JP2006257553A - 電気化学エッチング - Google Patents
電気化学エッチング Download PDFInfo
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- JP2006257553A JP2006257553A JP2006070731A JP2006070731A JP2006257553A JP 2006257553 A JP2006257553 A JP 2006257553A JP 2006070731 A JP2006070731 A JP 2006070731A JP 2006070731 A JP2006070731 A JP 2006070731A JP 2006257553 A JP2006257553 A JP 2006257553A
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- 238000005530 etching Methods 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 claims abstract description 113
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- 239000002736 nonionic surfactant Substances 0.000 claims abstract description 34
- 230000005684 electric field Effects 0.000 claims abstract description 25
- 239000000203 mixture Substances 0.000 claims abstract description 23
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 86
- 239000000758 substrate Substances 0.000 claims description 48
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 34
- 239000003463 adsorbent Substances 0.000 claims description 32
- 125000000217 alkyl group Chemical group 0.000 claims description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 150000004996 alkyl benzenes Chemical class 0.000 claims description 13
- 235000006408 oxalic acid Nutrition 0.000 claims description 11
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 8
- 229940092714 benzenesulfonic acid Drugs 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 238000004380 ashing Methods 0.000 claims description 6
- XYWJNTOURDMTPI-UHFFFAOYSA-N procodazole Chemical compound C1=CC=C2NC(CCC(=O)O)=NC2=C1 XYWJNTOURDMTPI-UHFFFAOYSA-N 0.000 claims description 5
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims 2
- UYWWLYCGNNCLKE-UHFFFAOYSA-N 2-pyridin-4-yl-1h-benzimidazole Chemical compound N=1C2=CC=CC=C2NC=1C1=CC=NC=C1 UYWWLYCGNNCLKE-UHFFFAOYSA-N 0.000 claims 1
- 239000002156 adsorbate Substances 0.000 claims 1
- 238000007598 dipping method Methods 0.000 claims 1
- 235000019260 propionic acid Nutrition 0.000 claims 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 claims 1
- 238000001039 wet etching Methods 0.000 abstract description 12
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- 238000004519 manufacturing process Methods 0.000 description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 238000000347 anisotropic wet etching Methods 0.000 description 7
- 239000007769 metal material Substances 0.000 description 5
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 4
- HVJWSZOEEIYKSS-UHFFFAOYSA-N 2-sulfobenzoic acid;hydrate Chemical compound O.OC(=O)C1=CC=CC=C1S(O)(=O)=O HVJWSZOEEIYKSS-UHFFFAOYSA-N 0.000 description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 4
- 239000012964 benzotriazole Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
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- 238000005498 polishing Methods 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 description 3
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 3
- 238000003486 chemical etching Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000003618 dip coating Methods 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 229910001092 metal group alloy Inorganic materials 0.000 description 3
- 238000001127 nanoimprint lithography Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 230000027756 respiratory electron transport chain Effects 0.000 description 3
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- GWXQTTKUYBEZBP-UHFFFAOYSA-N 1h-benzimidazol-1-ium-2-sulfonate Chemical compound C1=CC=C2NC(S(=O)(=O)O)=NC2=C1 GWXQTTKUYBEZBP-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- KBIWNQVZKHSHTI-UHFFFAOYSA-N 4-n,4-n-dimethylbenzene-1,4-diamine;oxalic acid Chemical compound OC(=O)C(O)=O.CN(C)C1=CC=C(N)C=C1 KBIWNQVZKHSHTI-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004630 atomic force microscopy Methods 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
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- 239000011521 glass Substances 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
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- 102220047090 rs6152 Human genes 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
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- 238000003860 storage Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
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- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/14—Etching locally
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/081,762 US20060207890A1 (en) | 2005-03-15 | 2005-03-15 | Electrochemical etching |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006257553A true JP2006257553A (ja) | 2006-09-28 |
| JP2006257553A5 JP2006257553A5 (enExample) | 2009-04-23 |
Family
ID=37009178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006070731A Pending JP2006257553A (ja) | 2005-03-15 | 2006-03-15 | 電気化学エッチング |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US20060207890A1 (enExample) |
| JP (1) | JP2006257553A (enExample) |
Families Citing this family (70)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7569490B2 (en) * | 2005-03-15 | 2009-08-04 | Wd Media, Inc. | Electrochemical etching |
| US20060207890A1 (en) | 2005-03-15 | 2006-09-21 | Norbert Staud | Electrochemical etching |
| JP5117895B2 (ja) | 2008-03-17 | 2013-01-16 | ダブリュディ・メディア・シンガポール・プライベートリミテッド | 磁気記録媒体及びその製造方法 |
| JP2009238299A (ja) | 2008-03-26 | 2009-10-15 | Hoya Corp | 垂直磁気記録媒体および垂直磁気記録媒体の製造方法 |
| JP5453666B2 (ja) | 2008-03-30 | 2014-03-26 | ダブリュディ・メディア・シンガポール・プライベートリミテッド | 磁気ディスク及びその製造方法 |
| WO2010038773A1 (ja) | 2008-09-30 | 2010-04-08 | Hoya株式会社 | 磁気ディスク及びその製造方法 |
| US8877359B2 (en) | 2008-12-05 | 2014-11-04 | Wd Media (Singapore) Pte. Ltd. | Magnetic disk and method for manufacturing same |
| WO2010116908A1 (ja) | 2009-03-28 | 2010-10-14 | Hoya株式会社 | 磁気ディスク用潤滑剤化合物及び磁気ディスク |
| JP2010257567A (ja) | 2009-03-30 | 2010-11-11 | Wd Media Singapore Pte Ltd | 垂直磁気記録媒体およびその製造方法 |
| US20100300884A1 (en) | 2009-05-26 | 2010-12-02 | Wd Media, Inc. | Electro-deposited passivation coatings for patterned media |
| US8492009B1 (en) | 2009-08-25 | 2013-07-23 | Wd Media, Inc. | Electrochemical etching of magnetic recording layer |
| US8496466B1 (en) | 2009-11-06 | 2013-07-30 | WD Media, LLC | Press system with interleaved embossing foil holders for nano-imprinting of recording media |
| US9330685B1 (en) | 2009-11-06 | 2016-05-03 | WD Media, LLC | Press system for nano-imprinting of recording media with a two step pressing method |
| JP5643516B2 (ja) | 2010-01-08 | 2014-12-17 | ダブリュディ・メディア・シンガポール・プライベートリミテッド | 垂直磁気記録媒体 |
| JP5574414B2 (ja) | 2010-03-29 | 2014-08-20 | ダブリュディ・メディア・シンガポール・プライベートリミテッド | 磁気ディスクの評価方法及び磁気ディスクの製造方法 |
| JP5634749B2 (ja) | 2010-05-21 | 2014-12-03 | ダブリュディ・メディア・シンガポール・プライベートリミテッド | 垂直磁気ディスク |
| JP5645476B2 (ja) | 2010-05-21 | 2014-12-24 | ダブリュディ・メディア・シンガポール・プライベートリミテッド | 垂直磁気ディスク |
| JP2011248969A (ja) | 2010-05-28 | 2011-12-08 | Wd Media (Singapore) Pte. Ltd | 垂直磁気ディスク |
| JP2011248967A (ja) | 2010-05-28 | 2011-12-08 | Wd Media (Singapore) Pte. Ltd | 垂直磁気ディスクの製造方法 |
| JP2011248968A (ja) | 2010-05-28 | 2011-12-08 | Wd Media (Singapore) Pte. Ltd | 垂直磁気ディスク |
| JP2012009086A (ja) | 2010-06-22 | 2012-01-12 | Wd Media (Singapore) Pte. Ltd | 垂直磁気記録媒体及びその製造方法 |
| US8889275B1 (en) | 2010-08-20 | 2014-11-18 | WD Media, LLC | Single layer small grain size FePT:C film for heat assisted magnetic recording media |
| US8743666B1 (en) | 2011-03-08 | 2014-06-03 | Western Digital Technologies, Inc. | Energy assisted magnetic recording medium capable of suppressing high DC readback noise |
| US8711499B1 (en) | 2011-03-10 | 2014-04-29 | WD Media, LLC | Methods for measuring media performance associated with adjacent track interference |
| US8491800B1 (en) | 2011-03-25 | 2013-07-23 | WD Media, LLC | Manufacturing of hard masks for patterning magnetic media |
| US9028985B2 (en) | 2011-03-31 | 2015-05-12 | WD Media, LLC | Recording media with multiple exchange coupled magnetic layers |
| US8565050B1 (en) | 2011-12-20 | 2013-10-22 | WD Media, LLC | Heat assisted magnetic recording media having moment keeper layer |
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| US8941950B2 (en) | 2012-05-23 | 2015-01-27 | WD Media, LLC | Underlayers for heat assisted magnetic recording (HAMR) media |
| US8993134B2 (en) | 2012-06-29 | 2015-03-31 | Western Digital Technologies, Inc. | Electrically conductive underlayer to grow FePt granular media with (001) texture on glass substrates |
| US9034492B1 (en) | 2013-01-11 | 2015-05-19 | WD Media, LLC | Systems and methods for controlling damping of magnetic media for heat assisted magnetic recording |
| US10115428B1 (en) | 2013-02-15 | 2018-10-30 | Wd Media, Inc. | HAMR media structure having an anisotropic thermal barrier layer |
| US9153268B1 (en) | 2013-02-19 | 2015-10-06 | WD Media, LLC | Lubricants comprising fluorinated graphene nanoribbons for magnetic recording media structure |
| US9183867B1 (en) | 2013-02-21 | 2015-11-10 | WD Media, LLC | Systems and methods for forming implanted capping layers in magnetic media for magnetic recording |
| US9196283B1 (en) | 2013-03-13 | 2015-11-24 | Western Digital (Fremont), Llc | Method for providing a magnetic recording transducer using a chemical buffer |
| US9190094B2 (en) | 2013-04-04 | 2015-11-17 | Western Digital (Fremont) | Perpendicular recording media with grain isolation initiation layer and exchange breaking layer for signal-to-noise ratio enhancement |
| US9093122B1 (en) | 2013-04-05 | 2015-07-28 | WD Media, LLC | Systems and methods for improving accuracy of test measurements involving aggressor tracks written to disks of hard disk drives |
| US8947987B1 (en) | 2013-05-03 | 2015-02-03 | WD Media, LLC | Systems and methods for providing capping layers for heat assisted magnetic recording media |
| US8867322B1 (en) | 2013-05-07 | 2014-10-21 | WD Media, LLC | Systems and methods for providing thermal barrier bilayers for heat assisted magnetic recording media |
| US9296082B1 (en) | 2013-06-11 | 2016-03-29 | WD Media, LLC | Disk buffing apparatus with abrasive tape loading pad having a vibration absorbing layer |
| US9406330B1 (en) | 2013-06-19 | 2016-08-02 | WD Media, LLC | Method for HDD disk defect source detection |
| US9607646B2 (en) | 2013-07-30 | 2017-03-28 | WD Media, LLC | Hard disk double lubrication layer |
| US9389135B2 (en) | 2013-09-26 | 2016-07-12 | WD Media, LLC | Systems and methods for calibrating a load cell of a disk burnishing machine |
| US9177585B1 (en) | 2013-10-23 | 2015-11-03 | WD Media, LLC | Magnetic media capable of improving magnetic properties and thermal management for heat-assisted magnetic recording |
| US9581510B1 (en) | 2013-12-16 | 2017-02-28 | Western Digital Technologies, Inc. | Sputter chamber pressure gauge with vibration absorber |
| US9382496B1 (en) | 2013-12-19 | 2016-07-05 | Western Digital Technologies, Inc. | Lubricants with high thermal stability for heat-assisted magnetic recording |
| US9824711B1 (en) | 2014-02-14 | 2017-11-21 | WD Media, LLC | Soft underlayer for heat assisted magnetic recording media |
| US9447368B1 (en) | 2014-02-18 | 2016-09-20 | WD Media, LLC | Detergent composition with low foam and high nickel solubility |
| US9431045B1 (en) | 2014-04-25 | 2016-08-30 | WD Media, LLC | Magnetic seed layer used with an unbalanced soft underlayer |
| US9042053B1 (en) | 2014-06-24 | 2015-05-26 | WD Media, LLC | Thermally stabilized perpendicular magnetic recording medium |
| US9159350B1 (en) | 2014-07-02 | 2015-10-13 | WD Media, LLC | High damping cap layer for magnetic recording media |
| US10054363B2 (en) | 2014-08-15 | 2018-08-21 | WD Media, LLC | Method and apparatus for cryogenic dynamic cooling |
| US9082447B1 (en) | 2014-09-22 | 2015-07-14 | WD Media, LLC | Determining storage media substrate material type |
| US9685184B1 (en) | 2014-09-25 | 2017-06-20 | WD Media, LLC | NiFeX-based seed layer for magnetic recording media |
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| US9257134B1 (en) | 2014-12-24 | 2016-02-09 | Western Digital Technologies, Inc. | Allowing fast data zone switches on data storage devices |
| US9990940B1 (en) | 2014-12-30 | 2018-06-05 | WD Media, LLC | Seed structure for perpendicular magnetic recording media |
| US9280998B1 (en) | 2015-03-30 | 2016-03-08 | WD Media, LLC | Acidic post-sputter wash for magnetic recording media |
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| US9822441B2 (en) | 2015-03-31 | 2017-11-21 | WD Media, LLC | Iridium underlayer for heat assisted magnetic recording media |
| US11074934B1 (en) | 2015-09-25 | 2021-07-27 | Western Digital Technologies, Inc. | Heat assisted magnetic recording (HAMR) media with Curie temperature reduction layer |
| US10236026B1 (en) | 2015-11-06 | 2019-03-19 | WD Media, LLC | Thermal barrier layers and seed layers for control of thermal and structural properties of HAMR media |
| US9406329B1 (en) | 2015-11-30 | 2016-08-02 | WD Media, LLC | HAMR media structure with intermediate layer underlying a magnetic recording layer having multiple sublayers |
| US10121506B1 (en) | 2015-12-29 | 2018-11-06 | WD Media, LLC | Magnetic-recording medium including a carbon overcoat implanted with nitrogen and hydrogen |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60178654A (ja) * | 1984-02-24 | 1985-09-12 | Sumitomo Metal Mining Co Ltd | サ−デイツプのリ−ドの酸化被膜の除去方法 |
| JPH08191687A (ja) * | 1994-09-02 | 1996-07-30 | Exxon Res & Eng Co | 尿素−界面活性剤クラスレート並びにそれの炭化水素含有土壌及び水のバイオリミジエーションへの使用 |
| WO1998042787A1 (en) * | 1997-03-25 | 1998-10-01 | Seiko Epson Corporation | Inks for ink-jet recording |
| JP2002513445A (ja) * | 1996-09-06 | 2002-05-08 | オブデュキャット、アクチボラグ | 導電材料内の構造の異方性エッチング方法 |
| JP2004141990A (ja) * | 2002-10-22 | 2004-05-20 | Sony Corp | 電解研磨組成物 |
| JP2005506457A (ja) * | 2001-10-23 | 2005-03-03 | アトテック・ドイチュラント・ゲーエムベーハー | 無電解ニッケルを剥離するための電解方法および組成物 |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4032379A (en) * | 1974-02-11 | 1977-06-28 | Philip A. Hunt Chemical Corporation | Nitric acid system for etching magnesium plates |
| US4279707A (en) * | 1978-12-18 | 1981-07-21 | International Business Machines Corporation | Electroplating of nickel-iron alloys for uniformity of nickel/iron ratio using a low density plating current |
| DE2917654A1 (de) * | 1979-05-02 | 1980-11-13 | Ibm Deutschland | Anordnung und verfahren zum selektiven, elektrochemischen aetzen |
| US4412934A (en) * | 1982-06-30 | 1983-11-01 | The Procter & Gamble Company | Bleaching compositions |
| US4629539A (en) * | 1982-07-08 | 1986-12-16 | Tdk Corporation | Metal layer patterning method |
| US4483781A (en) * | 1983-09-02 | 1984-11-20 | The Procter & Gamble Company | Magnesium salts of peroxycarboxylic acids |
| US4472248A (en) * | 1982-12-20 | 1984-09-18 | Minnesota Mining And Manufacturing Company | Method of making thin-film magnetic recording medium having perpendicular anisotropy |
| JPS6092431A (ja) | 1983-10-27 | 1985-05-24 | Mitsui Alum Kogyo Kk | 金属イオンの溶媒抽出方法 |
| US4537706A (en) * | 1984-05-14 | 1985-08-27 | The Procter & Gamble Company | Liquid detergents containing boric acid to stabilize enzymes |
| US4634551A (en) * | 1985-06-03 | 1987-01-06 | Procter & Gamble Company | Bleaching compounds and compositions comprising fatty peroxyacids salts thereof and precursors therefor having amide moieties in the fatty chain |
| DE3805752A1 (de) | 1988-02-24 | 1989-08-31 | Fraunhofer Ges Forschung | Anisotropes aetzverfahren mit elektrochemischem aetzstop |
| US4977038A (en) | 1989-04-14 | 1990-12-11 | Karl Sieradzki | Micro- and nano-porous metallic structures |
| US5071510A (en) * | 1989-09-22 | 1991-12-10 | Robert Bosch Gmbh | Process for anisotropic etching of silicon plates |
| US5167776A (en) * | 1991-04-16 | 1992-12-01 | Hewlett-Packard Company | Thermal inkjet printhead orifice plate and method of manufacture |
| EP0601020B1 (en) * | 1991-08-21 | 1997-07-09 | The Procter & Gamble Company | Detergent compositions containing lipase and terpene |
| US5194127A (en) * | 1992-01-24 | 1993-03-16 | Asahi Glass Company Ltd. | Method for etching an aluminum foil for an electrolytic capacitor |
| DE4202454C1 (enExample) | 1992-01-29 | 1993-07-29 | Siemens Ag, 8000 Muenchen, De | |
| TW263531B (enExample) * | 1992-03-11 | 1995-11-21 | Mitsubishi Gas Chemical Co | |
| EP0563744B1 (en) | 1992-03-30 | 1998-09-09 | Seiko Instruments Inc. | Method of electrochemical fine processing |
| JP2952539B2 (ja) | 1992-03-30 | 1999-09-27 | セイコーインスツルメンツ株式会社 | 微細加工装置 |
| MX9305898A (es) | 1992-10-30 | 1995-01-31 | Texas Instruments Inc | Metodo de grabado fotoquimico anisotropico para la fabricacion decircuitos integrados. |
| JP2781954B2 (ja) * | 1994-03-04 | 1998-07-30 | メック株式会社 | 銅および銅合金の表面処理剤 |
| MA24137A1 (fr) * | 1996-04-16 | 1997-12-31 | Procter & Gamble | Fabrication d'agents de surface ramifies . |
| US6159076A (en) * | 1998-05-28 | 2000-12-12 | Komag, Inc. | Slurry comprising a ligand or chelating agent for polishing a surface |
| US6426254B2 (en) * | 1999-06-09 | 2002-07-30 | Infineon Technologies Ag | Method for expanding trenches by an anisotropic wet etch |
| US6410442B1 (en) * | 1999-08-18 | 2002-06-25 | Advanced Micro Devices, Inc. | Mask-less differential etching and planarization of copper films |
| US6867148B2 (en) | 2001-05-16 | 2005-03-15 | Micron Technology, Inc. | Removal of organic material in integrated circuit fabrication using ozonated organic acid solutions |
| AU2003243506A1 (en) * | 2002-06-12 | 2003-12-31 | Faraday Technology, Inc. | Electrolytic etching of metal layers |
| US6984301B2 (en) * | 2002-07-18 | 2006-01-10 | Micron Technology, Inc. | Methods of forming capacitor constructions |
| US20040209123A1 (en) * | 2003-04-17 | 2004-10-21 | Bajorek Christopher H. | Method of fabricating a discrete track recording disk using a bilayer resist for metal lift-off |
| US7485241B2 (en) * | 2003-09-11 | 2009-02-03 | Cabot Microelectronics Corporation | Chemical-mechanical polishing composition and method for using the same |
| US7247566B2 (en) | 2003-10-23 | 2007-07-24 | Dupont Air Products Nanomaterials Llc | CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers |
| US7611588B2 (en) * | 2004-11-30 | 2009-11-03 | Ecolab Inc. | Methods and compositions for removing metal oxides |
| US20060163083A1 (en) * | 2005-01-21 | 2006-07-27 | International Business Machines Corporation | Method and composition for electro-chemical-mechanical polishing |
| US20060207890A1 (en) | 2005-03-15 | 2006-09-21 | Norbert Staud | Electrochemical etching |
| US7569490B2 (en) * | 2005-03-15 | 2009-08-04 | Wd Media, Inc. | Electrochemical etching |
-
2005
- 2005-03-15 US US11/081,762 patent/US20060207890A1/en not_active Abandoned
-
2006
- 2006-03-15 JP JP2006070731A patent/JP2006257553A/ja active Pending
-
2010
- 2010-12-13 US US12/966,859 patent/US9068274B1/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60178654A (ja) * | 1984-02-24 | 1985-09-12 | Sumitomo Metal Mining Co Ltd | サ−デイツプのリ−ドの酸化被膜の除去方法 |
| JPH08191687A (ja) * | 1994-09-02 | 1996-07-30 | Exxon Res & Eng Co | 尿素−界面活性剤クラスレート並びにそれの炭化水素含有土壌及び水のバイオリミジエーションへの使用 |
| JP2002513445A (ja) * | 1996-09-06 | 2002-05-08 | オブデュキャット、アクチボラグ | 導電材料内の構造の異方性エッチング方法 |
| WO1998042787A1 (en) * | 1997-03-25 | 1998-10-01 | Seiko Epson Corporation | Inks for ink-jet recording |
| JP2005506457A (ja) * | 2001-10-23 | 2005-03-03 | アトテック・ドイチュラント・ゲーエムベーハー | 無電解ニッケルを剥離するための電解方法および組成物 |
| JP2004141990A (ja) * | 2002-10-22 | 2004-05-20 | Sony Corp | 電解研磨組成物 |
Also Published As
| Publication number | Publication date |
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| US20060207890A1 (en) | 2006-09-21 |
| US9068274B1 (en) | 2015-06-30 |
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