JP2006179527A - アクチュエータ装置の製造方法及び液体噴射装置 - Google Patents
アクチュエータ装置の製造方法及び液体噴射装置 Download PDFInfo
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Abstract
【解決手段】 基板の一方面に振動板を形成する工程と、振動板上に下電極、圧電体層及び上電極からなる圧電素子を形成する工程とを具備し、振動板を形成する工程が、基板の一方面側にジルコニウム層を形成する成膜工程と、ジルコニウム層を所定の熱酸化温度で熱酸化させて酸化ジルコニウム層からなる絶縁体膜を形成すると同時に絶縁体膜の応力を調整する熱酸化工程とを少なくとも含む絶縁体膜形成工程を有するようにする。
【選択図】 なし
Description
かかる第1の態様では、絶縁体膜を形成する際にその応力調整を行うことで、割れ等を生じさせることなく振動板を形成することができる。また、圧電素子を含む膜全体を良好な応力状態とすることができ、圧電素子の変位特性を均一化したアクチュエータ装置を製造することができる。
かかる第2の態様では、絶縁体膜の応力をより確実に調整することができる。
かかる第3の態様では、絶縁体膜の応力をさらに確実に調整することができる。
かかる第4の態様では、ジルコニウム層を良好に熱酸化することができ、絶縁体膜の応力をより確実に調整することができる。
かかる第5の態様では、振動板を構成する絶縁体膜の密着力を向上させることができる。また、同一ウェハ内での絶縁体膜の密着力のばらつきも抑えることができる。
かかる第6の態様では、振動板の耐久性を向上すると共に、圧電素子の駆動による振動板の変位量を向上することができ、液滴の吐出特性を向上した液体噴射装置を実現することができる。
(実施形態1)
図1は、本発明の実施形態1に係るインクジェット式記録ヘッドを示す分解斜視図であり、図2は、図1の平面図及び断面図である。図示するように、流路形成基板10は、本実施形態では面方位(110)のシリコン単結晶基板からなり、その一方の面には予め熱酸化により形成した二酸化シリコンからなる、厚さ0.5〜2μmの弾性膜50が形成されている。流路形成基板10には、複数の圧力発生室12がその幅方向に並設されている。また、流路形成基板10の圧力発生室12の長手方向外側の領域には連通部13が形成され、連通部13と各圧力発生室12とが、各圧力発生室12毎に設けられたインク供給路14を介して連通されている。なお、連通部13は、後述する保護基板のリザーバ部と連通して各圧力発生室12の共通のインク室となるリザーバの一部を構成する。インク供給路14は、圧力発生室12よりも狭い幅で形成されており、連通部13から圧力発生室12に流入するインクの流路抵抗を一定に保持している。
以上、本発明の各実施形態を説明したが、本発明は、上述した実施形態に限定されるものではない。また、上述した実施形態においては、アクチュエータ装置を液体吐出手段として具備し液体噴射装置に搭載される液体噴射ヘッドの一例としてインクジェット式記録ヘッドを例示したが、本発明は、広くアクチュエータ装置の全般を対象としたものである。したがって、勿論、本発明は、インク以外の液体を噴射する液体噴射ヘッドにも適用することができる。その他の液体噴射ヘッドとしては、例えば、プリンタ等の画像記録装置に用いられる各種の記録ヘッド、液晶ディスプレー等のカラーフィルタの製造に用いられる色材噴射ヘッド、有機ELディスプレー、FED(面発光ディスプレー)等の電極形成に用いられる電極材料噴射ヘッド、バイオchip製造に用いられる生体有機物噴射ヘッド等が挙げられる。また、本発明は、液体噴射ヘッドに搭載されるアクチュエータ装置だけでなく、あらゆる装置に搭載されるアクチュエータ装置に適用できる。なお、アクチュエータ装置が搭載される他の装置としては、上述した液体噴射ヘッドの他に、例えば、センサー等が挙げられる。
Claims (6)
- 基板の一方面に振動板を形成する工程と、該振動板上に下電極、圧電体層及び上電極からなる圧電素子を形成する工程とを具備し、前記振動板を形成する工程が、前記基板の一方面側にジルコニウム層を形成する成膜工程と、該ジルコニウム層を所定の熱酸化温度で熱酸化させて酸化ジルコニウム層からなる絶縁体膜を形成すると同時に当該絶縁体膜の応力を調整する熱酸化工程とを少なくとも含む絶縁体膜形成工程を有することを特徴とするアクチュエータ装置の製造方法。
- 請求項1において、前記熱酸化工程では、前記熱酸化温度を制御することによって前記絶縁体膜の応力を調整することを特徴とするアクチュエータ装置の製造方法。
- 請求項1又は2において、前記熱酸化工程では、拡散炉によって前記ジルコニウム層を熱酸化させることを特徴とするアクチュエータ装置の製造方法。
- 請求項1〜3の何れかにおいて、前記ジルコニウム層を熱酸化する際の温度を800℃以上1000℃以下とすることを特徴とするアクチュエータ装置の製造方法。
- 請求項1〜4の何れかにおいて、前記絶縁体膜形成工程が、前記熱酸化工程後に実施されて前記絶縁体膜を前記熱酸化温度以下の温度でアニール処理して当該絶縁体膜の応力をさらに調整するアニール処理工程をさらに含むことを特徴とするアクチュエータ装置の製造方法。
- 請求項1〜5の何れかの製造方法によって製造されたアクチュエータ装置を液体吐出手段とする液体噴射ヘッドを備えたことを特徴とする液体噴射装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2004368221A JP4858670B2 (ja) | 2004-12-20 | 2004-12-20 | アクチュエータ装置の製造方法及び液体噴射装置 |
US11/295,608 US20060132549A1 (en) | 2004-12-20 | 2005-12-07 | Method for producing actuator device, and liquid-jet apparatus |
CNB2005101318703A CN100484765C (zh) | 2004-12-20 | 2005-12-15 | 制造致动器器件的方法和液体喷射设备 |
KR20050125520A KR100731438B1 (ko) | 2004-12-20 | 2005-12-19 | 액츄에이터 장치의 제조 방법 및 액체 분사 장치 |
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Cited By (2)
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JP2011062871A (ja) * | 2009-09-16 | 2011-03-31 | Seiko Epson Corp | 液滴噴射ヘッド及び液滴噴射装置 |
JP2012059770A (ja) * | 2010-09-06 | 2012-03-22 | Seiko Epson Corp | 圧電素子、液滴噴射ヘッドおよび液滴噴射装置ならびにそれらの製造方法 |
Families Citing this family (9)
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JP5089860B2 (ja) * | 2004-12-03 | 2012-12-05 | 富士フイルム株式会社 | 圧電アクチュエータ及び液体吐出ヘッド |
JP4858670B2 (ja) | 2004-12-20 | 2012-01-18 | セイコーエプソン株式会社 | アクチュエータ装置の製造方法及び液体噴射装置 |
KR20070083053A (ko) * | 2006-02-20 | 2007-08-23 | 삼성전자주식회사 | 엑츄에이터를 구비한 잉크젯 프린터 헤드, 이를 구비한잉크젯 프린팅 시스템 및 그 제어 방법 |
JP4296441B2 (ja) * | 2006-10-11 | 2009-07-15 | セイコーエプソン株式会社 | アクチュエータ装置の製造方法 |
US8029111B2 (en) * | 2007-11-05 | 2011-10-04 | Seiko Epson Corporation | Droplet ejection head and droplet ejection apparatus |
US8029110B2 (en) * | 2007-11-05 | 2011-10-04 | Seiko Epson Corporation | Droplet ejection head and droplet ejection apparatus |
KR20110088188A (ko) * | 2010-01-28 | 2011-08-03 | 삼성전기주식회사 | 잉크젯 프린트 헤드 및 잉크젯 프린트 헤드의 제조 방법 |
CN103252997B (zh) * | 2012-02-16 | 2015-12-16 | 珠海纳思达珠海赛纳打印科技股份有限公司 | 一种液体喷头及其制造方法 |
CN117087334A (zh) * | 2023-10-19 | 2023-11-21 | 季华实验室 | 打印喷头、喷墨打印设备及其控制方法、设备与存储介质 |
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US5944964A (en) * | 1997-02-13 | 1999-08-31 | Optical Coating Laboratory, Inc. | Methods and apparatus for preparing low net stress multilayer thin film coatings |
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JP4340048B2 (ja) * | 2001-08-28 | 2009-10-07 | セイコーエプソン株式会社 | 液体噴射ヘッド及び液体噴射装置 |
JP2004017613A (ja) * | 2002-06-20 | 2004-01-22 | Seiko Epson Corp | 液体噴射ヘッド及び液体噴射装置 |
JP2004268397A (ja) | 2003-03-07 | 2004-09-30 | Seiko Epson Corp | 液体噴射ヘッドの製造方法及び接合装置 |
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JP4858670B2 (ja) | 2004-12-20 | 2012-01-18 | セイコーエプソン株式会社 | アクチュエータ装置の製造方法及び液体噴射装置 |
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2005
- 2005-12-07 US US11/295,608 patent/US20060132549A1/en not_active Abandoned
- 2005-12-15 CN CNB2005101318703A patent/CN100484765C/zh not_active Expired - Fee Related
- 2005-12-19 KR KR20050125520A patent/KR100731438B1/ko active IP Right Grant
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JP2004195994A (ja) * | 1995-04-03 | 2004-07-15 | Seiko Epson Corp | アクチュエータ及びインクジェット記録用プリンタヘッド |
JP2000025225A (ja) * | 1998-07-10 | 2000-01-25 | Seiko Epson Corp | アクチュエータ装置及びインクジェット式記録ヘッド並びにインクジェット式記録装置 |
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JP2011062871A (ja) * | 2009-09-16 | 2011-03-31 | Seiko Epson Corp | 液滴噴射ヘッド及び液滴噴射装置 |
JP2012059770A (ja) * | 2010-09-06 | 2012-03-22 | Seiko Epson Corp | 圧電素子、液滴噴射ヘッドおよび液滴噴射装置ならびにそれらの製造方法 |
Also Published As
Publication number | Publication date |
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US20060132549A1 (en) | 2006-06-22 |
KR20060070460A (ko) | 2006-06-23 |
KR100731438B1 (ko) | 2007-06-21 |
CN100484765C (zh) | 2009-05-06 |
JP4858670B2 (ja) | 2012-01-18 |
CN1792635A (zh) | 2006-06-28 |
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