JP2006344910A - Method of dicing wafer and jig for dicing wafer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a dicing method for certainly dicing a wafer to a small chip, and a dicing jig adapted for this method. <P>SOLUTION: The wafer dicing method with the dicing jig that divides wafer 1 stuck on sheet 3 along a scheduled break apart line 2 with lattice-like shape makes the upper surface of dicing jig 10 contact and glide on the undersurface of a sheet 3 while locally carrying out vacuum suction of the sheet 3 by vacuum suction mouth 13 formed in the upper surface on the straight line. This vacuum suction force causing to generate bending stress concentrated on portion of a streak of the scheduled break apart line 2 of wafer 1 breaks apart and dices the wafer 1 from the scheduled break apart line 2. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a wafer dividing method and a dividing jig for subdividing a wafer in which chips such as a plurality of semiconductor elements are integrally formed for each chip.

  In the dicing process of the semiconductor manufacturing process, a stretchable sheet is attached to the back surface of a wafer (semiconductor wafer) in which a large number of chips such as semiconductor elements are integrally formed in a lattice arrangement, and the wafer surface is diced with a dicing wheel or the like. A groove (scheduled cutting line) is formed, and the wafer is divided into chips from the dicing groove. Also, in the bonding process of the semiconductor manufacturing process, the chips subdivided from the wafer in the dicing process are bonded to a base such as a lead frame. A die bonder is applied to the manufacturing equipment for this bonding process.

  The dicing process includes a laser dicing process in which dicing grooves are not formed on the wafer. In the laser dicing process, the laser beam is focused inside the wafer to form a linear modified region (scheduled line) due to cracking, melting, and other cracks, and in the subsequent process, the wafer is separated from the modified region for each chip. To divide. The modified region inside the wafer is easily separated from the modified region when a light external force is applied to the wafer (see, for example, Patent Document 1).

In addition, there is equipment using a die bonder expanding mechanism as equipment for subdividing the wafer into chips after forming the cutting lines of the modified region in a vertical and horizontal lattice pattern on the wafer in the laser dicing process. For example, as shown in FIG. 11A, the wafer 1 is attached to the surface of the central portion of the stretchable sheet 3 whose peripheral portion is supported by the support ring 4. The periphery of the sheet 3 is placed on a cylindrical expansion stage 5 and the support ring 4 is lowered to expand the sheet 3 radially 360 degrees around the wafer 1. As shown in FIG. 11B, this expand causes the wafer 1 on the center of the sheet to expand radially by 360 degrees, and tensile stress is generated in each modified region of the wafer 1. Each chip is divided from the lattice-shaped modified region. A large number of chips 1 ′ separated from the wafer 1 are radially expanded together with the sheet 3, and gaps are generated between the chips.
JP 2004-111601 A

  When the modified region is formed only inside the wafer by laser dicing, only the modified region with zero width is formed between the chips, and more chips can be formed on one wafer. It is easy to reduce the size to 25 mm square or the like. In addition, when a wafer in which a modified region is formed in a lattice shape is subdivided for each chip using an expanding mechanism, when the wafer is expanded on a sheet, the amount of expansion is smaller at the center of the wafer and the cleaving property is poor. . Therefore, in order to expand the central portion of the wafer well, a large expansion mechanism capable of expanding a large amount is required. This problem becomes more prominent as the size of the chip formed on one wafer is smaller and the number of the same chip is larger. Small chips such as 0.3 mm square and 0.25 mm square cannot be divided. It was difficult to improve chip yield. Further, the sheet is limited to a stretchable sheet that can be expanded, and cannot be applied to a wafer attached to a sheet that cannot be expanded, such as a PET material.

  The present invention has been made in view of such circumstances, and the object is to use a wafer dividing method corresponding to chip miniaturization and to subdivide a wafer into small chips using this dividing method. It is to provide a suitable dividing jig.

  The method of the present invention for achieving the above object is a wafer dividing method for dividing a wafer attached to a sheet along a planned cutting line formed on the wafer, and locally dividing the planned cutting line portion of the wafer through the sheet. Then, a bending stress is generated in the parting line part by vacuum suction, and the parting line part is cleaved by this bending stress.

  Here, the sheet is a non-expandable material such as a PET material that does not expand, in addition to the expandable exclusive sheet used in the expand mechanism of the existing die bonder and the expandable sheet used in the existing full cut dicing mechanism. Sex sheet can be applied. When expanding using an elastic sheet, the planned cutting line of the wafer is reliably cleaved by the bending stress generated by local vacuum suction and the tensile stress caused by the expansion of the elastic sheet. The chipping phenomenon in which the two split surfaces facing each other immediately after cleaving are separated from each other and the fractured surfaces immediately after cleaving rub against each other is avoided. When a non-stretchable sheet is used, the parting line portion of the wafer is cleaved by bending stress generated by local vacuum suction. In any of the sheets, the planned cutting line is formed on the wafer in a state where the wafer is bonded to the sheet, or the wafer on which the planned cutting line is formed is bonded to the sheet. As the wafer cutting line, a modified region formed inside the wafer by a laser dicing method, or a half-cut dicing groove formed by a dicing wheel or the like on the wafer front surface or back surface to the wafer back surface or near the surface can be applied. When a portion of the wafer's planned cutting line portion is vacuum-sucked through the sheet, bending stress is generated in the wafer thickness direction at the single cutting planned line portion. It is cleaved. The cleaving force due to such bending stress is stronger than the cleaving force due to the tensile stress generated by expanding the stretchable sheet to generate the cleaving line, and the wafer acts to concentrate on the cleaving line. It excels in wafer cleaving when subdividing into small chips, facilitates chip miniaturization, and can be expected to improve the yield of small chips. Moreover, the cutting line of the wafer can be formed so as not to be broken by a small external force. For example, when the planned cutting line of the wafer is a modified region, the modified region can be formed shallowly. In addition, when the planned cutting line of the wafer is a half-cut dicing groove, forming the groove shallowly prevents the wafer from being cut unintentionally before the chip is divided.

  Further, in the present invention, the wafer has a plurality of cutting lines scheduled in a vertical and horizontal grid pattern, and the vertical or horizontal cutting line portions of the wafer are divided by vacuum suction in order one by one. It is possible to divide the portion of the planned cutting line in the vertical direction by vacuum suction one line at a time.

  For example, in the case of dividing the wafer's vertical dividing line part by line, the means for locally vacuuming the wafer, the wafer and the sheet are moved relative to each other in the direction orthogonal to the vertical dividing line, and the vertical cutting line Cleave the pieces one by one. Next, the vacuum suction means and the wafer and the sheet are relatively rotated by 90 degrees, and the horizontal cutting line portion is cut one by one to subdivide the wafer into a large number of chips.

  Further, in the present invention, when a portion of the wafer planned cutting line portion is divided by vacuum suction, the pressing member can be pressed by a vacuum suction force to the portion of the wafer cutting planned line portion via the sheet.

  Here, the pressing member is a linear hard member that is longer than the planned cutting line, and a stepped portion provided on a work table on which a wafer sheet is placed (corresponding to a split jig to be described later) or on this work table. Attached squeegees, rods, etc. can be applied. It is desirable to form a planned cutting line on the surface opposite to the sheet on the wafer adhered to the sheet with which the pressing member abuts. When bending stress is generated by locally vacuuming a part of the wafer's cutting line, the pressing member comes into contact with the parting line part through the sheet, and the pressing member is cut by the vacuum suction force. If the part is pushed up and the parting line part is actively cleaved, the cleaving of the wafer becomes easy and reliable.

  Further, in the method of the present invention, it is also effective to divide the sheet with the sheets attached to both front and back surfaces. For example, a sheet is attached to the back surface of the wafer to form a cutting line on the surface of the wafer, and another sheet (hereinafter referred to as a cover sheet if necessary) is attached to the wafer surface before the division. . In this way, the wafer is cleaved by vacuum suction locally from the back sheet side. In this case, the cover sheet on the front surface side of the wafer suppresses the chip formed on the wafer from being pressed against the back sheet to be peeled off from the back sheet, and generates a tensile stress on the planned cutting line portion of the wafer. Make the cutting operation of the planned line part stable. Such a cover sheet is preferably an elastic sheet.

  In addition, the jig of the present invention for achieving the above object is a plurality of cutting schedule lines formed in a lattice shape on the surface opposite to the surface of the wafer attached to the wafer attached to the surface of the sheet. A wafer splitting jig that slidably contacts with the back surface of the sheet and holds the wafer via the sheet, and a length that is longer than the maximum length of the multiple cut lines on the wafer. Now formed on the holding surface, when a wafer is placed on the holding surface via a sheet, a linear pressing member that forms a gap between the holding surface and the sheet, and formed on the holding surface adjacent to this pressing member, A vacuum suction port is provided for evacuating the gap by performing a vacuum suction operation to locally vacuum-suck the wafer through the sheet.

  The wafer dividing jig here is like a suction stage having a vacuum suction port on the upper surface, and moves relative to the wafer and the sheet. For example, when used in combination with an expanding mechanism in which a wafer is bonded to an elastic sheet and the sheet is expanded, a wafer dividing jig is disposed below the expanded horizontal sheet so as to be movable in the horizontal direction. The upper surface of the split jig is a holding surface, which contacts and slides on the lower surface of the sheet and moves in the horizontal direction. The pressing member formed on the holding surface slides linearly against the lower surface of the sheet, and the vacuum suction port formed on the holding surface along the pressing member performs a vacuum suction operation to locally suck the sheet. Then, a bending stress is generated by vacuum-sucking a portion of the wafer's parting line to be cut locally.

  Here, the pressing member can be a stepped portion of a stepped portion including a stepped portion and a recessed step portion partially formed on the holding surface. In this case, a vacuum suction port can be formed in the concave step portion of the step portion.

  For example, the holding surface of the wafer split jig has an upper holding surface and a lower holding surface having a level difference of about the thickness of the wafer, and a step surface is formed between the upper holding surface and the lower holding surface. The convex step portion that is the boundary portion between the upper holding surface and the step surface becomes a linear pressing member, and a vacuum suction port is formed in the lower step holding surface at the concave step portion that is the boundary portion between the step surface and the lower step holding surface. For example, when the holding surface of the wafer dividing jig is brought into contact with the lower surface of the sheet expanded by the expanding mechanism and the vacuum suction port is operated by vacuum suction, the wafer is locally vacuum sucked through the sheet on the holding surface. Between the holding surface and the sheet, a gap in a vacuum suction state is generated at the stepped surface between the upper holding surface and the lower holding surface, and the convex step portion is strongly pressed against the lower surface of the sheet. The holding surface and the sheet are moved relative to each other while a bending stress is generated by locally applying a vacuum suction force to a portion of the wafer to be cut. When the convex step portion of the holding surface is relatively moved to a position directly below the planned cutting line portion of the one line of the wafer, the pushing-up action by the leading edge of the convex step portion is increased, and the cutting planned line portion is cut.

  Further, the pressing member in the wafer dividing jig can be a protruding body that is partially protruded from the holding surface. As this protrusion, a squeegee, a roller that rotates by relative contact with the sheet, or the like can be applied. In this case, vacuum suction ports can be formed on both sides of the protrusion.

  For example, the holding surface of the wafer dividing jig is a horizontal flat surface on which a wafer sheet slides. A linear protrusion protrudes at the height of the wafer thickness on the center of the flat surface. When the projecting body is a squeegee, only the upper end of the squeegee protrudes from the flat holding surface, and vacuum suction ports are provided along the left and right side surfaces of the squeegee. The upper end of the squeegee is brought into contact with the lower surface of the wafer sheet, the vacuum suction ports on the left and right sides of the squeegee are operated by vacuum suction, and the wafer is vacuum sucked from the left and right sides of the squeegee. When the linear top edge of the squeegee moves relatively directly below the part of the wafer's planned cutting line, a large bending stress is generated in the part of the single line of the planned cutting line due to vacuum suction from both sides, and the squeegee is pushed up. The action becomes strong, and the part of the planned cutting line is reliably cut.

  In addition, the jig of the present invention that achieves the above-described object is a method in which a wafer attached to the surface of a sheet is aligned with a plurality of planned cutting lines formed in a lattice pattern on the surface of the wafer attached to the sheet. A wafer splitting jig for splitting, comprising a first holding surface and a second holding surface, which are slidably in contact with the back surface of the sheet and hold the wafer via the sheet and which are continuous in an inverted shape, and a first holding surface And a vacuum suction port that is formed at a boundary portion of the second holding surface and vacuum-sucks the wafer locally through the sheet by performing a vacuum suction operation.

  As the wafer dividing jig here, a suction stage that moves relative to the wafer and the sheet can be applied. The first holding surface and the second holding surface, which are continuous in the shape of the reverse of the split jig, intersect at an obtuse angle close to 180 degrees, and both are inclined surfaces, or one is a horizontal surface and the other is an inclined surface. can do. When a wafer sheet is placed on the first holding surface and slid to the second holding surface, if the vacuum suction operation is performed at the vacuum suction port at the boundary portion between the two holding surfaces, the wafer is localized through the sheet. To cause a bending stress locally. When the above-described bending stress is generated in a portion of the wafer that is to be cut, the portion of the cut line is cut.

  According to the method of the present invention, the planned cutting line portion of the wafer is vacuum-sucked locally through the sheet, and the cutting planned line is divided by the laser dicing method because the bending stress is generated intensively in the planned cutting line portion. Even in the case of the modified region formed inside the wafer, it is possible to perform reliable cleaving even at the planned cutting line portion at the center of the wafer, and there is an excellent effect that the wafer dividing performance can be improved. In addition, by improving the wafer splitting performance, the wafer cutting line is formed in the modified region by the laser dicing method to form many chips on one wafer, and the chips are 0.3mm square or 0.25mm square. Thus, it is easy to reduce the size, and even a small chip can be divided with high certainty, so that the yield of the small chip can be improved and the practical value can be improved.

  In addition, the jig according to the present invention has a simple structure in which a vacuum suction port for locally vacuuming the sheet is provided on the holding surface for holding the wafer sheet, thus providing a small wafer split jig with low manufacturing cost. it can. In addition, such a small and simple wafer dividing jig can be easily incorporated into an expanding mechanism in an existing die bonder, and has an excellent practical value that can be applied to an existing die bonder with an advantage in capital investment.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  A first wafer dividing method and a dividing jig will be described with reference to FIGS. FIG. 1 is a plan view showing an outline of a wafer ring component 6 and a wafer dividing jig 10 used in an expanding mechanism of a die bonder. The wafer ring component 6 is the same as the component shown in FIG. 11, and the back surface of the support ring 4 is fixed to the periphery of the front surface of the stretchable sheet 3 with an adhesive, and one wafer 1 is formed at the center of the surface of the sheet 3. The back side is stuck. On the surface side of the wafer 1, the planned cutting line 2 is formed in a lattice pattern. One wafer 1 is divided at all portions of the planned cutting line 2 to form a large number of rectangular chips.

  The planned cutting line 2 of the wafer 1 is a modified region formed on the surface of the wafer 1 by laser dicing. The grid-like cutting lines 2 are a plurality of vertical cutting lines 2a and a plurality of horizontal cutting lines 2b. Since the wafer 1 has a substantially circular shape, the respective splitting planned lines 2 have different lengths. The wafer ring component 6 is incorporated in an expansion mechanism (not shown) and installed horizontally, and the sheet 3 is expanded 360 degrees from the wafer 1. A wafer dividing jig 10 is disposed on the lower surface side of the sheet 3 so as to be movable relative to the sheet 3 in the horizontal direction.

  The wafer dividing jig 10 is a flat rectangular hard material block slightly longer than the maximum length of the planned cutting line 2 of the wafer 1, and an enlarged cross-sectional shape is shown in FIG. The wafer dividing jig 10 has a holding surface 11 serving as an upper surface. The holding surface 11 slidably contacts the lower surface of the horizontal sheet 3 in the wafer ring component 6 of FIG. 1 and holds the wafer 1 via the sheet 3. The holding surface 11 has an upper holding surface 11a and a lower holding surface 11b with a level difference of approximately the thickness of the wafer 1, and a substantially vertical step surface 11c is formed between the upper holding surface 11a and the lower holding surface 11b. An edge of the convex step portion 12a that is a boundary portion between the upper holding surface 11a and the step surface 11c is formed as a linear pressing member 12. The edge of the straight convex portion 12 a has a length that is equal to or greater than the maximum length of the plurality of split planned lines 2 in the wafer 1. Further, a recessed step portion is formed at the boundary between the step surface 11c and the lower holding surface 11b, and the vacuum suction port 13 is formed on the lower holding surface 11b at the recessed step portion. The vacuum suction port 13 penetrates the dividing jig 10 and is connected to an external vacuum suction system 14.

  The entire area of the holding surface 11 of the wafer dividing jig 10 contacts the lower surface of the horizontal sheet 3. When the sheet 3 to which the wafer 1 is bonded is brought into contact with the upper holding surface 11a of the holding surface 11, a gap g is formed between the concave portion at the substantially central portion of the holding surface 11 and the sheet 3. When the vacuum suction port 13 performs vacuum suction, the sheet 3 also contacts the lower holding surface 11b. The vacuum suction port 13 in the central portion of the holding surface 11 is a rectangular hole or a semicircular hole, and is formed at a plurality of locations along the step surface 11c as shown in FIG. The gap g formed when the sheet 3 is vacuum-adsorbed across the entire holding surface 11 by closing both end openings of the concave step portion, which is the boundary portion between the step surface 11c and the lower holding surface 11b, with a substantially triangular sealing material 11d. The openings at both ends are closed with the sealing material 11d to prevent the vacuum suction force from decreasing in the gap g.

  The operation of dividing the wafer 1 by the wafer dividing jig 10 will be described. As shown in FIG. 2A, the horizontal sheet 3 in the expanded state is formed such that the edge of the straight convex portion 12a of the wafer dividing jig 10 is parallel to the longitudinal dividing line 2a of the wafer 1. The holding surface 11 is brought into contact with the lower surface of the plate. The entire jig is horizontally moved in the left direction in FIG. 2 while performing vacuum suction operation at the vacuum suction port 13 of the holding surface 11. When the holding surface 11 slides and moves on the lower surface of the sheet 3 in a state where the sheet 3 is locally vacuum-sucked, and the end of the wafer 1 moves directly above the vacuum suction port 13, the end of the wafer is vacuumed. Start receiving suction. Further, as shown in FIG. 2 (B), when the first vertical cutting line 2 at the edge of the wafer is moved directly above the edge of the straight convex portion 12a, this vertical cutting line 2 Bending stress is generated concentrated on the portion of the wafer 1, and the wafer 1 is cleaved from the portion of the planned cutting line 2 by this bending stress. The cut wafer edge 1 "shown in FIG. 2B remains adhered to the sheet 3, and is positively separated from the original wafer 1 at the same time as it is cleaved by the expansion of the sheet 3. In other words, it is scheduled to cleave in the vertical direction. The line 2a is first subjected to the tensile stress due to the expansion of the sheet 3, then subjected to the bending stress due to the vacuum suction force, and finally cleaved due to the bending stress due to the pushing up of the edge of the convex step portion 12a. However, the chip can be sufficiently dealt with even if the chip size obtained by cleaving is small.

  In the state of FIG. 2 (B), the wafer dividing jig 10 is moved horizontally with respect to the sheet 3 to sequentially cut (divide) the plurality of vertical cutting lines 2a one by one. After dividing all of the plurality of planned cutting lines 2a in the vertical direction, the wafer dividing jig 10 is rotated 90 degrees in the horizontal direction with the sheet 3 as it is, and the edge of the straight convex portion 12a is scheduled to be cut in the horizontal direction. In parallel with the line 2b, the sheet 3 is moved horizontally in the lateral direction as described above. By this horizontal movement, a plurality of horizontal cutting lines 2b of the wafer 1 are sequentially cut (divided) one by one, and the wafer 1 is finally subdivided into a number of rectangular chips.

  A second wafer dividing method and a dividing jig will be described with reference to FIGS. In the wafer dividing jig 10 shown in the cross-sectional view of FIG. 4, the pressing member 12 is configured by a protruding body 12 b that protrudes from the holding surface 11 at the center of the flat holding surface 11. The projecting body 12b is the upper edge of the squeegee 12'b and forms vacuum suction ports 13 and 13 on both sides of the squeegee. The sheet 3 of the wafer 1 slides on the flat holding surface 11. On the central portion of the holding surface 11, a linear protrusion 12b protrudes at a height of about the wafer thickness. The linear protrusion 12b is slightly longer than the planned cutting line 2 of the maximum length of the wafer 1. When the sheet 3 of the wafer 1 is placed on the holding surface 11 and the vacuum suction ports 13 and 13 are operated by vacuum suction to attract the sheet 3 to the holding surface 11, the protruding body 12b pushes the sheet 3 up slightly and holds it. A gap g is formed between the surface 11 and the surface 11. Sealing materials 11e as shown in FIG. 5 are formed on both ends of the squeegee 12'b so as to block both ends of the gap g, thereby preventing a decrease in vacuum suction force in the gap g.

  As shown in FIG. 4, the sheet 3 of the wafer 1 is placed on the holding surface 11, and the vacuum suction ports 13, 13 along the front and rear side surfaces of the squeegee 12 ′ b are simultaneously vacuum-sucked to place the holding surface 11 on the sheet 3. While sliding, the wafer dividing jig 10 is moved horizontally, and the linear protrusion 12b is moved directly below the planned cutting line 2 in the vertical or horizontal direction. When the projecting body 12b moves directly below the one line of the planned cutting line 2, the sheets 3 on both sides of the projecting body 12b are both sucked down by vacuum, and bending stress is concentrated on the planned cutting line 2 on the wafer surface. Then, cleave from the planned cutting line 2. This cleaving is performed more strongly than the jig in FIG. 2 because the wafer 1 is locally pushed up from the bottom in a reverse V shape with the protruding body 12b. In fact, even smaller chips (such as 0.25 mm square chips) can be reliably cleaved and divided.

  A third wafer dividing method and a dividing jig will be described with reference to FIG. The wafer 1 shown in FIG. 6 has a stretchable sheet 3 ′ attached to the front side. The wafer dividing jig 10 in FIG. 6 is the same jig as in FIG. The sheet 3 ′ on the front surface side of the wafer 1 is a cover sheet, and is attached after forming the planned cutting line 2 on the front surface side of the wafer 1. When the sheet 3 on the back surface of the wafer 1 is slid on the holding surface 11 of the wafer dividing jig 10 and is vacuum-sucked by the vacuum suction port 13, one strip of the wafer 1 is directly above the pressing member 12 as in FIG. When the planned cutting line 2 is moved, bending stress is concentrated at the portion of the planned cutting line 2 and the planned cutting line part is cut. At the time of this cleaving, the cover sheet 3 ′ is controlled from the front side by controlling the wafer 1 and the cleaved chip side, and the peeling from the sheet 3 is suppressed, and the back sheet 3 and the cover sheet 3 ′ are expanded. The tensile stress due to the cover sheet 3 'acts on the wafer surface, and the cleaving of the portion to be cut is more reliable and stable. Such a function and effect of the cover sheet 3 ′ is more effective as the chip to be cut is smaller in size, and facilitates downsizing of the chip.

  Next, a fourth wafer dividing method and a dividing jig will be described with reference to FIG. The wafer 1 shown in FIG. 7 has sheets 3 and 3 ′ attached to both the front and back surfaces as in FIG. 6. The wafer dividing jig 10 in FIG. 7 is the same jig as in FIG. 4, and uses a roller 12 c as the pressing member 12 instead of the squeegee 12 ′ b in FIG. 4. Vacuum suction ports 13 and 13 are formed on both sides of the roller 12c. The roller 12c protrudes from the holding surface 11 by the thickness of the wafer, and is rotated when the protruding outer periphery is brought into contact with the sheet 3 and moved horizontally.

  In the case of the jig shown in FIG. 7, the sheet 3 on the back surface of the wafer 1 is brought into contact with the holding surface 11, and the vacuum suction ports 13 and 13 on both the front and rear sides of the roller 12 c are simultaneously operated by vacuum suction. While sliding, the wafer dividing jig 10 is moved horizontally. By this horizontal movement, the linear roller 12c rotates by contact resistance with the sheet 3 and moves on the lower surface of the sheet 3, so that the movement becomes smooth. This roller 12c is moved in sequence in the longitudinal or lateral direction of the wafer 1 directly below the planned cutting line 2. When the roller 12c moves directly below the one line of the planned cutting line 2, the sheets 3 on both sides of the roller 12c are both sucked by vacuum, and bending stress concentrates on the planned cutting line 2 on the wafer surface. Cleave from line 2. This cleaving is also performed more strongly than the jig in FIG. 2 because the wafer 1 is locally pushed up from the bottom in a reverse V shape by the roller 12c. Further, the roller 12c that pushes the wafer 1 locally together with the cover sheet 3 'on the front surface side in an inverted V shape moves while rotating the lower surface of the sheet 3 on the back surface side of the wafer, so that damage to the sheet 3 is reduced. Can do.

  Next, a fifth wafer dividing method and a dividing jig will be described with reference to FIGS.

  In the wafer 1 shown in FIG. 8, the planned cutting lines 2 are formed in a lattice shape on the surface side to which the sheet 3 is adhered. For example, the cutting line 2 is formed on the surface of the wafer 1, which is the lower surface in FIG. 10, and then the sheet 3 is attached to the surface of the wafer 1. The wafer 1 is turned upside down so that the sheet 3 faces down, and the sheet 3 is placed on the holding surface 11 which is the upper surface of the wafer dividing jig 10 shown in FIG.

  The holding surface 11 of the wafer dividing jig 10 shown in FIG. 9 is in contact with the back surface of the sheet 3 so as to be slidable and holds the wafer 1 via the sheet 3. It is comprised by the holding surface 11q. A vacuum suction port 13 is formed at the boundary between the first holding surface 11p and the second holding surface 11q. The 1st holding surface 11p and the 2nd holding surface 11q which continue in reverse square shape cross | intersect with the obtuse angle close | similar to 180 degree | times. The first holding surface 11p and the second holding surface 11q shown in FIG. 8 form a substantially V shape having an obtuse angle close to 180 degrees, and a plurality of vacuum suction ports 13 are linearly formed in an extremely shallow valley between both surfaces of the substantially V shape. It is formed side by side. The length of this valley is a little longer than the maximum length of the plurality of split planned lines 2 of the wafer 1.

  When a wafer sheet is placed on the first holding surface 11 p and is slid relative to the second holding surface 11 q and a vacuum suction operation is performed at the vacuum suction port 13, the wafer 1 is locally vacuum sucked through the sheet 3. Bending stress occurs. When the portion of the cut line 2 of the wafer 1 is relatively moved to the vacuum suction port 13, the portion of the cut line 2 formed on the lower surface of the wafer 1 in FIG. This occurs, and the portion of the planned cutting line is cleaved by this bending stress.

  It should be noted that the present invention is not limited to the above-described embodiment, and it is needless to say that various modifications can be made without departing from the gist of the present invention.

It is a top view of the wafer and jig | tool for demonstrating the 1st wafer division | segmentation method and division jig | tool of this invention. (A), (B) is an expanded sectional view at the time of each operation | movement of the wafer division jig | tool of FIG. It is a perspective view of the wafer division jig of FIG. It is sectional drawing at the time of operation | movement of the wafer and jig | tool for demonstrating the 2nd wafer division | segmentation method and a division | segmentation jig | tool. FIG. 5 is a partial perspective view of the wafer dividing jig in FIG. 4. It is sectional drawing at the time of operation | movement of the wafer and jig | tool for demonstrating the 3rd wafer division | segmentation method and a division | segmentation jig | tool. It is sectional drawing at the time of operation | movement of the wafer and jig | tool for demonstrating the 4th wafer division | segmentation method and a division | segmentation jig | tool. It is sectional drawing at the time of operation | movement of the wafer and jig | tool for demonstrating the 5th wafer division | segmentation method and a division | segmentation jig | tool. FIG. 9 is a partial perspective view of the wafer dividing jig in FIG. 8. FIG. 9 is an exploded view of the wafer and sheet of FIG. 8. (A), (B) is sectional drawing at the time of each operation | movement for demonstrating the wafer division | segmentation method by the expand mechanism of a die bonder.

Explanation of symbols

1 Wafer 2 Planned cutting line (modified area)
3, 3 ′ sheet 4 support ring 6 wafer ring component 10 wafer split jig 11 holding surface 11a upper holding surface 11b lower holding surface 11c step surface 11p first holding surface 11q second holding surface 12 pressing member 12a convex step portion 12b protrusion 12c Roller 13 Vacuum suction port 14 Vacuum suction system

Claims (10)

A wafer dividing method for dividing a wafer attached to a sheet along a planned cutting line formed on the wafer,
Wafer splitting method characterized by generating a bending stress in the planned cutting line portion by locally vacuum-sucking the planned cutting line portion of the wafer through the sheet, and cutting the planned cutting line portion by this bending stress. .   The wafer dividing method according to claim 1, wherein the planned cutting line of the wafer is a modified region due to a crack formed inside the wafer by a laser dicing method.   The wafer has a plurality of planned cutting lines in a vertical and horizontal grid pattern, and the vertical or horizontal cutting planned line portions of the wafer are divided by vacuum suction in order, and then the horizontal or vertical cutting schedule 3. The wafer dividing method according to claim 1, wherein the line portions are divided by vacuum suction sequentially one by one.   4. The wafer division according to claim 3, wherein vacuum cutting is performed on a portion of the wafer scheduled to be cut, and a pressing member is pressed to the portion of the wafer planned cutting line via the sheet with the vacuum suction force. Method.   The wafer dividing method according to claim 1, wherein sheets are attached to both front and back surfaces of the wafer. A wafer dividing jig that divides a wafer attached to the surface of a sheet along a plurality of cutting planned lines formed in a lattice pattern on the opposite surface of the surface of the wafer to which the sheet is attached. ,
A holding surface that slidably contacts the back surface of the sheet and holds the wafer via the sheet, and is formed on the holding surface with a length that is greater than or equal to the maximum length of the plurality of planned cutting lines in the wafer, A linear pressing member that forms a gap between the holding surface and the sheet when the wafer is placed on the holding surface via the sheet, and is formed on the holding surface adjacent to the pressing member and performs a vacuum suction operation. And a vacuum suction port for vacuuming the gap and locally vacuuming the wafer through the sheet.   7. The wafer dividing jig according to claim 6, wherein the pressing member is the convex step portion of a step portion formed by a convex step portion and a concave step portion partially formed on the holding surface.   The wafer dividing jig according to claim 6, wherein the pressing member is a protruding body partially protruding from the holding surface.   9. The wafer dividing jig according to claim 8, wherein the vacuum suction ports are formed on both sides of the protruding body. A wafer dividing jig that divides a wafer attached to the surface of a sheet along a plurality of cutting planned lines formed in a lattice pattern on the surface of the wafer attached to the sheet,
A first holding surface and a second holding surface that are slidably in contact with the back surface of the sheet and hold the wafer via the sheet, and the boundary between the first holding surface and the second holding surface. A wafer splitting jig, comprising: a vacuum suction port formed in a portion and vacuum-sucking the wafer locally through the sheet by performing a vacuum suction operation.

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