JP2006505919A5 - - Google Patents
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- Publication number
- JP2006505919A5 JP2006505919A5 JP2003572090A JP2003572090A JP2006505919A5 JP 2006505919 A5 JP2006505919 A5 JP 2006505919A5 JP 2003572090 A JP2003572090 A JP 2003572090A JP 2003572090 A JP2003572090 A JP 2003572090A JP 2006505919 A5 JP2006505919 A5 JP 2006505919A5
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- strut
- platform
- vias
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 26
- 239000004020 conductor Substances 0.000 claims 20
- 239000000463 material Substances 0.000 claims 16
- 239000003990 capacitor Substances 0.000 claims 15
- 238000012360 testing method Methods 0.000 claims 11
- 239000000758 substrate Substances 0.000 claims 10
- 239000000969 carrier Substances 0.000 claims 9
- 238000010030 laminating Methods 0.000 claims 8
- 239000000945 filler Substances 0.000 claims 6
- 238000004458 analytical method Methods 0.000 claims 4
- 239000011231 conductive filler Substances 0.000 claims 4
- 230000002093 peripheral effect Effects 0.000 claims 4
- 238000007747 plating Methods 0.000 claims 4
- 239000012811 non-conductive material Substances 0.000 claims 2
- 238000003491 array Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 claims 1
- 239000002243 precursor Substances 0.000 claims 1
- 239000000523 sample Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US36047302P | 2002-02-26 | 2002-02-26 | |
| PCT/US2003/005359 WO2003073506A2 (en) | 2002-02-26 | 2003-02-21 | A modular integrated circuit chip carrier |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006044465A Division JP2006186391A (ja) | 2002-02-26 | 2006-02-21 | モジュール式集積回路チップキャリア |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006505919A JP2006505919A (ja) | 2006-02-16 |
| JP2006505919A5 true JP2006505919A5 (enExample) | 2006-04-13 |
Family
ID=27766230
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003572090A Pending JP2006505919A (ja) | 2002-02-26 | 2003-02-21 | モジュール式集積回路チップキャリア |
| JP2006044465A Pending JP2006186391A (ja) | 2002-02-26 | 2006-02-21 | モジュール式集積回路チップキャリア |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006044465A Pending JP2006186391A (ja) | 2002-02-26 | 2006-02-21 | モジュール式集積回路チップキャリア |
Country Status (9)
| Country | Link |
|---|---|
| EP (1) | EP1481424B1 (enExample) |
| JP (2) | JP2006505919A (enExample) |
| KR (1) | KR100980356B1 (enExample) |
| CN (1) | CN100481444C (enExample) |
| AU (1) | AU2003216362A1 (enExample) |
| ES (1) | ES2440770T3 (enExample) |
| MY (1) | MY135660A (enExample) |
| TW (1) | TWI282157B (enExample) |
| WO (1) | WO2003073506A2 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100378970C (zh) * | 2005-04-22 | 2008-04-02 | 北京中星微电子有限公司 | 多用负载板 |
| US10251273B2 (en) | 2008-09-08 | 2019-04-02 | Intel Corporation | Mainboard assembly including a package overlying a die directly attached to the mainboard |
| US8299809B2 (en) | 2009-09-21 | 2012-10-30 | International Business Machines Corporation | In-line characterization of a device under test |
| US8941221B2 (en) * | 2011-09-30 | 2015-01-27 | Mediatek Inc. | Semiconductor package |
| CN102569247A (zh) * | 2012-01-17 | 2012-07-11 | 华为终端有限公司 | 集成模块、集成系统板和电子设备 |
| US20140307391A1 (en) * | 2013-04-13 | 2014-10-16 | Infineon Technologies Ag | Three dimensional packaging |
| TWI591352B (zh) | 2013-06-07 | 2017-07-11 | 金士頓數位股份有限公司 | 測試裝置 |
| CN104681510A (zh) * | 2013-12-03 | 2015-06-03 | 晟碟信息科技（上海）有限公司 | 用于嵌入半导体裸片的桥结构 |
| CN106061232B (zh) * | 2016-06-27 | 2019-03-26 | 北京空间机电研究所 | 一种用于遥感相机多片ccd器件盲插的装置及盲插方法 |
| TWI719241B (zh) * | 2017-08-18 | 2021-02-21 | 景碩科技股份有限公司 | 可做電性測試的多層電路板及其製法 |
| CN108376674B (zh) * | 2018-05-04 | 2024-03-08 | 扬州扬杰电子科技股份有限公司 | 一种vdmos功率器件塑封防分层翘曲结构 |
| KR102151989B1 (ko) * | 2018-09-06 | 2020-09-04 | 주식회사 지로이아이 | Psr 적용 쓰루홀 타입 단면 인쇄회로기판 |
| KR102187538B1 (ko) * | 2018-09-17 | 2020-12-07 | 주식회사 지로이아이 | 쓰루홀 타입 단면형 인쇄회로기판 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5065227A (en) * | 1990-06-04 | 1991-11-12 | International Business Machines Corporation | Integrated circuit packaging using flexible substrate |
| US5579207A (en) * | 1994-10-20 | 1996-11-26 | Hughes Electronics | Three-dimensional integrated circuit stacking |
| CA2218307C (en) * | 1997-10-10 | 2006-01-03 | Gennum Corporation | Three dimensional packaging configuration for multi-chip module assembly |
| KR100266693B1 (ko) * | 1998-05-30 | 2000-09-15 | 김영환 | 적층가능한 비지에이 반도체 칩 패키지 및 그 제조방법 |
| US6313522B1 (en) * | 1998-08-28 | 2001-11-06 | Micron Technology, Inc. | Semiconductor structure having stacked semiconductor devices |
| MY144503A (en) * | 1998-09-14 | 2011-09-30 | Ibiden Co Ltd | Printed circuit board and method for its production |
| JP2003521810A (ja) | 1999-05-07 | 2003-07-15 | シーゲイト テクノロジー エルエルシー | 表面実装ｉｃ積層方法および装置 |
| WO2001048819A2 (en) * | 1999-12-28 | 2001-07-05 | Intel Corporation | Interconnect structure and method of fabrication therefor |
| JP2001210954A (ja) * | 2000-01-24 | 2001-08-03 | Ibiden Co Ltd | 多層基板 |
| US6487078B2 (en) * | 2000-03-13 | 2002-11-26 | Legacy Electronics, Inc. | Electronic module having a three dimensional array of carrier-mounted integrated circuit packages |
| US6404043B1 (en) * | 2000-06-21 | 2002-06-11 | Dense-Pac Microsystems, Inc. | Panel stacking of BGA devices to form three-dimensional modules |
-
2003
- 2003-02-21 KR KR1020047013372A patent/KR100980356B1/ko not_active Expired - Fee Related
- 2003-02-21 AU AU2003216362A patent/AU2003216362A1/en not_active Abandoned
- 2003-02-21 WO PCT/US2003/005359 patent/WO2003073506A2/en not_active Ceased
- 2003-02-21 ES ES03742896.8T patent/ES2440770T3/es not_active Expired - Lifetime
- 2003-02-21 EP EP03742896.8A patent/EP1481424B1/en not_active Expired - Lifetime
- 2003-02-21 JP JP2003572090A patent/JP2006505919A/ja active Pending
- 2003-02-21 CN CNB038093618A patent/CN100481444C/zh not_active Expired - Fee Related
- 2003-02-24 MY MYPI20030627A patent/MY135660A/en unknown
- 2003-02-26 TW TW092104108A patent/TWI282157B/zh not_active IP Right Cessation
-
2006
- 2006-02-21 JP JP2006044465A patent/JP2006186391A/ja active Pending
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