JP2006278886A - 半導体集積回路の配線方法 - Google Patents
半導体集積回路の配線方法 Download PDFInfo
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- JP2006278886A JP2006278886A JP2005098277A JP2005098277A JP2006278886A JP 2006278886 A JP2006278886 A JP 2006278886A JP 2005098277 A JP2005098277 A JP 2005098277A JP 2005098277 A JP2005098277 A JP 2005098277A JP 2006278886 A JP2006278886 A JP 2006278886A
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005098277A JP2006278886A (ja) | 2005-03-30 | 2005-03-30 | 半導体集積回路の配線方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005098277A JP2006278886A (ja) | 2005-03-30 | 2005-03-30 | 半導体集積回路の配線方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006278886A true JP2006278886A (ja) | 2006-10-12 |
| JP2006278886A5 JP2006278886A5 (https=) | 2008-04-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005098277A Pending JP2006278886A (ja) | 2005-03-30 | 2005-03-30 | 半導体集積回路の配線方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2006278886A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008186230A (ja) * | 2007-01-30 | 2008-08-14 | Fujitsu Ltd | 集積回路設計装置、集積回路設計方法及び集積回路設計プログラム |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08316419A (ja) * | 1995-05-22 | 1996-11-29 | Fujitsu Ltd | 半導体集積回路及び半導体集積回路の自動配線方法 |
| JPH09213888A (ja) * | 1996-01-30 | 1997-08-15 | Nec Corp | 半導体集積回路チップ |
| JP2001267427A (ja) * | 2000-03-16 | 2001-09-28 | Kawasaki Steel Corp | 配置配線方法 |
-
2005
- 2005-03-30 JP JP2005098277A patent/JP2006278886A/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08316419A (ja) * | 1995-05-22 | 1996-11-29 | Fujitsu Ltd | 半導体集積回路及び半導体集積回路の自動配線方法 |
| JPH09213888A (ja) * | 1996-01-30 | 1997-08-15 | Nec Corp | 半導体集積回路チップ |
| JP2001267427A (ja) * | 2000-03-16 | 2001-09-28 | Kawasaki Steel Corp | 配置配線方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008186230A (ja) * | 2007-01-30 | 2008-08-14 | Fujitsu Ltd | 集積回路設計装置、集積回路設計方法及び集積回路設計プログラム |
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