JP2006257408A5 - - Google Patents
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- Publication number
- JP2006257408A5 JP2006257408A5 JP2006036875A JP2006036875A JP2006257408A5 JP 2006257408 A5 JP2006257408 A5 JP 2006257408A5 JP 2006036875 A JP2006036875 A JP 2006036875A JP 2006036875 A JP2006036875 A JP 2006036875A JP 2006257408 A5 JP2006257408 A5 JP 2006257408A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive adhesive
- adhesive according
- component
- weight
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims 12
- 230000001070 adhesive effect Effects 0.000 claims 12
- 239000002184 metal Substances 0.000 claims 9
- 229910052751 metal Inorganic materials 0.000 claims 9
- 239000000945 filler Substances 0.000 claims 7
- 239000011347 resin Substances 0.000 claims 6
- 229920005989 resin Polymers 0.000 claims 6
- 230000001603 reducing effect Effects 0.000 claims 2
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 150000002894 organic compounds Chemical class 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 229910052708 sodium Inorganic materials 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006036875A JP4939072B2 (ja) | 2005-02-15 | 2006-02-14 | 導電性接着剤 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005037490 | 2005-02-15 | ||
| JP2005037490 | 2005-02-15 | ||
| JP2006036875A JP4939072B2 (ja) | 2005-02-15 | 2006-02-14 | 導電性接着剤 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006257408A JP2006257408A (ja) | 2006-09-28 |
| JP2006257408A5 true JP2006257408A5 (enExample) | 2009-01-22 |
| JP4939072B2 JP4939072B2 (ja) | 2012-05-23 |
Family
ID=37097008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006036875A Expired - Fee Related JP4939072B2 (ja) | 2005-02-15 | 2006-02-14 | 導電性接着剤 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4939072B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7910837B2 (en) | 2007-08-10 | 2011-03-22 | Napra Co., Ltd. | Circuit board, electronic device and method for manufacturing the same |
| JP4678654B2 (ja) * | 2007-09-03 | 2011-04-27 | 有限会社ナプラ | 電子デバイス。 |
| JP4998520B2 (ja) | 2009-06-15 | 2012-08-15 | 住友電気工業株式会社 | 電極の接続方法、電極の接続構造及び電子機器 |
| JP5440478B2 (ja) * | 2010-11-12 | 2014-03-12 | 住友電気工業株式会社 | 異方導電性接着剤、電極の接続構造及び電子機器 |
| JP6310954B2 (ja) * | 2015-05-29 | 2018-04-11 | 株式会社タムラ製作所 | 導電性接着剤および電子基板の製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61287974A (ja) * | 1985-06-14 | 1986-12-18 | Showa Electric Wire & Cable Co Ltd | 異方導電性接着剤 |
| DE4443459C2 (de) * | 1994-12-07 | 1996-11-21 | Wieland Werke Ag | Bleifreies Weichlot und seine Verwendung |
-
2006
- 2006-02-14 JP JP2006036875A patent/JP4939072B2/ja not_active Expired - Fee Related
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