JP2006156612A - 位置決め装置 - Google Patents

位置決め装置 Download PDF

Info

Publication number
JP2006156612A
JP2006156612A JP2004343412A JP2004343412A JP2006156612A JP 2006156612 A JP2006156612 A JP 2006156612A JP 2004343412 A JP2004343412 A JP 2004343412A JP 2004343412 A JP2004343412 A JP 2004343412A JP 2006156612 A JP2006156612 A JP 2006156612A
Authority
JP
Japan
Prior art keywords
substrate
positioning
positioning device
floating
levitating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004343412A
Other languages
English (en)
Japanese (ja)
Inventor
Shinji Takase
真治 高瀬
Kazunobu Yamaguchi
和伸 山口
Atsuo Kajima
淳生 楫間
Tsuneo Tanimoto
恒夫 谷本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Tatsumo KK
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Tatsumo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd, Tatsumo KK filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP2004343412A priority Critical patent/JP2006156612A/ja
Priority to CNB2005101373310A priority patent/CN100505204C/zh
Priority to KR1020050114650A priority patent/KR20060059835A/ko
Publication of JP2006156612A publication Critical patent/JP2006156612A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2004343412A 2004-11-29 2004-11-29 位置決め装置 Pending JP2006156612A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004343412A JP2006156612A (ja) 2004-11-29 2004-11-29 位置決め装置
CNB2005101373310A CN100505204C (zh) 2004-11-29 2005-11-29 定位装置
KR1020050114650A KR20060059835A (ko) 2004-11-29 2005-11-29 위치결정 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004343412A JP2006156612A (ja) 2004-11-29 2004-11-29 位置決め装置

Publications (1)

Publication Number Publication Date
JP2006156612A true JP2006156612A (ja) 2006-06-15

Family

ID=36634521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004343412A Pending JP2006156612A (ja) 2004-11-29 2004-11-29 位置決め装置

Country Status (3)

Country Link
JP (1) JP2006156612A (zh)
KR (1) KR20060059835A (zh)
CN (1) CN100505204C (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009170797A (ja) * 2008-01-18 2009-07-30 Disco Abrasive Syst Ltd ウェーハ搬送装置および加工装置
JP2013080851A (ja) * 2011-10-05 2013-05-02 Dainippon Printing Co Ltd 基板のアラインメント方法及び装置
JP2013175622A (ja) * 2012-02-27 2013-09-05 Dainippon Screen Mfg Co Ltd 塗布装置、基板保持装置および基板保持方法
WO2019163191A1 (ja) * 2018-02-26 2019-08-29 株式会社Ｓｃｒｅｅｎホールディングス センタリング装置、センタリング方法、基板処理装置、および基板処理方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102947052B (zh) * 2010-06-17 2015-12-02 日产自动车株式会社 工件定位装置和电池制造方法
CN103367215B (zh) * 2013-06-08 2016-08-24 天通吉成机器技术有限公司 一种等离子刻蚀设备的基片定位升降装置
JP6842948B2 (ja) * 2017-02-24 2021-03-17 リンテック株式会社 位置決め装置および位置決め方法
CN111211064A (zh) * 2018-11-21 2020-05-29 沈阳芯源微电子设备股份有限公司 一种低接触晶圆对中、翻转系统
JP7259476B2 (ja) * 2019-03-27 2023-04-18 東京エレクトロン株式会社 アライメント装置、基板処理装置、アライメント方法及び基板処理方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009170797A (ja) * 2008-01-18 2009-07-30 Disco Abrasive Syst Ltd ウェーハ搬送装置および加工装置
JP2013080851A (ja) * 2011-10-05 2013-05-02 Dainippon Printing Co Ltd 基板のアラインメント方法及び装置
JP2013175622A (ja) * 2012-02-27 2013-09-05 Dainippon Screen Mfg Co Ltd 塗布装置、基板保持装置および基板保持方法
WO2013128710A1 (ja) * 2012-02-27 2013-09-06 大日本スクリーン製造株式会社 塗布装置、基板保持装置および基板保持方法
WO2019163191A1 (ja) * 2018-02-26 2019-08-29 株式会社Ｓｃｒｅｅｎホールディングス センタリング装置、センタリング方法、基板処理装置、および基板処理方法
JP2019149423A (ja) * 2018-02-26 2019-09-05 株式会社Ｓｃｒｅｅｎホールディングス センタリング装置、センタリング方法、基板処理装置、および基板処理方法
TWI690015B (zh) * 2018-02-26 2020-04-01 日商斯庫林集團股份有限公司 定心裝置、定心方法、基板處理裝置及基板處理方法

Also Published As

Publication number Publication date
CN1812073A (zh) 2006-08-02
KR20060059835A (ko) 2006-06-02
CN100505204C (zh) 2009-06-24

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