JP2006339559A5 - - Google Patents

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Publication number
JP2006339559A5
JP2006339559A5 JP2005165112A JP2005165112A JP2006339559A5 JP 2006339559 A5 JP2006339559 A5 JP 2006339559A5 JP 2005165112 A JP2005165112 A JP 2005165112A JP 2005165112 A JP2005165112 A JP 2005165112A JP 2006339559 A5 JP2006339559 A5 JP 2006339559A5
Authority
JP
Japan
Prior art keywords
led chip
heat sink
wiring board
hole
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005165112A
Other languages
English (en)
Japanese (ja)
Other versions
JP4915058B2 (ja
JP2006339559A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005165112A priority Critical patent/JP4915058B2/ja
Priority claimed from JP2005165112A external-priority patent/JP4915058B2/ja
Priority to PCT/JP2006/306798 priority patent/WO2006106901A1/ja
Priority to US11/579,770 priority patent/US20070200133A1/en
Publication of JP2006339559A publication Critical patent/JP2006339559A/ja
Publication of JP2006339559A5 publication Critical patent/JP2006339559A5/ja
Application granted granted Critical
Publication of JP4915058B2 publication Critical patent/JP4915058B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2005165112A 2005-04-01 2005-06-06 Ｌｅｄ部品およびその製造方法 Expired - Fee Related JP4915058B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005165112A JP4915058B2 (ja) 2005-06-06 2005-06-06 Ｌｅｄ部品およびその製造方法
PCT/JP2006/306798 WO2006106901A1 (ja) 2005-04-01 2006-03-31 Ｌｅｄ部品およびその製造方法
US11/579,770 US20070200133A1 (en) 2005-04-01 2006-03-31 Led assembly and manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005165112A JP4915058B2 (ja) 2005-06-06 2005-06-06 Ｌｅｄ部品およびその製造方法

Publications (3)

Publication Number Publication Date
JP2006339559A JP2006339559A (ja) 2006-12-14
JP2006339559A5 true JP2006339559A5 (ko) 2008-07-10
JP4915058B2 JP4915058B2 (ja) 2012-04-11

Family

ID=37559822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005165112A Expired - Fee Related JP4915058B2 (ja) 2005-04-01 2005-06-06 Ｌｅｄ部品およびその製造方法

Country Status (1)

Country Link
JP (1) JP4915058B2 (ko)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4984930B2 (ja) * 2006-03-20 2012-07-25 Ｔｄｋ株式会社 バリスタ素子
JP4984929B2 (ja) * 2007-02-01 2012-07-25 Ｔｄｋ株式会社 バリスタ素子
JP4867511B2 (ja) * 2006-07-19 2012-02-01 Ｔｄｋ株式会社 バリスタ及び発光装置
JP4888225B2 (ja) * 2007-03-30 2012-02-29 Ｔｄｋ株式会社 バリスタ及び発光装置
WO2008129877A1 (ja) * 2007-04-17 2008-10-30 Panasonic Corporation Ｌｅｄ実装基板
WO2008139981A1 (ja) * 2007-05-09 2008-11-20 C.I. Kasei Company, Limited 発光装置および発光装置用パッケージ集合体
KR100999760B1 (ko) * 2008-09-26 2010-12-08 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
US20110272731A1 (en) * 2008-10-31 2011-11-10 Denki Kagaku Kogyo Kabushiki Kaisha Substrate for light emitting element package, and light emitting element package
KR101047801B1 (ko) * 2008-12-29 2011-07-07 엘지이노텍 주식회사 발광 디바이스 패키지 및 그 제조방법
JP2012253048A (ja) * 2010-02-26 2012-12-20 Sanyo Electric Co Ltd 電子デバイス
US9076714B2 (en) 2010-03-01 2015-07-07 Panasonic Intellectual Property Management Co., Ltd. Substrate for mounting light-emitting element and light-emitting device
JP5965158B2 (ja) * 2012-02-20 2016-08-03 スタンレー電気株式会社 発光装置及びその製造方法
DE102012104494A1 (de) 2012-05-24 2013-11-28 Epcos Ag Leuchtdiodenvorrichtung
JP5832956B2 (ja) 2012-05-25 2015-12-16 株式会社東芝 半導体発光装置
KR101778867B1 (ko) * 2012-07-23 2017-09-26 구이저우 쥐지쥐피에스 씨오., 엘티디 호환성 및 통용성이 높은 led 벌브 구성 방법과 일체식 led 벌브 및 램프
DE102012113014A1 (de) * 2012-12-21 2014-06-26 Epcos Ag Bauelementträger und Bauelementträgeranordnung
DE102014115375A1 (de) * 2014-08-08 2016-02-11 Epcos Ag Träger für eine LED
KR20160094755A (ko) * 2015-02-02 2016-08-10 서울반도체 주식회사 발광 장치
US11236227B2 (en) 2015-06-29 2022-02-01 Tatsuta Electric Wire & Cable Co., Ltd. Heat dissipation material adhering composition, heat dissipation material having adhesive, inlay substrate, and method for manufacturing same
CN112868147B (zh) * 2018-10-19 2024-10-25 京瓷株式会社 光元件搭载用封装件、电子装置以及电子模块

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11186053A (ja) * 1997-12-18 1999-07-09 Matsushita Electric Ind Co Ltd 複合部品およびその製造方法
JP3639428B2 (ja) * 1998-03-17 2005-04-20 三洋電機株式会社 光源装置
JP2001015815A (ja) * 1999-04-28 2001-01-19 Sanken Electric Co Ltd 半導体発光装置
JP2002368277A (ja) * 2001-06-05 2002-12-20 Rohm Co Ltd チップ型半導体発光装置
JP4211359B2 (ja) * 2002-03-06 2009-01-21 日亜化学工業株式会社 半導体装置の製造方法
JP4085917B2 (ja) * 2003-07-16 2008-05-14 松下電工株式会社 高熱伝導性発光素子用回路部品及び高放熱モジュール
JP2005064047A (ja) * 2003-08-13 2005-03-10 Citizen Electronics Co Ltd 発光ダイオード
US7683386B2 (en) * 2003-08-19 2010-03-23 Nichia Corporation Semiconductor light emitting device with protrusions to improve external efficiency and crystal growth
JP2005136224A (ja) * 2003-10-30 2005-05-26 Asahi Kasei Electronics Co Ltd 発光ダイオード照明モジュール
US7279724B2 (en) * 2004-02-25 2007-10-09 Philips Lumileds Lighting Company, Llc Ceramic substrate for a light emitting diode where the substrate incorporates ESD protection

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