオード
9 熱源
10 ヒートシンク
11 コンタクト(カソード)
12 コンタクト(アノード)
13 中間層
14・15 熱源
16 絶縁層
17 電気導体
61〜63 電気導体
71〜73 電気導体
Tcold 一方の端部(冷却)
Thot 他端部(加熱)
Claims (4)
- 熱電圧を発生させるための熱電対と、p側およびn側を有するpn接合とを備える熱電素子と、熱源と、ヒートシンクと、を有する熱電発電機であって、
前記熱電素子は、正のゼーベック係数をもつ第1の材料と、負のゼーベック係数をもつ第2の材料とを有しており、
前記第1の材料が第1の導体を介して選択的にpn接合のp側と接触し、かつ前記第2の材料が第2の導体を介して選択的にpn接合のn側と接触しており、
前記熱電対が前記熱源とヒートシンクとに熱的に接続されており、かつ前記熱電圧が前記第1および第2の導体を介してpn接合を電気的に逆方向へ極性化し、
前記熱源および前記ヒートシンクはそれぞれpn接合のp側およびn側から空間的に分離されていることを特徴とする熱電発電機。 - 前記熱電対およびpn接合が相互に導体によってのみ電気的に接続されていることを特徴とする請求項1に記載の熱電発電機。
- 前記pn接合がドーピングされていることを特徴とする請求項1ないし2のいずれか1項に記載の熱電発電機。
- 前記pn接合が結晶欠陥を有することを特徴とする請求項1ないし3のいずれか1項に記載の熱電発電機。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ATA1009/2007 | 2007-06-29 | ||
AT0100907A AT505168B1 (de) | 2007-06-29 | 2007-06-29 | Thermoelektrisches element |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009016831A JP2009016831A (ja) | 2009-01-22 |
JP4881919B2 true JP4881919B2 (ja) | 2012-02-22 |
Family
ID=39790321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008170129A Expired - Fee Related JP4881919B2 (ja) | 2007-06-29 | 2008-06-30 | 熱電素子を有する熱電発電機 |
Country Status (8)
Country | Link |
---|---|
US (2) | US8373057B2 (ja) |
EP (1) | EP2009709B1 (ja) |
JP (1) | JP4881919B2 (ja) |
KR (1) | KR101175386B1 (ja) |
CN (1) | CN101335324B (ja) |
AT (1) | AT505168B1 (ja) |
ES (1) | ES2531161T3 (ja) |
RU (1) | RU2419919C2 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT508277B1 (de) * | 2009-06-09 | 2011-09-15 | Avl List Gmbh | Thermoelektrisches modul mit paarweise angeordneten p- und n- dotierten schenkeln |
FR2963165A1 (fr) * | 2010-07-22 | 2012-01-27 | St Microelectronics Crolles 2 | Procede de generation d'energie electrique dans un dispositif semi-conducteur, et dispositif correspondant |
CN102130076B (zh) * | 2010-12-25 | 2012-05-30 | 紫光股份有限公司 | 一种热电式计算机芯片散热器 |
RU2444814C1 (ru) * | 2011-03-29 | 2012-03-10 | Юрий Феликсович Верниковский | Термоэлектрический кластер, способ его работы, устройство соединения в нем активного элемента с теплоэлектропроводом, генератор (варианты) и тепловой насос (варианты) на его основе |
DE102011001653A1 (de) * | 2011-03-30 | 2012-10-04 | O-Flexx Technologies Gmbh | Thermoelektrische Anordnung |
CN102306701B (zh) * | 2011-09-22 | 2013-05-08 | 华南理工大学 | 一种长程集中冷却动力热电偶转换元件 |
US8796535B2 (en) * | 2011-09-30 | 2014-08-05 | Sunpower Corporation | Thermal tracking for solar systems |
KR20130072694A (ko) * | 2011-12-22 | 2013-07-02 | 한국전자통신연구원 | 열전소자 및 그 제조 방법 |
US9081030B2 (en) | 2013-06-10 | 2015-07-14 | Korea Advanced Institute Of Science And Technology | Computer-aided simulation method for atomic-resolution scanning seebeck microscope (SSM) images |
CN104602484B (zh) * | 2013-10-31 | 2017-04-26 | 展讯通信(上海)有限公司 | 便携式设备及其散热装置 |
CN103701186B (zh) * | 2013-12-19 | 2015-08-12 | 北京京东方光电科技有限公司 | 移动通信终端 |
RU2584143C2 (ru) * | 2014-04-15 | 2016-05-20 | Акционерное общество "Научно-производственный центр "Полюс" (АО "НПЦ "Полюс") | Способ отвода тепла от мощных эри, электронных узлов, блоков и модулей и устройство для его осуществления |
ITUA20164656A1 (it) * | 2016-06-06 | 2017-12-06 | Maria Longo | Trasduttore termoelettrico di composizione mista. |
US9773717B1 (en) | 2016-08-22 | 2017-09-26 | Globalfoundries Inc. | Integrated circuits with peltier cooling provided by back-end wiring |
IL248115A0 (en) * | 2016-09-28 | 2017-01-31 | Yeda Res & Dev | Thermoelectric device |
WO2020129539A1 (ja) * | 2018-12-19 | 2020-06-25 | 国立研究開発法人産業技術総合研究所 | 太陽電池および熱電変換素子を有する複合発電装置 |
CN113838944B (zh) * | 2021-08-27 | 2024-06-21 | 中国华能集团清洁能源技术研究院有限公司 | 集成式热光伏电池 |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL251789A (ja) * | 1959-05-26 | 1900-01-01 | ||
US3076861A (en) * | 1959-06-30 | 1963-02-05 | Space Technology Lab Inc | Electromagnetic radiation converter |
JPS5148037B2 (ja) * | 1974-02-26 | 1976-12-18 | ||
JPS50134391A (ja) * | 1974-04-09 | 1975-10-24 | ||
JPS57115877A (en) * | 1981-01-09 | 1982-07-19 | Mitsubishi Electric Corp | Combined element of semiconductor photocell and thermal generator |
JPS58213479A (ja) * | 1982-06-04 | 1983-12-12 | Futaba Corp | エネルギ−変換素子 |
JPS61284976A (ja) * | 1985-06-11 | 1986-12-15 | Tohoku Metal Ind Ltd | 熱電気変換素子 |
NL8801093A (nl) * | 1988-04-27 | 1989-11-16 | Theodorus Bijvoets | Thermo-electrische inrichting. |
DE3835279A1 (de) * | 1988-10-15 | 1990-04-19 | Willi Schickedanz | Energiequelle mit einem photovoltaischen element |
JPH04280482A (ja) * | 1991-03-08 | 1992-10-06 | Oki Electric Ind Co Ltd | 太陽光を利用した冷却素子 |
DE69218102T2 (de) * | 1991-10-22 | 1997-10-09 | Canon Kk | Photovoltaisches Bauelement |
US6084175A (en) * | 1993-05-20 | 2000-07-04 | Amoco/Enron Solar | Front contact trenches for polycrystalline photovoltaic devices and semi-conductor devices with buried contacts |
US5716480A (en) * | 1995-07-13 | 1998-02-10 | Canon Kabushiki Kaisha | Photovoltaic device and method of manufacturing the same |
US5929440A (en) * | 1996-10-25 | 1999-07-27 | Hypres, Inc. | Electromagnetic radiation detector |
DE19704944A1 (de) * | 1997-02-10 | 1998-08-20 | Hans K Seibold | Effektivitätsverstärker für thermoelektrische Energiewandler |
JPH11135846A (ja) * | 1997-10-31 | 1999-05-21 | Fujitsu Ltd | 半導体を用いた熱電装置 |
US6256092B1 (en) * | 1997-11-28 | 2001-07-03 | Hitachi, Ltd. | Defect inspection apparatus for silicon wafer |
JP4208281B2 (ja) * | 1998-02-26 | 2009-01-14 | キヤノン株式会社 | 積層型光起電力素子 |
DE19927604A1 (de) * | 1999-06-17 | 2000-12-21 | Bayer Ag | Silicium mit strukturierter Sauerstoffdotierung, dessen Herstellung und Verwendung |
AT410492B (de) | 2000-05-02 | 2003-05-26 | Span Gerhard Dipl Ing Dr | Thermoelektrisches element mit mindestens einer n-schicht und mindestens einer p-schicht |
DE10136667C2 (de) * | 2001-07-27 | 2003-06-18 | Oliver Eibl | Peltierschenkel mit integrierter Diode |
JP2003069088A (ja) * | 2001-08-30 | 2003-03-07 | Fujitsu Ltd | 半導体装置及びその駆動方法 |
US7400050B2 (en) * | 2001-12-12 | 2008-07-15 | Hi-Z Technology, Inc. | Quantum well thermoelectric power source |
US20040155251A1 (en) * | 2003-02-07 | 2004-08-12 | Vladimir Abramov | Peltier cooler integrated with electronic device(s) |
US20040177876A1 (en) * | 2003-03-10 | 2004-09-16 | Enhanced Energy Systems, Inc. | Spatially optimized thermoelectric module |
JP4118187B2 (ja) * | 2003-05-09 | 2008-07-16 | 信越半導体株式会社 | 太陽電池の製造方法 |
JP2005228915A (ja) | 2004-02-13 | 2005-08-25 | Toshiaki Eto | セパレート型ペルチェシステム |
JP2005268284A (ja) | 2004-03-16 | 2005-09-29 | Toshiba Corp | 熱電変換モジュール、熱電変換装置 |
US20060090787A1 (en) * | 2004-10-28 | 2006-05-04 | Onvural O R | Thermoelectric alternators and thermoelectric climate control devices with controlled current flow for motor vehicles |
JP2007165463A (ja) | 2005-12-12 | 2007-06-28 | Osamu Yamashita | 熱電変換素子並びに発電用モジュール |
JP4667406B2 (ja) * | 2006-03-30 | 2011-04-13 | 三洋電機株式会社 | 太陽電池モジュール及びその製造方法 |
US8334450B2 (en) * | 2006-09-04 | 2012-12-18 | Micallef Joseph A | Seebeck solar cell |
-
2007
- 2007-06-29 AT AT0100907A patent/AT505168B1/de not_active IP Right Cessation
-
2008
- 2008-06-19 ES ES08011099T patent/ES2531161T3/es active Active
- 2008-06-19 EP EP08011099.2A patent/EP2009709B1/de not_active Not-in-force
- 2008-06-27 KR KR1020080061537A patent/KR101175386B1/ko not_active IP Right Cessation
- 2008-06-27 CN CN2008101289899A patent/CN101335324B/zh not_active Expired - Fee Related
- 2008-06-27 RU RU2008126318/28A patent/RU2419919C2/ru not_active IP Right Cessation
- 2008-06-27 US US12/216,031 patent/US8373057B2/en active Active
- 2008-06-30 JP JP2008170129A patent/JP4881919B2/ja not_active Expired - Fee Related
-
2012
- 2012-10-18 US US13/654,592 patent/US8766083B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
RU2419919C2 (ru) | 2011-05-27 |
RU2008126318A (ru) | 2010-01-10 |
US8766083B2 (en) | 2014-07-01 |
KR101175386B1 (ko) | 2012-08-20 |
US20130042900A1 (en) | 2013-02-21 |
KR20090003124A (ko) | 2009-01-09 |
EP2009709A2 (de) | 2008-12-31 |
ES2531161T3 (es) | 2015-03-11 |
US8373057B2 (en) | 2013-02-12 |
US20090014047A1 (en) | 2009-01-15 |
AT505168B1 (de) | 2008-11-15 |
EP2009709B1 (de) | 2014-11-26 |
CN101335324A (zh) | 2008-12-31 |
AT505168A4 (de) | 2008-11-15 |
JP2009016831A (ja) | 2009-01-22 |
EP2009709A3 (de) | 2011-05-18 |
CN101335324B (zh) | 2012-04-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4881919B2 (ja) | 熱電素子を有する熱電発電機 | |
US10305014B2 (en) | Methods and devices for controlling thermal conductivity and thermoelectric power of semiconductor nanowires | |
US6762484B2 (en) | Thermoelectric element | |
US20040177876A1 (en) | Spatially optimized thermoelectric module | |
US20100193000A1 (en) | Thermoelectric generator for converting thermal energy into electrical energy | |
US20060185710A1 (en) | High performance thermoelectric nanocomposite device | |
RU2008148931A (ru) | Низкоразмерные термоэлектрики, изготовленные травлением полупроводниковых пластин | |
JP6949850B2 (ja) | 熱電変換材料、熱電変換素子および熱電変換モジュール | |
US20040177877A1 (en) | Geometrically optimized thermoelectric module | |
US20120031450A1 (en) | Thermoelectric semiconductor component | |
KR20120080820A (ko) | 열전모듈 | |
JP6976631B2 (ja) | 熱電モジュールおよび熱電発電装置 | |
Lee | Thermoelectric Generators | |
KR101046130B1 (ko) | 열전소자 | |
US11011692B2 (en) | Thermoelectric device utilizing non-zero berry curvature | |
KR20110136619A (ko) | 이종 열전소자를 구비한 열전모듈 | |
KR101552784B1 (ko) | 열전 발전 장치 및 시스템 | |
KR102549143B1 (ko) | 반도체 열전 발전기 | |
KR102673621B1 (ko) | 발전용 박막열전소자 | |
US10062825B2 (en) | Thermo-electric generator module | |
Sil et al. | Design optimization of CMOS thermoelectric energy harvester for high thermoelectric efficiency | |
Goldsmid et al. | Thermionic Energy Conversion | |
KR20130061942A (ko) | 열전지수 향상을 위한 클래딩된 나노선을 이용한 열전 소자 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090729 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100330 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100406 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20100630 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20100705 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100726 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110621 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110913 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20111108 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20111205 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 4881919 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20141209 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |