JPH11261179A5 - - Google Patents

Info

Publication number
JPH11261179A5
JPH11261179A5 JP1998334259A JP33425998A JPH11261179A5 JP H11261179 A5 JPH11261179 A5 JP H11261179A5 JP 1998334259 A JP1998334259 A JP 1998334259A JP 33425998 A JP33425998 A JP 33425998A JP H11261179 A5 JPH11261179 A5 JP H11261179A5
Authority
JP
Japan
Prior art keywords
image
ball grid
grid array
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP1998334259A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11261179A (ja
Filing date
Publication date
Priority claimed from US08/986,078 external-priority patent/US6040530A/en
Application filed filed Critical
Publication of JPH11261179A publication Critical patent/JPH11261179A/ja
Publication of JPH11261179A5 publication Critical patent/JPH11261179A5/ja
Withdrawn legal-status Critical Current

Links

JP10334259A 1997-12-05 1998-11-25 試験用プリント回路基板 Withdrawn JPH11261179A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/986,078 US6040530A (en) 1997-12-05 1997-12-05 Versatile printed circuit board for testing processing reliability
US986,078 1997-12-05

Publications (2)

Publication Number Publication Date
JPH11261179A JPH11261179A (ja) 1999-09-24
JPH11261179A5 true JPH11261179A5 (enExample) 2006-01-19

Family

ID=25532056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10334259A Withdrawn JPH11261179A (ja) 1997-12-05 1998-11-25 試験用プリント回路基板

Country Status (5)

Country Link
US (1) US6040530A (enExample)
EP (1) EP0926930B1 (enExample)
JP (1) JPH11261179A (enExample)
DE (1) DE69827754T2 (enExample)
SG (1) SG70122A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6662250B1 (en) * 2000-02-25 2003-12-09 Hewlett-Packard Development Company, L.P. Optimized routing strategy for multiple synchronous bus groups
US6564986B1 (en) * 2001-03-08 2003-05-20 Xilinx, Inc. Method and assembly for testing solder joint fractures between integrated circuit package and printed circuit board
JP3790175B2 (ja) * 2002-03-01 2006-06-28 株式会社アドバンテスト 基板異常検出回路付き装置
US6788092B2 (en) * 2002-04-15 2004-09-07 Advanced Semiconductor Engineering, Inc. Test assembly for integrated circuit package
US6888360B1 (en) * 2004-02-20 2005-05-03 Research In Motion Limited Surface mount technology evaluation board having varied board pad characteristics
EP1566995B1 (en) * 2004-02-20 2007-08-15 Research In Motion Limited Surface mount technology evaluation board
DE502005008223D1 (de) * 2004-07-09 2009-11-12 Diehl Aerospace Gmbh Leiterkarte mit Karbonisierungssensor
US9853007B2 (en) * 2014-12-30 2017-12-26 Microsemi Solutions (U.S.), Inc. Method for producing an integrated circuit package and apparatus produced thereby
US9698093B2 (en) * 2015-08-24 2017-07-04 Nxp Usa,Inc. Universal BGA substrate
WO2020170341A1 (ja) * 2019-02-19 2020-08-27 株式会社Ｆｕｊｉ 基準マーク特定装置、基準マーク特定方法
CN114863868B (zh) * 2022-03-27 2023-04-25 深圳市美矽微半导体有限公司 一种led载板及其显示设备
CN115968120A (zh) * 2023-02-21 2023-04-14 宏华胜精密电子(烟台)有限公司 一种水平线异物反沾检查方式

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3588616A (en) * 1969-01-24 1971-06-28 Sprague Electric Co Compensation substrate for dual in line package
US3964087A (en) * 1975-05-15 1976-06-15 Interdyne Company Resistor network for integrated circuit
US4426773A (en) * 1981-05-15 1984-01-24 General Electric Ceramics, Inc. Array of electronic packaging substrates
US4583150A (en) * 1983-01-21 1986-04-15 Methode Electronics, Inc. Printed circuit boards
US4725775A (en) * 1986-06-12 1988-02-16 Environmental Processing, Incorporated Resistor isolated burn-in socket board
US4926546A (en) * 1988-06-09 1990-05-22 A. O. Smith Corporation PC board panel configuration technique
JPH02197190A (ja) * 1989-01-26 1990-08-03 Shin Kobe Electric Mach Co Ltd 多層印刷配線板
ATE91059T1 (de) * 1989-08-17 1993-07-15 Schlegel Georg Gmbh & Co Elektrische leiterplatte.
US5561584A (en) * 1993-09-30 1996-10-01 Vimak Corporation Electrical ground plane apparatus
JP3037043B2 (ja) * 1993-10-29 2000-04-24 日本電気株式会社 プリント基板のテスト容易化回路実装方式
US5457390A (en) * 1993-12-13 1995-10-10 Northern Telecom Limited Circuit board manufacture
JPH07333300A (ja) * 1994-06-14 1995-12-22 Mitsubishi Electric Corp 電気特性評価用基板
JP2570637B2 (ja) * 1994-11-28 1997-01-08 日本電気株式会社 Ｍｃｍキャリア
US5761051A (en) * 1994-12-29 1998-06-02 Compaq Computer Corporation Multi-layer circuit board having a supply bus and discrete voltage supply planes
US5642262A (en) * 1995-02-23 1997-06-24 Altera Corporation High-density programmable logic device in a multi-chip module package with improved interconnect scheme
TW382736B (en) * 1996-04-18 2000-02-21 Eastern Kk Circuit board for a semiconductor device and method of making the same
US6612022B1 (en) * 1996-05-03 2003-09-02 Invensys Systems, Inc. Printed circuit board including removable auxiliary area with test points
US5896037A (en) * 1996-10-10 1999-04-20 Methode Electronics, Inc. Interface test adapter for actively testing an integrated circuit chip package

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