JP2006131993A - 蒸着方法及びそのための蒸着装置 - Google Patents
蒸着方法及びそのための蒸着装置 Download PDFInfo
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- JP2006131993A JP2006131993A JP2005295632A JP2005295632A JP2006131993A JP 2006131993 A JP2006131993 A JP 2006131993A JP 2005295632 A JP2005295632 A JP 2005295632A JP 2005295632 A JP2005295632 A JP 2005295632A JP 2006131993 A JP2006131993 A JP 2006131993A
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- vapor deposition
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- 238000007740 vapor deposition Methods 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000010438 heat treatment Methods 0.000 claims abstract description 83
- 238000000151 deposition Methods 0.000 claims abstract description 75
- 239000000758 substrate Substances 0.000 claims abstract description 65
- 239000000463 material Substances 0.000 claims abstract description 26
- 239000010409 thin film Substances 0.000 claims abstract description 11
- 230000008021 deposition Effects 0.000 claims description 65
- 239000010408 film Substances 0.000 claims description 35
- 239000000126 substance Substances 0.000 claims description 6
- 230000007423 decrease Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 4
- 239000011368 organic material Substances 0.000 description 4
- 239000007772 electrode material Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/246—Replenishment of source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
【解決手段】薄膜が蒸着される基板を準備するステップと、蒸着材料を加熱して基板に蒸着させる複数個の加熱容器が一列に備えられたラインソースを準備するステップと、ラインソースを回転させつつ、蒸着材料を基板に蒸着させるステップと、を備えることを特徴とする蒸着方法及びそのための蒸着装置である。
【選択図】図1
Description
110 ラインソース
120 加熱容器
130 アクチュエータ
Claims (15)
- 薄膜が蒸着される基板を準備するステップと、
蒸着材料を加熱して前記基板に蒸着させる複数個の加熱容器が一列に備えられたラインソースを準備するステップと、
前記ラインソースを回転させつつ、前記蒸着材料を前記基板に蒸着させるステップと、を備えることを特徴とする蒸着方法。 - 前記ラインソースに備えられた各加熱容器の蒸着率を異ならせることを特徴とする請求項1に記載の蒸着方法。
- 前記ラインソースの端部側に備えられた加熱容器であるほどその蒸着率を高めることを特徴とする請求項2に記載の蒸着方法。
- 前記各加熱容器の蒸着率は、前記ラインソースの中央から前記加熱容器が備えられた位置までの距離に比例させることを特徴とする請求項3に記載の蒸着方法。
- 前記ラインソースに備えられた相互隣接した加熱容器間の距離を異ならせることを特徴とする請求項1に記載の蒸着方法。
- 前記ラインソースの端部側に備えられた加熱容器であるほど相互隣接した加熱容器間の距離を狭めることを特徴とする請求項5に記載の蒸着方法。
- 前記ラインソースに備えられた各加熱容器の蒸着率は、同一にすることを特徴とする請求項6に記載の蒸着方法。
- 蒸着膜が形成される基板を支持する支持部材と、
前記基板に蒸着される物質を放出する複数個の加熱容器が一列に備えられたラインソースと、
前記ラインソースを回転させうるアクチュエータと、を備えることを特徴とする蒸着装置。 - 前記ラインソースに備えられた各加熱容器は、蒸着率が相異なることを特徴とする請求項8に記載の蒸着装置。
- 前記ラインソースの端部側に備えられた加熱容器であるほどその蒸着率が高いことを特徴とする請求項9に記載の蒸着装置。
- 前記各加熱容器の蒸着率は、前記ラインソースの中央から前記加熱容器が備えられた位置までの距離に比例することを特徴とする請求項10に記載の蒸着装置。
- 前記相互隣接した加熱容器間の距離は、同じであることを特徴とする請求項10に記載の蒸着装置。
- 前記ラインソースに備えられた相互隣接した加熱容器間の距離は相異なることを特徴とする請求項8に記載の蒸着装置。
- 前記ラインソースの端部側に備えられた加熱容器であるほど相互隣接した加熱容器間の距離が狭まることを特徴とする請求項13に記載の蒸着装置。
- 前記ラインソースに備えられた各加熱容器の蒸着率は、同じであることを特徴とする請求項14に記載の蒸着装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040089649A KR100637180B1 (ko) | 2004-11-05 | 2004-11-05 | 증착 방법 및 이를 위한 증착 장치 |
Publications (2)
Publication Number | Publication Date |
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JP2006131993A true JP2006131993A (ja) | 2006-05-25 |
JP4584105B2 JP4584105B2 (ja) | 2010-11-17 |
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JP2005295632A Active JP4584105B2 (ja) | 2004-11-05 | 2005-10-07 | 蒸着方法及びそのための蒸着装置 |
Country Status (4)
Country | Link |
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US (1) | US7819975B2 (ja) |
JP (1) | JP4584105B2 (ja) |
KR (1) | KR100637180B1 (ja) |
CN (1) | CN1769513B (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008025022A (ja) * | 2006-07-18 | 2008-02-07 | Semes Co Ltd | 薄膜蒸着用の回転蒸着源及びこれを用いる薄膜蒸着装置 |
JP2008221532A (ja) * | 2007-03-09 | 2008-09-25 | Oshima Denki Seisakusho:Kk | 成膜装置 |
JP2012111977A (ja) * | 2010-11-19 | 2012-06-14 | Semiconductor Energy Lab Co Ltd | 成膜装置及び成膜方法、並びに照明装置の作製方法 |
WO2012086568A1 (ja) * | 2010-12-24 | 2012-06-28 | シャープ株式会社 | 蒸着装置、蒸着方法、並びに、有機エレクトロルミネッセンス表示装置の製造方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101528575B1 (ko) * | 2013-12-12 | 2015-06-12 | 주식회사 에스에프에이 | 박막 증착 장치 |
CN105624611B (zh) * | 2016-03-29 | 2018-04-24 | 苏州方昇光电股份有限公司 | 一种旋转式有机材料蒸发装置 |
Citations (3)
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JPH11504077A (ja) * | 1995-04-24 | 1999-04-06 | コミツサリア タ レネルジー アトミーク | 大面積基板上への蒸着による材料成膜装置 |
JPH11200017A (ja) * | 1998-01-20 | 1999-07-27 | Nikon Corp | 光学薄膜成膜装置およびこの光学薄膜成膜装置により成膜された光学素子 |
JP2003297570A (ja) * | 2002-03-08 | 2003-10-17 | Eastman Kodak Co | 有機発光デバイス製造用のコーティング方法及び細長い熱物理蒸着源 |
Family Cites Families (5)
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---|---|---|---|---|
DE3316554C1 (de) * | 1983-05-06 | 1984-07-12 | Dr. Johannes Heidenhain Gmbh, 8225 Traunreut | Verdampfervorrichtung mit Strahlheizung zum Aufdampfen mehrerer Materialien |
US6830626B1 (en) * | 1999-10-22 | 2004-12-14 | Kurt J. Lesker Company | Method and apparatus for coating a substrate in a vacuum |
JP2003086374A (ja) | 2001-09-12 | 2003-03-20 | Sony Corp | 成膜ユニット、成膜装置および成膜方法、並びに表示素子の製造装置および表示素子の製造方法 |
CN1444423A (zh) * | 2002-03-08 | 2003-09-24 | 伊斯曼柯达公司 | 用于制造有机发光器件的长条形热物理蒸汽淀积源 |
US20040123804A1 (en) * | 2002-09-20 | 2004-07-01 | Semiconductor Energy Laboratory Co., Ltd. | Fabrication system and manufacturing method of light emitting device |
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2004
- 2004-11-05 KR KR1020040089649A patent/KR100637180B1/ko active IP Right Grant
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2005
- 2005-10-07 JP JP2005295632A patent/JP4584105B2/ja active Active
- 2005-11-03 CN CN2005101173634A patent/CN1769513B/zh active Active
- 2005-11-04 US US11/266,398 patent/US7819975B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH11504077A (ja) * | 1995-04-24 | 1999-04-06 | コミツサリア タ レネルジー アトミーク | 大面積基板上への蒸着による材料成膜装置 |
JPH11200017A (ja) * | 1998-01-20 | 1999-07-27 | Nikon Corp | 光学薄膜成膜装置およびこの光学薄膜成膜装置により成膜された光学素子 |
JP2003297570A (ja) * | 2002-03-08 | 2003-10-17 | Eastman Kodak Co | 有機発光デバイス製造用のコーティング方法及び細長い熱物理蒸着源 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008025022A (ja) * | 2006-07-18 | 2008-02-07 | Semes Co Ltd | 薄膜蒸着用の回転蒸着源及びこれを用いる薄膜蒸着装置 |
JP2008221532A (ja) * | 2007-03-09 | 2008-09-25 | Oshima Denki Seisakusho:Kk | 成膜装置 |
JP2012111977A (ja) * | 2010-11-19 | 2012-06-14 | Semiconductor Energy Lab Co Ltd | 成膜装置及び成膜方法、並びに照明装置の作製方法 |
WO2012086568A1 (ja) * | 2010-12-24 | 2012-06-28 | シャープ株式会社 | 蒸着装置、蒸着方法、並びに、有機エレクトロルミネッセンス表示装置の製造方法 |
JP5330608B2 (ja) * | 2010-12-24 | 2013-10-30 | シャープ株式会社 | 蒸着装置、蒸着方法、並びに、有機エレクトロルミネッセンス表示装置の製造方法 |
JP2013249541A (ja) * | 2010-12-24 | 2013-12-12 | Sharp Corp | 蒸着装置 |
JPWO2012086568A1 (ja) * | 2010-12-24 | 2014-05-22 | シャープ株式会社 | 蒸着装置、蒸着方法、並びに、有機エレクトロルミネッセンス表示装置の製造方法 |
US8845808B2 (en) | 2010-12-24 | 2014-09-30 | Sharp Kabushiki Kaisha | Vapor deposition device, vapor deposition method, and method of manufacturing organic electroluminescent display device |
US9714466B2 (en) | 2010-12-24 | 2017-07-25 | Sharp Kabushiki Kaisha | Vapor deposition device, vapor deposition method, and method of manufacturing organic electroluminescent display device |
Also Published As
Publication number | Publication date |
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US20060099820A1 (en) | 2006-05-11 |
KR100637180B1 (ko) | 2006-10-23 |
US7819975B2 (en) | 2010-10-26 |
CN1769513A (zh) | 2006-05-10 |
KR20060040827A (ko) | 2006-05-11 |
CN1769513B (zh) | 2010-06-16 |
JP4584105B2 (ja) | 2010-11-17 |
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