JP2006261366A - プリント配線板へのｌｅｄ実装方法およびｌｅｄ実装プリント配線板 - Google Patents

プリント配線板へのｌｅｄ実装方法およびｌｅｄ実装プリント配線板 Download PDF

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Publication number
JP2006261366A
JP2006261366A JP2005076410A JP2005076410A JP2006261366A JP 2006261366 A JP2006261366 A JP 2006261366A JP 2005076410 A JP2005076410 A JP 2005076410A JP 2005076410 A JP2005076410 A JP 2005076410A JP 2006261366 A JP2006261366 A JP 2006261366A
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JP
Japan
Prior art keywords
led
wiring board
printed wiring
mounting
bare chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005076410A
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English (en)
Japanese (ja)
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JP2006261366A5 (enExample
Inventor
Noboru Tanaka
昇 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
REIMEI GIKEN KOGYO KK
Original Assignee
REIMEI GIKEN KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by REIMEI GIKEN KOGYO KK filed Critical REIMEI GIKEN KOGYO KK
Priority to JP2005076410A priority Critical patent/JP2006261366A/ja
Priority to TW94114530A priority patent/TWI289940B/zh
Publication of JP2006261366A publication Critical patent/JP2006261366A/ja
Publication of JP2006261366A5 publication Critical patent/JP2006261366A5/ja
Pending legal-status Critical Current

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  • Led Device Packages (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2005076410A 2005-03-17 2005-03-17 プリント配線板へのｌｅｄ実装方法およびｌｅｄ実装プリント配線板 Pending JP2006261366A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005076410A JP2006261366A (ja) 2005-03-17 2005-03-17 プリント配線板へのｌｅｄ実装方法およびｌｅｄ実装プリント配線板
TW94114530A TWI289940B (en) 2005-03-17 2005-05-05 Method for packaging LED to printed-wiring board, and LED packaging printed-wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005076410A JP2006261366A (ja) 2005-03-17 2005-03-17 プリント配線板へのｌｅｄ実装方法およびｌｅｄ実装プリント配線板

Publications (2)

Publication Number Publication Date
JP2006261366A true JP2006261366A (ja) 2006-09-28
JP2006261366A5 JP2006261366A5 (enExample) 2007-05-10

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ID=37100273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005076410A Pending JP2006261366A (ja) 2005-03-17 2005-03-17 プリント配線板へのｌｅｄ実装方法およびｌｅｄ実装プリント配線板

Country Status (2)

Country Link
JP (1) JP2006261366A (enExample)
TW (1) TWI289940B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101107590B1 (ko) 2011-04-05 2012-01-25 안복만 발광소자 패키지의 제조방법
CN103296185A (zh) * 2012-03-02 2013-09-11 河南森源电气股份有限公司 一种倒梯形led支架及其led光源
JP7507288B2 (ja) 2017-12-18 2024-06-27 ローム株式会社 半導体発光装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63107483A (ja) * 1986-10-22 1988-05-12 Matsushita Electric Ind Co Ltd ブラシレスモ−タ
JPH0278102A (ja) * 1987-12-24 1990-03-19 Mitsubishi Cable Ind Ltd 発光ダイオード照明具
JPH11298050A (ja) * 1998-04-10 1999-10-29 Mitsubishi Plastics Ind Ltd 窪み付きメタルコア印刷回路基板およびこれを用いた照明具
JP2000031548A (ja) * 1998-07-09 2000-01-28 Stanley Electric Co Ltd 面実装型発光ダイオードおよびその製造方法
JP2001148514A (ja) * 1999-11-18 2001-05-29 Matsushita Electric Works Ltd 照明光源
JP2004039691A (ja) * 2002-06-28 2004-02-05 Matsushita Electric Ind Co Ltd Ｌｅｄ照明装置用の熱伝導配線基板およびそれを用いたｌｅｄ照明装置、並びにそれらの製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63107483A (ja) * 1986-10-22 1988-05-12 Matsushita Electric Ind Co Ltd ブラシレスモ−タ
JPH0278102A (ja) * 1987-12-24 1990-03-19 Mitsubishi Cable Ind Ltd 発光ダイオード照明具
JPH11298050A (ja) * 1998-04-10 1999-10-29 Mitsubishi Plastics Ind Ltd 窪み付きメタルコア印刷回路基板およびこれを用いた照明具
JP2000031548A (ja) * 1998-07-09 2000-01-28 Stanley Electric Co Ltd 面実装型発光ダイオードおよびその製造方法
JP2001148514A (ja) * 1999-11-18 2001-05-29 Matsushita Electric Works Ltd 照明光源
JP2004039691A (ja) * 2002-06-28 2004-02-05 Matsushita Electric Ind Co Ltd Ｌｅｄ照明装置用の熱伝導配線基板およびそれを用いたｌｅｄ照明装置、並びにそれらの製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101107590B1 (ko) 2011-04-05 2012-01-25 안복만 발광소자 패키지의 제조방법
CN103296185A (zh) * 2012-03-02 2013-09-11 河南森源电气股份有限公司 一种倒梯形led支架及其led光源
JP7507288B2 (ja) 2017-12-18 2024-06-27 ローム株式会社 半導体発光装置

Also Published As

Publication number Publication date
TW200635080A (en) 2006-10-01
TWI289940B (en) 2007-11-11

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