JP2006253194A - 半導体装置およびその製造方法 - Google Patents

半導体装置およびその製造方法 Download PDF

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Publication number
JP2006253194A
JP2006253194A JP2005063884A JP2005063884A JP2006253194A JP 2006253194 A JP2006253194 A JP 2006253194A JP 2005063884 A JP2005063884 A JP 2005063884A JP 2005063884 A JP2005063884 A JP 2005063884A JP 2006253194 A JP2006253194 A JP 2006253194A
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JP
Japan
Prior art keywords
electrode
insulating film
film
semiconductor device
plug
Prior art date
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Withdrawn
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JP2005063884A
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English (en)
Japanese (ja)
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JP2006253194A5 (enExample
Inventor
Toyoji Ito
豊二 伊東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
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Priority to JP2005063884A priority Critical patent/JP2006253194A/ja
Publication of JP2006253194A publication Critical patent/JP2006253194A/ja
Publication of JP2006253194A5 publication Critical patent/JP2006253194A5/ja
Withdrawn legal-status Critical Current

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  • Semiconductor Integrated Circuits (AREA)
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JP2005063884A 2005-03-08 2005-03-08 半導体装置およびその製造方法 Withdrawn JP2006253194A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005063884A JP2006253194A (ja) 2005-03-08 2005-03-08 半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005063884A JP2006253194A (ja) 2005-03-08 2005-03-08 半導体装置およびその製造方法

Publications (2)

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JP2006253194A true JP2006253194A (ja) 2006-09-21
JP2006253194A5 JP2006253194A5 (enExample) 2006-12-28

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JP2005063884A Withdrawn JP2006253194A (ja) 2005-03-08 2005-03-08 半導体装置およびその製造方法

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JP (1) JP2006253194A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8367428B2 (en) 2006-11-14 2013-02-05 Fujitsu Semiconductor Limited Semiconductor device and manufacturing method thereof
JP2014057104A (ja) * 2013-12-16 2014-03-27 Fujitsu Semiconductor Ltd 半導体装置及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8367428B2 (en) 2006-11-14 2013-02-05 Fujitsu Semiconductor Limited Semiconductor device and manufacturing method thereof
JP2014057104A (ja) * 2013-12-16 2014-03-27 Fujitsu Semiconductor Ltd 半導体装置及びその製造方法

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