JP2006229211A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2006229211A JP2006229211A JP2006011926A JP2006011926A JP2006229211A JP 2006229211 A JP2006229211 A JP 2006229211A JP 2006011926 A JP2006011926 A JP 2006011926A JP 2006011926 A JP2006011926 A JP 2006011926A JP 2006229211 A JP2006229211 A JP 2006229211A
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Abstract
【解決手段】アンテナ、記憶素子及びトランジスタの3つを含み、アンテナとして機能する導電層は、トランジスタ又は記憶素子が含む導電層と同じ層に設けることを特徴とする。上記特徴により、アンテナとして機能する導電層を形成する工程を独立して設ける必要がなく、アンテナとして機能する導電層を形成する工程と、他の素子の導電層を形成する工程を同時に行うことができる。従って、作製工程を簡略化し、作製費用を抑制し、歩留まりの低下を抑制することができる。
【選択図】図1
Description
(実施の形態1)
(実施の形態2)
(実施の形態3)
(実施の形態4)
(実施の形態5)
(実施の形態6)
(実施の形態7)
(実施の形態8)
(実施の形態9)
(実施の形態10)
本実施例は、上記の実施の形態、実施例と自由に組み合わせることができる。
Claims (21)
- 半導体層、ゲート絶縁層である第1の絶縁層及びゲート電極である第1の導電層を含むトランジスタと、
前記トランジスタを覆う第2の絶縁層と、
前記第2の絶縁層に設けられた開口部を介して前記半導体層の不純物領域に接続された第2の導電層と、
前記第2の導電層に接続された有機化合物を含む層と、
前記有機化合物を含む層に接続された第3の導電層と、
アンテナとして機能する第4の導電層と、を有し、
前記第4の導電層は、前記第1の導電層、前記第2の導電層及び前記第3の導電層の少なくとも1つと同じ層に設けられた導電層であることを特徴とする半導体装置。 - 請求項1において、前記トランジスタ、前記第2の絶縁層、前記第2の導電層、前記有機化合物を含む層、前記第3の導電層及び前記第4の導電層は、同じ基板上に設けられていることを特徴とする半導体装置。
- 半導体層、ゲート絶縁層である第1の絶縁層及びゲート電極である第1の導電層を含むトランジスタと、
前記トランジスタを覆う第2の絶縁層と、
前記第2の絶縁層に設けられた開口部を介して前記半導体層の不純物領域に接続された第2の導電層と、
前記第2の導電層を覆う第3の絶縁層と、
前記第3の絶縁層に設けられた開口部を介して前記第2の導電層に接続された第3の導電層と、
前記第3の導電層に接続された有機化合物を含む層と、
前記有機化合物を含む層に接続された第4の導電層と、
アンテナとして機能する第5の導電層と、を有し、
前記第5の導電層は、前記第1の導電層、前記第2の導電層、前記第3の導電層及び前記第4の導電層の少なくとも1つと同じ層に設けられた導電層であることを特徴とする半導体装置。 - 請求項3において、前記トランジスタ、前記第2の絶縁層、前記第2の導電層、前記第3の絶縁層、前記第3の導電層、前記有機化合物を含む層、前記第4の導電層及び前記第5の導電層は、同じ基板上に設けられていることを特徴とする半導体装置。
- 半導体層、ゲート絶縁層である第1の絶縁層及びゲート電極である第1の導電層を含むトランジスタと、
前記トランジスタを覆う第2の絶縁層と、
前記第2の絶縁層に設けられた開口部を介して前記半導体層の不純物領域に接続された第2の導電層と、
前記第2の導電層を覆う第3の絶縁層と、
前記第3の絶縁層に設けられた開口部を介して前記第2の導電層に接続された有機化合物を含む層と、
前記有機化合物を含む層に接する第3の導電層と、
アンテナとして機能する第4の導電層と、を有し、
前記第4の導電層は、前記第1の導電層、前記第2の導電層及び前記第3の導電層の少なくとも1つと同じ層に設けられた導電層であることを特徴とする半導体装置。 - 請求項5において、前記トランジスタ、前記第2の絶縁層、前記第2の導電層、前記第3の絶縁層、前記有機化合物を含む層、前記第3の導電層及び前記第4の導電層は、同じ基板上に設けられていることを特徴とする半導体装置。
- 半導体層、ゲート絶縁層である第1の絶縁層及びゲート電極である第1の導電層を含むトランジスタと、
前記トランジスタを覆う第2の絶縁層と、
前記第2の絶縁層に設けられた開口部を介して前記半導体層の不純物領域に接続された第2の導電層と、
前記第2の導電層を覆う第3の絶縁層と、
前記第3の絶縁層に設けられた開口部を介して前記第2の導電層に接続された第3の導電層と、
前記第3の導電層を覆う第4の絶縁層と、
前記第4の絶縁層に設けられた開口部を介して前記第3の導電層に接続された有機化合物を含む層と、
前記有機化合物を含む層に接続された第4の導電層と、
アンテナとして機能する第5の導電層と、を有し、
前記第5の導電層は、前記第1の導電層、前記第2の導電層、前記第3の導電層及び前記第4の導電層の少なくとも1つと同じ層に設けられた導電層であることを特徴とする半導体装置。 - 請求項7において、前記トランジスタ、前記第2の絶縁層、前記第2の導電層、前記第3の絶縁層、前記第3の導電層、前記第4の絶縁層、前記有機化合物を含む層、前記第4の導電層及び前記第5の導電層は、同じ基板上に設けられていることを特徴とする半導体装置。
- 第1の基板上に設けられた第1の導電層と、
前記第1の導電層に接続された有機化合物を含む層と、
前記有機化合物を含む層に接続された第2の導電層と、
第2の基板上に設けられ、半導体層、ゲート絶縁層である第1の絶縁層及びゲート電極である第3の導電層を含むトランジスタと、
前記トランジスタを覆う第2の絶縁層と、
前記第2の絶縁層に設けられた開口部を介して前記半導体層の不純物領域に接続された第4の導電層と、
前記第2の基板上に設けられ、アンテナとして機能する第5の導電層と、を有し、
前記第1の基板と前記第2の基板は、前記第1の導電層と前記第4の導電層、又は前記第2の導電層と前記第4の導電層とが接するように、導電性粒子を含む層を介して貼りあわされており、
前記第5の導電層は、前記第3の導電層と前記第4の導電層の少なくとも1つと同じ層に設けられた導電層であることを特徴とする半導体装置。 - 第1の基板上に設けられた第1の導電層と、
前記第1の導電層に接続された有機化合物を含む層と、
前記有機化合物を含む層に接続された第2の導電層を有し、
第2の基板上に設けられ、半導体層、ゲート絶縁層である第1の絶縁層及びゲート電極として機能する第3の導電層を含むトランジスタと、
前記トランジスタを覆う第2の絶縁層と、
前記第2の絶縁層に設けられた開口部を介して前記半導体層の不純物領域に接続された第4の導電層と、
前記第4の導電層を覆う第3の絶縁層と、
前記第3の絶縁層に設けられた開口部を介して前記第4の導電層に接続された第5の導電層と、
前記第2の基板上に設けられ、アンテナとして機能する第6の導電層と、を有し、
前記第1の基板と前記第2の基板は、前記第1の導電層と前記第5の導電層、又は前記第2の導電層と前記第5の導電層が接するように、導電性粒子を含む層を介して貼りあわされており、
前記第6の導電層は、前記第4の導電層と前記第5の導電層の少なくとも1つと同じ層に設けられた導電層であることを特徴とする半導体装置。 - 第1の基板上に設けられ、第1の半導体層、ゲート絶縁層である第1の絶縁層及びゲート電極である第1の導電層を含む第1のトランジスタと、
前記第1のトランジスタを覆う第2の絶縁層と、
前記第2の絶縁層に設けられた開口部を介して、前記第1の半導体層の不純物領域に接続された第2の導電層と、
前記第2の導電層に接続された有機化合物を含む層と、
前記有機化合物を含む層に接続された第3の導電層と、を有し、
第2の基板上に設けられ、第2の半導体層と、ゲート絶縁層である第3の絶縁層及びゲート電極である第4の導電層を含む第2のトランジスタと、
前記第2のトランジスタを覆う第4の絶縁層と、
前記第4の絶縁層に設けられた開口部を介して前記第2の半導体層の不純物領域に接続された第5の導電層と、
前記第2の基板上に設けられ、アンテナとして機能する第6の導電層と、を有し、
前記第1の基板と前記第2の基板は、前記第3の導電層と前記第5の導電層が接するように、導電性粒子を含む層を介して貼りあわされており、
前記第6の導電層は、前記第4の導電層と前記第5の導電層の少なくとも1つと同じ層に設けられた導電層であることを特徴とする半導体装置。 - 第1の基板上に設けられ、第1の半導体層、ゲート絶縁層である第1の絶縁層及びゲート電極である第1の導電層を含む第1のトランジスタと、
前記第1のトランジスタを覆う第2の絶縁層と、
前記第2の絶縁層に設けられた開口部を介して前記第1の半導体層の不純物領域に接続された第2の導電層と、
前記第2の導電層に接続された有機化合物を含む層と、
前記有機化合物を含む層に接続された第3の導電層と、
第2の基板上に設けられ、第2の半導体層、ゲート絶縁層である第3の絶縁層及びゲート電極である第4の導電層を含む第2のトランジスタと、
前記第2のトランジスタを覆う第4の絶縁層と、
前記第4の絶縁層に設けられた開口部を介して前記第2の半導体層の不純物領域に接続された第5の導電層と、
前記第5の導電層を覆う第5の絶縁層と、
前記第5の絶縁層に設けられた開口部を介して前記第5の導電層に接続された第6の導電層と、
前記第2の基板上に設けられ、アンテナとして機能する第7の導電層と、を有し、
前記第1の基板と前記第2の基板は、前記第3の導電層と前記第6の導電層が接するように、導電性粒子を含む層を介して貼りあわされており、
前記第7の導電層は、前記第4の導電層、前記第5の導電層及び前記第6の導電層の少なくとも1つと同じ層に設けられた導電層であることを特徴とする半導体装置。 - 第1の基板上に設けられた第1の導電層と、
前記第1の導電層に接続された有機化合物を含む層と、
前記有機化合物を含む層に接続された第2の導電層と、
前記第1の基板上に設けられ、アンテナとして機能する第3の導電層と、
第2の基板上に設けられ、半導体層、ゲート絶縁層である第1の絶縁層及びゲート電極である第4の導電層を含むトランジスタと、
前記トランジスタを覆う第2の絶縁層と、
前記第2の絶縁層に設けられた開口部を介して前記半導体層の不純物領域に接続された第5の導電層と、を有し、
前記第1の基板と前記第2の基板は、前記第1の導電層と前記第5の導電層、又は前記第2の導電層と前記第5の導電層が接するように、導電性粒子を含む層を介して貼りあわされており、
前記第3の導電層は、前記第1の導電層と前記第2の導電層の少なくとも1つと同じ層に設けられた導電層であることを特徴とする半導体装置。 - 基板上に設けられた第1の導電層と、
前記第1の導電層に接続された有機化合物を含む層と、
前記有機化合物を含む層に接続された第2の導電層と、
前記第2の導電層を覆う導電性粒子を含む層と、
前記導電性粒子を含む層を覆う第2の絶縁層と、
前記第2の絶縁層上に設けられ、半導体層、ゲート絶縁層である第3の絶縁層及びゲート電極である第3の導電層を含むトランジスタと、
前記トランジスタを覆う第4の絶縁層と、
前記第4の絶縁層に設けられた開口部を介して前記半導体層の不純物領域に接続された第4の導電層と、
前記第2の絶縁層と前記第4の絶縁層に設けられた開口部を介して前記導電性粒子を含む層に接続された第5の導電層と、
前記基板上に設けられ、アンテナとして機能する第6の導電層と、を有し、
前記第6の導電層は、前記第3の導電層と前記第4の導電層の少なくとも1つと同じ層に設けられた導電層であることを特徴とする半導体装置。 - 基板上に設けられた第1の導電層と、
前記第1の導電層に接続された有機化合物を含む層と、
前記有機化合物を含む層に接続された第2の導電層と、
前記第2の導電層を覆う導電性粒子を含む層と、
前記導電性粒子を含む層を覆う第2の絶縁層と、
前記第2の絶縁層上に設けられ、半導体層、ゲート絶縁層である第3の絶縁層及びゲート電極である第3の導電層を含むトランジスタと、
前記トランジスタを覆う第4の絶縁層と、
前記第4の絶縁層に設けられた開口部を介して前記半導体層の不純物領域に接続された第4の導電層と、
前記第2の絶縁層と前記第4の絶縁層に設けられた開口部を介して前記導電性粒子を含む層に接続された第5の導電層と、
前記第4の導電層と前記第5の導電層を覆う第5の絶縁層と、
前記第5の絶縁層に設けられた開口部を介して前記第4の導電層に接続された第6の導電層と、
前記基板上に設けられ、アンテナとして機能する第7の導電層と、を有し、
前記第7の導電層は、前記第3の導電層、前記第4の導電層及び前記第6の導電層の少なくとも1つと同じ層に設けられた導電層であることを特徴とする半導体装置。 - 基板上に設けられ、第1の半導体層、ゲート絶縁層である第1の絶縁層及びゲート電極である第1の導電層を含む第1のトランジスタと、
前記第1のトランジスタを覆う第2の絶縁層と、
前記第2の絶縁層に設けられた開口部を介して前記第1の半導体層の不純物領域に接続された第2の導電層と、
前記第2の導電層を覆う第3の絶縁層と、
前記第3の絶縁層に設けられた開口部を介して前記第2の導電層に接続された第3の導電層と、
前記第3の絶縁層に設けられた開口部を介して前記第2の導電層に接続された有機化合物を含む層と、
前記有機化合物を含む層に接続された第4の導電層と、
前記第4の導電層を覆う導電性粒子を含む層と、
前記導電性粒子を含む層を覆う第4の絶縁層と、
前記第4の絶縁層上に設けられ、第2の半導体層、ゲート絶縁層である第5の絶縁層及びゲート電極である第5の導電層を含む第2のトランジスタと、
前記第2のトランジスタ上の第6の絶縁層と、
前記第6の絶縁層に設けられた開口部を介して前記第2の半導体層の不純物領域に接続された第6の導電層と、
前記第4の絶縁層と前記第6の絶縁層に設けられた開口部を介して前記導電性粒子を含む層に接続された第7の導電層と、
前記基板上に設けられ、アンテナとして機能する第8の導電層と、を有し、
前記第8の導電層は、前記第5の導電層と前記第6の導電層の少なくとも1つと同じ層に設けられた導電層であることを特徴とする半導体装置。 - 基板上に設けられ、第1の半導体層、ゲート絶縁層である第1の絶縁層及びゲート電極である第1の導電層を含む第1のトランジスタと、
前記第1のトランジスタを覆う第2の絶縁層と、
前記第2の絶縁層に設けられた開口部を介して前記第1の半導体層の不純物領域に接続された第2の導電層と、
前記第2の導電層を覆う第3の絶縁層と、
前記第3の絶縁層に設けられた開口部を介して前記第2の導電層に接続された第3の導電層と、
前記第3の絶縁層に設けられた開口部を介して前記第2の導電層に接続された有機化合物を含む層と、
前記有機化合物を含む層に接続された第4の導電層と、
前記第4の導電層を覆う導電性粒子を含む層と、
前記導電性粒子を含む層を覆う第4の絶縁層と、
前記第4の絶縁層上に設けられ、第2の半導体層、ゲート絶縁層である第5の絶縁層及びゲート電極である第5の導電層を含む第2のトランジスタと、
前記第2のトランジスタ上の第6の絶縁層と、
前記第6の絶縁層に設けられた開口部を介して前記第2の半導体層の不純物領域に接続された第6の導電層と、
前記第4の絶縁層と前記第6の絶縁層に設けられた開口部を介して前記導電性粒子を含む層に接続された第7の導電層と、
前記第6の導電層と前記第7の導電層を覆う第7の絶縁層と、
前記第7の絶縁層に設けられた開口部を介して前記第6の導電層に接続された第8の導電層と、
前記基板上に設けられ、アンテナとして機能する第9の導電層と、を有し、
前記第9の導電層は、前記第5の導電層、前記第6の導電層及び前記第8の導電層の少なくとも1つと同じ層に設けられた導電層であることを特徴とする半導体装置。 - 基板上に設けられた第1の導電層と、
前記第1の導電層に接続された有機化合物を含む層と、
前記有機化合物を含む層に接続された第2の導電層と、
前記基板上に設けられ、アンテナとして機能する第3の導電層と、
前記第2の導電層上の導電性粒子を含む層と、
前記導電性粒子を含む層上の第1の絶縁層と、
前記第1の絶縁層上に設けられ、半導体層、ゲート絶縁層である第2の絶縁層及びゲート電極である第4の導電層を含むトランジスタと、
前記トランジスタを覆う第3の絶縁層と、
前記第3の絶縁層に設けられた開口部を介して前記半導体層の不純物領域に接続された第5の導電層と、
前記第1の絶縁層と前記第3の絶縁層に設けられた開口部を介して前記導電性粒子を含む層に接続された第6の導電層と、を有し、
前記第3の導電層は、前記第1の導電層と前記第2の導電層の少なくとも1つと同じ層に設けられた導電層であることを特徴とする半導体装置。 - 請求項1乃至請求項10、請求項13乃至請求項15、請求項18のいずれか一項において、
整流回路、変調回路、復調回路、クロック生成回路及び符号化回路から選択された1つ又は複数を有し、
前記整流回路、前記変調回路、前記復調回路、前記クロック生成回路及び前記符号化回路から選択された1つ又は複数は、前記トランジスタを含むことを特徴とする半導体装置。 - 請求項11、請求項12、請求項16又は請求項17のいずれか一項において、
整流回路、変調回路、復調回路、クロック生成回路及び符号化回路から選択された1つ又は複数を有し、
前記整流回路、前記変調回路、前記復調回路、前記クロック生成回路及び前記符号化回路から選択された1つ又は複数は、前記第1のトランジスタと前記第2のトランジスタの一方又は両方を含むことを特徴とする半導体装置。 - 請求項1乃至請求項18のいずれか一項において、
前記アンテナは、電磁波を交流の電気信号に変換し、
前記アンテナから供給される交流の電気信号を基に電源電位を生成する整流回路を有することを特徴とする半導体装置。
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EP1839335A4 (en) | 2011-09-14 |
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JP5025134B2 (ja) | 2012-09-12 |
WO2006078065A1 (en) | 2006-07-27 |
US8835907B2 (en) | 2014-09-16 |
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