JP2006325051A - 弾性表面波デバイス及び電子機器 - Google Patents
弾性表面波デバイス及び電子機器 Download PDFInfo
- Publication number
- JP2006325051A JP2006325051A JP2005147594A JP2005147594A JP2006325051A JP 2006325051 A JP2006325051 A JP 2006325051A JP 2005147594 A JP2005147594 A JP 2005147594A JP 2005147594 A JP2005147594 A JP 2005147594A JP 2006325051 A JP2006325051 A JP 2006325051A
- Authority
- JP
- Japan
- Prior art keywords
- acoustic wave
- saw
- surface acoustic
- element piece
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 159
- 239000000758 substrate Substances 0.000 claims description 44
- 238000000034 method Methods 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000035882 stress Effects 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000010355 oscillation Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 230000006355 external stress Effects 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 230000005236 sound signal Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005147594A JP2006325051A (ja) | 2005-05-20 | 2005-05-20 | 弾性表面波デバイス及び電子機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005147594A JP2006325051A (ja) | 2005-05-20 | 2005-05-20 | 弾性表面波デバイス及び電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006325051A true JP2006325051A (ja) | 2006-11-30 |
| JP2006325051A5 JP2006325051A5 (https=) | 2008-05-29 |
Family
ID=37544373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005147594A Pending JP2006325051A (ja) | 2005-05-20 | 2005-05-20 | 弾性表面波デバイス及び電子機器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2006325051A (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000151346A (ja) * | 1998-10-30 | 2000-05-30 | Thomson Csf | 一つの同じ容器に積み重ねられたモジュ―ル部品 |
| JP2000278079A (ja) * | 1999-03-24 | 2000-10-06 | Toyo Commun Equip Co Ltd | 圧電デバイス |
| JP2002290200A (ja) * | 2001-03-26 | 2002-10-04 | Seiko Epson Corp | 弾性表面波装置及びその製造方法 |
| JP2004153408A (ja) * | 2002-10-29 | 2004-05-27 | Seiko Epson Corp | 圧電デバイスおよびその製造方法 |
-
2005
- 2005-05-20 JP JP2005147594A patent/JP2006325051A/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000151346A (ja) * | 1998-10-30 | 2000-05-30 | Thomson Csf | 一つの同じ容器に積み重ねられたモジュ―ル部品 |
| JP2000278079A (ja) * | 1999-03-24 | 2000-10-06 | Toyo Commun Equip Co Ltd | 圧電デバイス |
| JP2002290200A (ja) * | 2001-03-26 | 2002-10-04 | Seiko Epson Corp | 弾性表面波装置及びその製造方法 |
| JP2004153408A (ja) * | 2002-10-29 | 2004-05-27 | Seiko Epson Corp | 圧電デバイスおよびその製造方法 |
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Legal Events
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|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080416 |
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| A977 | Report on retrieval |
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