JP2006165187A - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
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- JP2006165187A JP2006165187A JP2004353045A JP2004353045A JP2006165187A JP 2006165187 A JP2006165187 A JP 2006165187A JP 2004353045 A JP2004353045 A JP 2004353045A JP 2004353045 A JP2004353045 A JP 2004353045A JP 2006165187 A JP2006165187 A JP 2006165187A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
- G03F7/2006—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light using coherent light; using polarised light
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
【解決手段】インデクサセルから払い出された基板W(第1の基板W)が露光装置でのレチクル変更前の最終基板である場合には、その次に処理される基板W(第2の基板W)のインデクサセルからの払い出しを一旦停止する。そして、レチクル交換時間に相当する時間の経過を待ってから基板払い出しを再開し、インデクサセルから第2の基板Wを払い出す。露光装置側では、第1の基板Wの露光処理が終了し、レチクル交換が完了するタイミングでレジスト塗布処理済みの第2の基板Wが搬入されることとなるため、処理効率を低下させることなく、基板Wへのレジスト塗布処理が完了してから露光処理が行われるまでの時間を一定にすることができる。その結果、基板Wの処理履歴を均一にすることができ、パターンの線幅均一性をより向上させることができる。
【選択図】図7
Description
2 バークブロック
3 レジスト塗布ブロック
4 現像処理ブロック
5 インターフェイスブロック
12 基板移載機構
21,31,41,42 熱処理タワー
55 搬送機構
100 ホストコンピュータ
BRC1〜BRC3,SC1〜SC3 塗布処理ユニット
CC セルコントローラ
CP1〜CP13 クールプレート
EXP 露光装置
HP1〜HP11 ホットプレート
MC メインコントローラ
PASS1〜PASS10 基板載置部
PHP1〜PHP12 加熱部
SD1〜SD5 現像処理ユニット
TC 搬送ロボットコントローラ
TR1〜TR4 搬送ロボット
W 基板
Claims (2)
- 基板にレジストを塗布することによってレジスト膜が形成された基板を露光装置に搬入するとともに、該露光装置から受け取った露光後の基板に現像処理を行う基板処理装置であって、
基板にレジスト塗布処理を行う塗布処理部と、
露光後の基板に現像処理を行う現像処理部と、
前記レジスト塗布処理が行われてレジスト膜が形成された基板を前記塗布処理部から受け取って露光装置に渡すとともに、露光済みの基板を前記露光装置から受け取って前記現像処理部に渡すインターフェイス部と、
装置外から受け取った未処理基板を前記塗布処理部に払い出すとともに、前記現像処理部から受け取った処理済み基板を装置外に搬出する搬入搬出部と、
前記塗布処理部、前記現像処理部、前記インターフェイス部および前記搬入搬出部の間で基板の搬送を行う搬送手段と、
前記塗布処理部での基板へのレジスト塗布処理が完了してから当該基板に前記露光装置にて露光処理が行われるまでの時間が一定となるように前記搬送手段を制御する制御手段と、
を備えることを特徴とする基板処理装置。 - 請求項1記載の基板処理装置において、
第1の基板の露光処理に使用されるレチクルと前記第1の基板の次に処理される第2の基板に使用されるレチクルとが異なる場合に、前記インデクサ部から前記第1の基板が払い出された後、前記露光装置におけるレチクル交換時間が経過した時点で前記インデクサ部が前記第2の基板を払い出すことを特徴とする基板処理装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004353045A JP4393976B2 (ja) | 2004-12-06 | 2004-12-06 | 基板処理装置 |
US11/294,268 US7512456B2 (en) | 2004-12-06 | 2005-12-05 | Substrate processing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004353045A JP4393976B2 (ja) | 2004-12-06 | 2004-12-06 | 基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006165187A true JP2006165187A (ja) | 2006-06-22 |
JP4393976B2 JP4393976B2 (ja) | 2010-01-06 |
Family
ID=36574330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004353045A Expired - Fee Related JP4393976B2 (ja) | 2004-12-06 | 2004-12-06 | 基板処理装置 |
Country Status (2)
Country | Link |
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US (1) | US7512456B2 (ja) |
JP (1) | JP4393976B2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008034746A (ja) * | 2006-07-31 | 2008-02-14 | Tokyo Electron Ltd | 塗布、現像装置、その方法及び記憶媒体 |
JP2012109607A (ja) * | 2012-02-15 | 2012-06-07 | Tokyo Electron Ltd | 塗布、現像装置、その方法及び記憶媒体 |
WO2019159736A1 (ja) * | 2018-02-16 | 2019-08-22 | 東京エレクトロン株式会社 | 基板処理装置 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5091413B2 (ja) * | 2006-03-08 | 2012-12-05 | 東京エレクトロン株式会社 | 基板処理装置および基板処理装置の制御方法 |
US8636458B2 (en) * | 2007-06-06 | 2014-01-28 | Asml Netherlands B.V. | Integrated post-exposure bake track |
TW200919117A (en) * | 2007-08-28 | 2009-05-01 | Tokyo Electron Ltd | Coating-developing apparatus, coating-developing method and storage medium |
JP5779168B2 (ja) * | 2012-12-04 | 2015-09-16 | 東京エレクトロン株式会社 | 周縁部塗布装置、周縁部塗布方法及び周縁部塗布用記録媒体 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW301037B (ja) | 1993-11-19 | 1997-03-21 | Sony Co Ltd | |
JPH07142356A (ja) | 1993-11-19 | 1995-06-02 | Sony Corp | レジスト・パターン形成方法およびこれに用いるレジスト・パターン形成システム |
JP4004248B2 (ja) * | 2000-09-01 | 2007-11-07 | 大日本スクリーン製造株式会社 | 基板処理装置および基板検査方法 |
TWI244603B (en) * | 2001-07-05 | 2005-12-01 | Dainippon Screen Mfg | Substrate processing system for managing device information of substrate processing device |
JP3902027B2 (ja) * | 2002-03-01 | 2007-04-04 | 大日本スクリーン製造株式会社 | 基板処理装置 |
US6807455B2 (en) * | 2002-06-26 | 2004-10-19 | Dainippon Screen Mfg. Co. Ltd. | System for and method of processing substrate |
JP2004342654A (ja) | 2003-05-13 | 2004-12-02 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
-
2004
- 2004-12-06 JP JP2004353045A patent/JP4393976B2/ja not_active Expired - Fee Related
-
2005
- 2005-12-05 US US11/294,268 patent/US7512456B2/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008034746A (ja) * | 2006-07-31 | 2008-02-14 | Tokyo Electron Ltd | 塗布、現像装置、その方法及び記憶媒体 |
JP2012109607A (ja) * | 2012-02-15 | 2012-06-07 | Tokyo Electron Ltd | 塗布、現像装置、その方法及び記憶媒体 |
WO2019159736A1 (ja) * | 2018-02-16 | 2019-08-22 | 東京エレクトロン株式会社 | 基板処理装置 |
JPWO2019159736A1 (ja) * | 2018-02-16 | 2021-01-28 | 東京エレクトロン株式会社 | 基板処理装置 |
JP7117366B2 (ja) | 2018-02-16 | 2022-08-12 | 東京エレクトロン株式会社 | 基板処理装置 |
Also Published As
Publication number | Publication date |
---|---|
JP4393976B2 (ja) | 2010-01-06 |
US20060120716A1 (en) | 2006-06-08 |
US7512456B2 (en) | 2009-03-31 |
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