KR20060059835A - 위치결정 장치 - Google Patents

위치결정 장치 Download PDF

Info

Publication number
KR20060059835A
KR20060059835A KR1020050114650A KR20050114650A KR20060059835A KR 20060059835 A KR20060059835 A KR 20060059835A KR 1020050114650 A KR1020050114650 A KR 1020050114650A KR 20050114650 A KR20050114650 A KR 20050114650A KR 20060059835 A KR20060059835 A KR 20060059835A
Authority
KR
South Korea
Prior art keywords
substrate
floating
positioning
support member
receiving
Prior art date
Application number
KR1020050114650A
Other languages
English (en)
Korean (ko)
Inventor
츠네오 타니모토
신지 타카세
카즈노부 야마구치
아츠오 카지마
Original Assignee
도쿄 오카 고교 가부시키가이샤
다즈모 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄 오카 고교 가부시키가이샤, 다즈모 가부시키가이샤 filed Critical 도쿄 오카 고교 가부시키가이샤
Publication of KR20060059835A publication Critical patent/KR20060059835A/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020050114650A 2004-11-29 2005-11-29 위치결정 장치 KR20060059835A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004343412A JP2006156612A (ja) 2004-11-29 2004-11-29 位置決め装置
JPJP-P-2004-00343412 2004-11-29

Publications (1)

Publication Number Publication Date
KR20060059835A true KR20060059835A (ko) 2006-06-02

Family

ID=36634521

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050114650A KR20060059835A (ko) 2004-11-29 2005-11-29 위치결정 장치

Country Status (3)

Country Link
JP (1) JP2006156612A (zh)
KR (1) KR20060059835A (zh)
CN (1) CN100505204C (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018139280A (ja) * 2017-02-24 2018-09-06 リンテック株式会社 位置決め装置および位置決め方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4989498B2 (ja) * 2008-01-18 2012-08-01 株式会社ディスコ ウェーハ搬送装置および加工装置
WO2011158903A1 (ja) * 2010-06-17 2011-12-22 日産自動車株式会社 ワーク位置決め装置及び電池製造方法
JP5861365B2 (ja) * 2011-10-05 2016-02-16 大日本印刷株式会社 基板のアラインメント方法及び装置
JP5977042B2 (ja) * 2012-02-27 2016-08-24 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置、基板保持装置および基板保持方法
CN103367215B (zh) * 2013-06-08 2016-08-24 天通吉成机器技术有限公司 一种等离子刻蚀设备的基片定位升降装置
JP6934435B2 (ja) * 2018-02-26 2021-09-15 株式会社Ｓｃｒｅｅｎホールディングス センタリング装置、センタリング方法、基板処理装置、および基板処理方法
JP7259476B2 (ja) * 2019-03-27 2023-04-18 東京エレクトロン株式会社 アライメント装置、基板処理装置、アライメント方法及び基板処理方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018139280A (ja) * 2017-02-24 2018-09-06 リンテック株式会社 位置決め装置および位置決め方法

Also Published As

Publication number Publication date
CN100505204C (zh) 2009-06-24
JP2006156612A (ja) 2006-06-15
CN1812073A (zh) 2006-08-02

Similar Documents

Publication Publication Date Title
US7624498B2 (en) Apparatus for detaching a semiconductor chip from a tape
JP4440219B2 (ja) 担持体上に半導体デバイスを位置合わせするための装置及び方法
JP4643185B2 (ja) 移載装置
KR101226578B1 (ko) 웨이퍼 절단 방법
KR102084792B1 (ko) 포일로부터 반도체 칩을 탈착시키기 위한 방법
US20150279716A1 (en) Apparatus and method for detaching chip
JP3441879B2 (ja) チップ剥離装置
KR20060059835A (ko) 위치결정 장치
US6817601B2 (en) Block suction apparatus
JP6540272B2 (ja) ブレイク装置及びブレイク方法
JP5254832B2 (ja) ウェーハ保持機構
KR102048371B1 (ko) 척 고정형 웨이퍼 푸셔 장치 및 웨이퍼 프로버
JP4459023B2 (ja) 基板保持装置
US6981312B2 (en) System for handling microelectronic dies having a non-piercing die ejector
KR20180069381A (ko) 반도체 기판을 지지하는 진공척
JP3613170B2 (ja) 基板の下受け装置および下受け方法
CN102664156B (zh) 吸取焊球的吸头及装置及半导体工艺
CN221436233U (zh) 一种芯片框架装片后结合力检测用定位装置
JPH04293300A (ja) プリント基板支持装置
KR102288927B1 (ko) 다이 이젝터 및 이를 포함하는 다이 픽업 장치
KR20240143912A (ko) 실장 툴 및 실장 장치
JPH08141988A (ja) 板状体の位置決め方法及び装置
JP6259880B2 (ja) 脆性材料基板の吸引搬送ヘッド
KR20150002433A (ko) 취성 재료 기판의 반송 방법 및 반송 장치
KR200193941Y1 (ko) 웨이퍼 제조공정의 칩 분리장치

Legal Events

Date Code Title Description
A201 Request for examination
AMND Amendment
E601 Decision to refuse application
AMND Amendment
J201 Request for trial against refusal decision
B601 Maintenance of original decision after re-examination before a trial
J301 Trial decision

Free format text: TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20130412

Effective date: 20130924