JP2006297701A - 半導体封止用エポキシ樹脂組成物の製造方法、半導体封止用エポキシ樹脂組成物及びそれを用いた電子部品装置 - Google Patents
半導体封止用エポキシ樹脂組成物の製造方法、半導体封止用エポキシ樹脂組成物及びそれを用いた電子部品装置 Download PDFInfo
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- JP2006297701A JP2006297701A JP2005120982A JP2005120982A JP2006297701A JP 2006297701 A JP2006297701 A JP 2006297701A JP 2005120982 A JP2005120982 A JP 2005120982A JP 2005120982 A JP2005120982 A JP 2005120982A JP 2006297701 A JP2006297701 A JP 2006297701A
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- epoxy resin
- resin composition
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- semiconductor
- cooling
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Abstract
【解決手段】 エポキシ樹脂、硬化剤、無機充填剤を含む半導体封止用エポキシ樹脂組成物の製造方法において、エポキシ樹脂、硬化剤、無機充填剤を含む原材料を混合後、混練装置にて混練して混練物を得る工程、前記混練物を圧延ロールでシート状に圧延して、圧延物を得る工程、前記圧延物を冷却コンベアにて搬送しながら、低温の気体中で冷却する工程、前記圧延物を粉砕機にて粉砕して粉砕品を得る工程、前記粉砕品を圧縮成形する工程、を有する半導体封止用エポキシ樹脂組成物の製造方法。
【選択図】 図1
Description
(1)エポキシ樹脂、硬化剤、無機充填剤を含む半導体封止用エポキシ樹脂組成物の製造方法において、エポキシ樹脂、硬化剤、無機充填剤を含む原材料を混合後、混練装置にて混練して混練物を得る工程、前記混練物を圧延ロールでシート状に圧延して、圧延物を得る工程、前記圧延物を冷却コンベアにて搬送しながら、低温の気体中で冷却する工程、前記圧延物を粉砕機にて粉砕して粉砕品を得る工程、前記粉砕品を圧縮成形する工程、を有する半導体封止用エポキシ樹脂組成物の製造方法。
(2)低温の気体中で冷却する工程が、圧延物に低温の気体を吹き付けて冷却する工程である項(1)に記載の半導体封止用エポキシ樹脂組成物の製造方法。
(3)低温の気体が、0〜15℃の空気である項(1)又は(2)に記載の半導体封止用エポキシ樹脂組成物の製造方法。
(4)圧延物を粉砕機にて粉砕して粉砕品を得る工程が、低温度低露点の空気中で圧延物を粉砕機にて粉砕して粉砕品を得る工程である項(1)〜(3)いずれかに記載の半導体封止用エポキシ樹脂組成物の製造方法。
(5)低温度低露点の空気温度が5℃以下、露点温度が0℃以下である項(4)に記載の半導体封止用エポキシ樹脂組成物の製造方法。
(6)項(1)〜(5)いずれかに記載の半導体封止用エポキシ樹脂組成物の製造方法で製造されたことを特徴とする半導体封止用エポキシ樹脂組成物。
(7)項(6)に記載の半導体封止用エポキシ樹脂組成物を用いて封止された素子を備えたことを特徴とする電子部品装置。
本発明の半導体封止用エポキシ樹脂組成物の製造方法は、エポキシ樹脂、硬化剤、無機充填剤を含む半導体封止用エポキシ樹脂組成物の製造方法において、エポキシ樹脂、硬化剤、無機充填剤を含む原材料を混合後、混練装置にて混練して混練物を得る工程、前記混練物を圧延ロールでシート状に圧延して、圧延物を得る工程、前記圧延物を冷却コンベアにて搬送しながら、低温の気体中で冷却する工程、前記圧延物を粉砕機にて粉砕して粉砕品を得る工程、前記粉砕品を圧縮成形する工程を有することを特徴としている。
(実施例1)
エポキシ樹脂としてエポキシ当量186、融点75℃のビスフェノールF型エポキシ樹脂(新日鉄化学株式会社製商品名ESLV−80XY)を85重量部、及びエポキシ当量375、軟化点80℃、臭素含量48重量%のビスフェノールA型ブロム化エポキシ樹脂(住友化学工業株式会社製商品名ESB−400T)を15重量部、硬化剤として水酸基当量199、軟化点80℃のビフェニル型フェノール樹脂(明和化成株式会社製商品名MEH−7851)を99重量部、硬化促進剤としてトリフェニルホスフィンとp−ベンゾキノンとの付加物を3.5重量部、無機充填剤として平均粒径17.5μm、比表面積3.8m2/gの球状溶融シリカを1983重量部、カップリング剤としてγ−グリシドキシプロピルトリメトキシシラン(エポキシシラン)を4.5重量部、その他の添加剤として三酸化アンチモンを6.0重量部、カルナバワックス(株式会社セラリカNODA製)を2.0重量部、カーボンブラック(三菱化学株式会社製商品名MA−100)を3.5重量部、それぞれを含む原材料をミキサーで混合し、混練温度80℃、混練時間10分の条件で混練装置11である同方向回転二軸押出機で混練を行い、混練物16を作製した。
12 圧延ロール
13 冷却コンベア
14 冷風生成循環装置
15 冷風ダクト
16 混練物
18 圧延物
19 粗粉砕機
20 筐体
21 冷風吹き出し口
22 冷風調整ダンパ
30 搬送装置
31 粉砕機
32 ストックタンク
33 充填タンク
34 粉砕品
35 低温度低露点空気発生装置
36 調整ダンパ
Claims (7)
- エポキシ樹脂、硬化剤、無機充填剤を含む半導体封止用エポキシ樹脂組成物の製造方法において、
エポキシ樹脂、硬化剤、無機充填剤を含む原材料を混合後、混練装置にて混練して混練物を得る工程、
前記混練物を圧延ロールでシート状に圧延して、圧延物を得る工程、
前記圧延物を冷却コンベアにて搬送しながら、低温の気体中で冷却する工程、
前記圧延物を粉砕機にて粉砕して粉砕品を得る工程、
前記粉砕品を圧縮成形する工程、を有する半導体封止用エポキシ樹脂組成物の製造方法。 - 低温の気体中で冷却する工程が、圧延物に低温の気体を吹き付けて冷却する工程である請求項1に記載の半導体封止用エポキシ樹脂組成物の製造方法。
- 低温の気体が、0〜15℃の空気である請求項1又は2に記載の半導体封止用エポキシ樹脂組成物の製造方法。
- 圧延物を粉砕機にて粉砕して粉砕品を得る工程が、低温度低露点の空気中で圧延物を粉砕機にて粉砕して粉砕品を得る工程である請求項1〜3いずれかに記載の半導体封止用エポキシ樹脂組成物の製造方法。
- 低温度低露点の空気温度が5℃以下、露点温度が0℃以下である請求項4に記載の半導体封止用エポキシ樹脂組成物の製造方法。
- 請求項1〜5いずれかに記載の半導体封止用エポキシ樹脂組成物の製造方法で製造されたことを特徴とする半導体封止用エポキシ樹脂組成物。
- 請求項6に記載の半導体封止用エポキシ樹脂組成物を用いて封止された素子を備えたことを特徴とする電子部品装置。
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