JP2006196929A - 半導体装置とその製造方法 - Google Patents
半導体装置とその製造方法 Download PDFInfo
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- JP2006196929A JP2006196929A JP2006113172A JP2006113172A JP2006196929A JP 2006196929 A JP2006196929 A JP 2006196929A JP 2006113172 A JP2006113172 A JP 2006113172A JP 2006113172 A JP2006113172 A JP 2006113172A JP 2006196929 A JP2006196929 A JP 2006196929A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- Solid State Image Pick-Up Elements (AREA)
Abstract
【解決手段】外部端子5を有する中空型樹脂パッケージ1と、パッケージの内部底面にダイボンド剤で固着された半導体素子7と、パッケージの内部端子3と前記素子の電極端子9とを電気的に接続する導体10と、パッケージ内部の素子主面および前記素子裏面を除く領域であって、素子の電極端子と前記導体との接続部を含む領域に設けた吸湿性樹脂13と、パッケージ外囲器の上面に貼りつけられた透明ガラス板12とを有することを特徴とする半導体装置とする。
【選択図】図2
Description
ヤング率(Kgf/mm2) 4×10-2 2.4×103
透湿度(g/cm2)、24h 1.1 0.06
指触性(相対比較) 大 無し
熱伝導率(W/m.K) 0.18 0.20
本発明の第2の実施の形態における半導体装置14の構造を図3から図6を用いて説明する。本発明の中空型樹脂パッケージ1構成材料は実施形態1に記載の各材質と同様のもので形成される。本発明と実施形態1の相異は実施形態1の中空型樹脂パッケージ1を構成する外囲器と外囲器に形成された中空部と中空部周囲の封着面4と内部端子3とパッケージ底面2と外部端子5とパッケージ底面2の半導体素子7固着領域を包囲するように形成された隔壁19を備える点である。
2 パッケージ底面
3 内部端子
4 封着面(外囲器中空部上面)
5 外部端子
6 固着物(DB剤)
7 半導体素子
8 主面
9 電極端子(ボンディングパッド)
10 導体(金属細線)
11 封着物
12 ガラス板
13 ゲル状吸湿性樹脂
14 半導体装置
16 溝
17 塊(乾燥剤)
18 導電性固着台
19 隔壁
Claims (8)
- 外部端子を有する中空型樹脂パッケージと、前記パッケージの内部底面にダイボンド剤で固着された半導体素子と、前記パッケージの内部端子と前記素子の電極端子とを電気的に接続する導体と、前記パッケージ内部の前記素子主面および前記素子裏面を除く領域であって、前記素子の電極端子と前記導体との接続部を含む領域に設けた吸湿性樹脂と、前記パッケージ外囲器の上面に貼りつけられた透明ガラス板とを有することを特徴とする半導体装置。
- 半導体素子の固着領域を包囲するように内部底面に設けられた隔壁と外部端子とを有する中空型樹脂パッケージと、前記パッケージの内部底面にダイボンド剤で固着された半導体素子と、前記パッケージの内部端子と前記素子の電極端子とを電気的に接続する導体と、前記パッケージ内部の前記素子主面および前記素子裏面を除く領域であって、前記素子の電極端子と前記導体との接続部を含み、かつ前記パッケージの外囲器内壁と前記隔壁との間に施した吸湿性樹脂と、前記パッケージの外囲器上面に貼りつけた透明ガラス板とを有することを特徴とする半導体装置。
- 前記パッケージ底面に溝を設け、前記溝に乾燥剤の環状もしくは分割状の塊を前記吸湿性樹脂中に埋設する状態で備えたことを特徴とする請求項1または請求項2に記載の半導体装置。
- 前記吸湿性樹脂は粘着性を有することを特徴とする請求項1ないし請求項3のいずれかに記載の半導体装置。
- 前記吸湿性樹脂はゲル状シリコーン樹脂と硬化剤とを加熱硬化して得られ、前記シリコーン樹脂中に粒径が1μmから200μmの粉末シリカゲルまたはモレキュラーシーブズの吸湿性充填剤を混ぜて用いることを特徴とする請求項1ないし請求項4のいずれかに記載の半導体装置。
- 前記ゲル状シリコーン樹脂に暗色顔料を混ぜて用いることを特徴とする請求項5に記載の半導体装置。
- 前記導体は金属細線であることを特徴とする請求項1ないし請求項6のいずれかに記載の半導体装置。
- 中空樹脂型パッケージを酸素プラズマまたはアルゴンスパッタで表面改質処理する工程と、前記パッケージ底面にダイボンド剤で半導体素子を固着する工程と、前記パッケージ内部端子と前記素子の電極端子とを導体で電気的に接続する工程と、前記パッケージ内部の前記素子主面および前記素子裏面を除く領域であって、前記素子の電極端子と前記導体との接続部を含む領域に吸湿性樹脂を塗布する工程と、透明ガラス板を前記パッケージ枠部の上面に貼りつける工程とを有することを特徴とする半導体装置の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006113172A JP4446977B2 (ja) | 2006-04-17 | 2006-04-17 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
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JP2006113172A JP4446977B2 (ja) | 2006-04-17 | 2006-04-17 | 半導体装置の製造方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002178101A Division JP3885670B2 (ja) | 2002-06-19 | 2002-06-19 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
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JP2006196929A true JP2006196929A (ja) | 2006-07-27 |
JP4446977B2 JP4446977B2 (ja) | 2010-04-07 |
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JP2006113172A Expired - Fee Related JP4446977B2 (ja) | 2006-04-17 | 2006-04-17 | 半導体装置の製造方法 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008084987A (ja) * | 2006-09-26 | 2008-04-10 | Matsushita Electric Works Ltd | 真空封止デバイスおよびその製造方法 |
JP2010212528A (ja) * | 2009-03-12 | 2010-09-24 | Panasonic Corp | 光半導体装置用パッケージおよび光半導体装置 |
JP2011119239A (ja) * | 2009-10-27 | 2011-06-16 | Panasonic Electric Works Co Ltd | 発光モジュール |
CN102484102A (zh) * | 2009-08-24 | 2012-05-30 | 本田技研工业株式会社 | 电子器件以及电子器件的制造方法 |
-
2006
- 2006-04-17 JP JP2006113172A patent/JP4446977B2/ja not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008084987A (ja) * | 2006-09-26 | 2008-04-10 | Matsushita Electric Works Ltd | 真空封止デバイスおよびその製造方法 |
JP2010212528A (ja) * | 2009-03-12 | 2010-09-24 | Panasonic Corp | 光半導体装置用パッケージおよび光半導体装置 |
CN102484102A (zh) * | 2009-08-24 | 2012-05-30 | 本田技研工业株式会社 | 电子器件以及电子器件的制造方法 |
JP2011119239A (ja) * | 2009-10-27 | 2011-06-16 | Panasonic Electric Works Co Ltd | 発光モジュール |
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JP4446977B2 (ja) | 2010-04-07 |
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