JP2006152185A - エポキシ樹脂組成物及び半導体装置 - Google Patents

エポキシ樹脂組成物及び半導体装置 Download PDF

Info

Publication number
JP2006152185A
JP2006152185A JP2004347743A JP2004347743A JP2006152185A JP 2006152185 A JP2006152185 A JP 2006152185A JP 2004347743 A JP2004347743 A JP 2004347743A JP 2004347743 A JP2004347743 A JP 2004347743A JP 2006152185 A JP2006152185 A JP 2006152185A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
semiconductor
integer
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004347743A
Other languages
English (en)
Japanese (ja)
Inventor
Hidetoshi Seki
秀俊 関
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP2004347743A priority Critical patent/JP2006152185A/ja
Priority to SG10201406279UA priority patent/SG10201406279UA/en
Priority to CN2005800410378A priority patent/CN101068846B/zh
Priority to CN201210063230.3A priority patent/CN102627832B/zh
Priority to SG10201406277RA priority patent/SG10201406277RA/en
Priority to CN201210063222.9A priority patent/CN102617981B/zh
Priority to SG200906719-0A priority patent/SG156623A1/en
Priority to KR1020117005937A priority patent/KR101081723B1/ko
Priority to PCT/JP2005/021658 priority patent/WO2006059542A1/ja
Priority to KR1020117005936A priority patent/KR101081619B1/ko
Priority to KR1020077013906A priority patent/KR101152040B1/ko
Priority to SG10201406280UA priority patent/SG10201406280UA/en
Priority to US11/289,265 priority patent/US20060157872A1/en
Priority to MYPI20113758 priority patent/MY150584A/en
Priority to MYPI20113757 priority patent/MY150607A/en
Priority to MYPI20055572 priority patent/MY150688A/en
Priority to TW101128572A priority patent/TWI478969B/zh
Priority to TW094142028A priority patent/TWI378968B/zh
Priority to TW101128571A priority patent/TWI527854B/zh
Publication of JP2006152185A publication Critical patent/JP2006152185A/ja
Priority to US12/270,162 priority patent/US8324326B2/en
Priority to US13/667,367 priority patent/US8519067B2/en
Priority to US13/667,344 priority patent/US8697803B2/en
Priority to US13/667,318 priority patent/US8921461B2/en
Pending legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2004347743A 2004-10-19 2004-11-30 エポキシ樹脂組成物及び半導体装置 Pending JP2006152185A (ja)

Priority Applications (23)

Application Number Priority Date Filing Date Title
JP2004347743A JP2006152185A (ja) 2004-11-30 2004-11-30 エポキシ樹脂組成物及び半導体装置
SG10201406280UA SG10201406280UA (en) 2004-11-30 2005-11-25 Epoxy resin composition and semiconductor device
PCT/JP2005/021658 WO2006059542A1 (ja) 2004-11-30 2005-11-25 エポキシ樹脂組成物及び半導体装置
CN201210063230.3A CN102627832B (zh) 2004-11-30 2005-11-25 环氧树脂组合物及半导体器件
SG10201406277RA SG10201406277RA (en) 2004-11-30 2005-11-25 Epoxy resin composition and semiconductor device
CN201210063222.9A CN102617981B (zh) 2004-11-30 2005-11-25 环氧树脂组合物及半导体器件
SG200906719-0A SG156623A1 (en) 2004-11-30 2005-11-25 Epoxy resin composition and semiconductor device
KR1020117005937A KR101081723B1 (ko) 2004-11-30 2005-11-25 에폭시 수지 조성물 및 반도체장치
CN2005800410378A CN101068846B (zh) 2004-11-30 2005-11-25 环氧树脂组合物及半导体器件
KR1020117005936A KR101081619B1 (ko) 2004-11-30 2005-11-25 에폭시 수지 조성물 및 반도체장치
KR1020077013906A KR101152040B1 (ko) 2004-11-30 2005-11-25 에폭시 수지 조성물 및 반도체장치
SG10201406279UA SG10201406279UA (en) 2004-11-30 2005-11-25 Epoxy resin composition and semiconductor device
US11/289,265 US20060157872A1 (en) 2004-11-30 2005-11-29 Epoxy resin composition and semiconductor device
MYPI20055572 MY150688A (en) 2004-11-30 2005-11-29 Epoxy resin composition and semiconductor device
MYPI20113757 MY150607A (en) 2004-11-30 2005-11-29 Epoxy resin composition and semiconductor device
MYPI20113758 MY150584A (en) 2004-11-30 2005-11-29 Epoxy resin composition and semiconductor device
TW094142028A TWI378968B (en) 2004-11-30 2005-11-30 Epoxy resin composition and semiconductor device
TW101128572A TWI478969B (zh) 2004-11-30 2005-11-30 環氧樹脂組成物及半導體裝置
TW101128571A TWI527854B (zh) 2004-11-30 2005-11-30 環氧樹脂組成物及半導體裝置
US12/270,162 US8324326B2 (en) 2004-11-30 2008-11-13 Epoxy resin composition and semiconductor device
US13/667,367 US8519067B2 (en) 2004-11-30 2012-11-02 Epoxy resin composition and semiconductor device
US13/667,344 US8697803B2 (en) 2004-10-19 2012-11-02 Epoxy resin composition and semiconductor device
US13/667,318 US8921461B2 (en) 2004-11-30 2012-11-02 Epoxy resin composition and semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004347743A JP2006152185A (ja) 2004-11-30 2004-11-30 エポキシ樹脂組成物及び半導体装置

Publications (1)

Publication Number Publication Date
JP2006152185A true JP2006152185A (ja) 2006-06-15

Family

ID=36630853

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004347743A Pending JP2006152185A (ja) 2004-10-19 2004-11-30 エポキシ樹脂組成物及び半導体装置

Country Status (2)

Country Link
JP (1) JP2006152185A (zh)
CN (1) CN101068846B (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012167215A (ja) * 2011-02-15 2012-09-06 Ube Industries Ltd 変性ジエン系ゴム及びその製造方法並びにそれを用いたゴム組成物
JP2016183258A (ja) * 2015-03-26 2016-10-20 Jnc株式会社 熱硬化性樹脂組成物
KR20190006443A (ko) * 2017-07-10 2019-01-18 아지노모토 가부시키가이샤 수지 조성물
JP2019196473A (ja) * 2018-05-11 2019-11-14 サムスン エレクトロニクス カンパニー リミテッド プリント回路基板及びｉｃパッケージ用樹脂組成物、並びにこれを用いた製品

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5185890B2 (ja) * 2009-06-17 2013-04-17 株式会社日立産機システム 高電圧電気機器用絶縁注型樹脂及びこれを用いた高電圧電気機器
CN101974208B (zh) * 2010-08-20 2012-11-14 广东生益科技股份有限公司 高导热树脂组合物及使用其制作的高导热覆金属箔板
CN101974205A (zh) * 2010-08-20 2011-02-16 广东生益科技股份有限公司 用于埋入式电容器的树脂组合物、使用其制作的介电层及覆金属箔板
CN101967266A (zh) * 2010-09-25 2011-02-09 江苏中鹏新材料股份有限公司 无卤阻燃环氧树脂组合物
CN102311612B (zh) * 2011-04-03 2013-05-01 广东生益科技股份有限公司 树脂组合物及使用其制作的涂树脂铜箔
JP2013023661A (ja) * 2011-07-25 2013-02-04 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
CN102504532B (zh) * 2011-10-18 2013-09-18 广东生益科技股份有限公司 无卤低介电树脂组合物及使用其制作的预浸料与覆铜箔层压板
CN102863744A (zh) * 2012-09-27 2013-01-09 江苏中鹏新材料股份有限公司 具有良好成型性能的大功率封装环氧树脂组合物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1171445A (ja) * 1997-08-28 1999-03-16 Toshiba Chem Corp エポキシ樹脂組成物および半導体封止装置
JP2002302593A (ja) * 2001-01-31 2002-10-18 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
JP2003292582A (ja) * 2002-03-29 2003-10-15 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3238340B2 (ja) * 1996-12-04 2001-12-10 住友ベークライト株式会社 液状エポキシ樹脂封止材料
US6297306B1 (en) * 1998-05-15 2001-10-02 Shin-Etsu Chemical Co., Ltd. Semiconductor encapsulating epoxy resin composition and semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1171445A (ja) * 1997-08-28 1999-03-16 Toshiba Chem Corp エポキシ樹脂組成物および半導体封止装置
JP2002302593A (ja) * 2001-01-31 2002-10-18 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
JP2003292582A (ja) * 2002-03-29 2003-10-15 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012167215A (ja) * 2011-02-15 2012-09-06 Ube Industries Ltd 変性ジエン系ゴム及びその製造方法並びにそれを用いたゴム組成物
JP2016183258A (ja) * 2015-03-26 2016-10-20 Jnc株式会社 熱硬化性樹脂組成物
KR20190006443A (ko) * 2017-07-10 2019-01-18 아지노모토 가부시키가이샤 수지 조성물
JP2019014843A (ja) * 2017-07-10 2019-01-31 味の素株式会社 樹脂組成物
KR102663957B1 (ko) 2017-07-10 2024-05-09 아지노모토 가부시키가이샤 수지 조성물
JP2019196473A (ja) * 2018-05-11 2019-11-14 サムスン エレクトロニクス カンパニー リミテッド プリント回路基板及びｉｃパッケージ用樹脂組成物、並びにこれを用いた製品

Also Published As

Publication number Publication date
CN101068846A (zh) 2007-11-07
CN101068846B (zh) 2012-04-25

Similar Documents

Publication Publication Date Title
JP5564793B2 (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
WO2006059542A1 (ja) エポキシ樹脂組成物及び半導体装置
JP4496786B2 (ja) エポキシ樹脂組成物及び半導体装置
JP4736432B2 (ja) エポキシ樹脂組成物及び半導体装置
JPWO2004074344A1 (ja) エポキシ樹脂組成物及び半導体装置
JP4736506B2 (ja) エポキシ樹脂組成物及び半導体装置
JP2006152185A (ja) エポキシ樹脂組成物及び半導体装置
JP2006233016A (ja) エポキシ樹脂組成物及び半導体装置
JP4622221B2 (ja) エポキシ樹脂組成物及び半導体装置
JP4496740B2 (ja) エポキシ樹脂組成物及び半導体装置
JP4250987B2 (ja) エポキシ樹脂組成物及び半導体装置
JP5407767B2 (ja) エポキシ樹脂組成物及び半導体装置
JP4759994B2 (ja) エポキシ樹脂組成物及び半導体装置
JP4543638B2 (ja) エポキシ樹脂組成物及び半導体装置
JP4770024B2 (ja) エポキシ樹脂組成物及び半導体装置
JP2005154717A (ja) エポキシ樹脂組成物及び半導体装置
JP2006176555A (ja) エポキシ樹脂組成物及び半導体装置
JP4736406B2 (ja) エポキシ樹脂組成物及び半導体装置
JP2005162826A (ja) 封止用樹脂組成物および樹脂封止型半導体装置
JP5093977B2 (ja) エリア実装型半導体装置
JP5055778B2 (ja) エポキシ樹脂組成物、エポキシ樹脂成形材料及び半導体装置
JP4645147B2 (ja) エポキシ樹脂組成物及び半導体装置
JP2006176554A (ja) エポキシ樹脂組成物及び半導体装置
JP2005281584A (ja) エポキシ樹脂組成物及び半導体装置
JP2006225464A (ja) エポキシ樹脂組成物及び半導体装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070711

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100427

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20100907