JP4444906B2 - 加熱容器とそれを備えた蒸着装置 - Google Patents
加熱容器とそれを備えた蒸着装置 Download PDFInfo
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- JP4444906B2 JP4444906B2 JP2005311750A JP2005311750A JP4444906B2 JP 4444906 B2 JP4444906 B2 JP 4444906B2 JP 2005311750 A JP2005311750 A JP 2005311750A JP 2005311750 A JP2005311750 A JP 2005311750A JP 4444906 B2 JP4444906 B2 JP 4444906B2
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- 238000010438 heat treatment Methods 0.000 title claims description 84
- 238000007740 vapor deposition Methods 0.000 title claims description 51
- 239000000463 material Substances 0.000 claims description 40
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 28
- 239000010936 titanium Substances 0.000 claims description 28
- 229910052719 titanium Inorganic materials 0.000 claims description 28
- 239000012212 insulator Substances 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 21
- 230000008021 deposition Effects 0.000 claims description 15
- 239000000919 ceramic Substances 0.000 claims description 10
- 238000000151 deposition Methods 0.000 description 16
- 230000008859 change Effects 0.000 description 9
- 239000010408 film Substances 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 229910010293 ceramic material Inorganic materials 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000011368 organic material Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Description
前記図面を参照すれば、本実施形態による蒸着装置の内部にチャンバ411が備えられるが、前記チャンバ411には、蒸着しようとする基板400を支持する基板支持部412と、前記基板400に密着され、蒸着しようとするパターンのスリットが形成された蒸着マスク413と、前記蒸着マスク413を介して前記基板400と対向するように配置される加熱容器420と、が備えられている。
110c 開口部
120 熱線
130 絶縁体
140 支持台
150 突出部
Claims (14)
- 蒸着される物質が満たされる空間部と、蒸着される物質が放出される開口部とを有するチタンから形成された本体と、
前記本体を加熱する熱線と、
前記本体を前記熱線と絶縁させる絶縁体と、を備え、
前記本体は、開口部が形成された、補助熱線を有する蓋部と、空間部が形成された本体部とを備えることを特徴とする蒸着装置の加熱容器。 - 前記絶縁体は、セラミックから形成された絶縁体であることを特徴とする請求項1に記載の蒸着装置の加熱容器。
- 前記本体を支持する支持台をさらに備えることを特徴とする請求項1に記載の蒸着装置の加熱容器。
- 前記支持台は、円筒形の支持台であり、前記熱線は、前記支持台の内側と前記支持台の上端部とにわたって備えられることを特徴とする請求項3に記載の蒸着装置の加熱容器。
- 前記支持台は、円筒形の支持台であり、前記熱線は、前記支持台の内側にコイル状に備えられることを特徴とする請求項3に記載の蒸着装置の加熱容器。
- 前記本体の上部には、前記支持台によって前記本体を支持させる突出部がさらに備えられることを特徴とする請求項3に記載の蒸着装置の加熱容器。
- 前記絶縁体は、前記突出部と前記支持台との間、または前記突出部と前記熱線との間に介在されることを特徴とする請求項6に記載の蒸着装置の加熱容器。
- 蒸着膜が形成される基板を支持する支持部材と、
前記基板と対向する側に配置されて蒸着される物質を放出するものであって、蒸着される物質が満たされる空間部と蒸着される物質が放出される開口部とを有するチタンから形成された本体と、前記本体を加熱する熱線、及び前記本体を前記熱線と絶縁させる絶縁体を備え、前記本体は、開口部が形成された、補助熱線を有する蓋部と、空間部が形成された本体部とを備える加熱容器と、を備えることを特徴とする蒸着装置。 - 前記絶縁体は、セラミックから形成された絶縁体であることを特徴とする請求項8に記載の蒸着装置。
- 前記本体を支持する支持台をさらに備えることを特徴とする請求項9に記載の蒸着装置。
- 前記支持台は、円筒形の支持台であり、前記熱線は、前記支持台の内側と前記支持台の上端部とにわたって備えられることを特徴とする請求項10に記載の蒸着装置。
- 前記支持台は、円筒形の支持台であり、前記熱線は、前記支持台の内側にコイル状に備えられることを特徴とする請求項10に記載の蒸着装置。
- 前記本体の上部には、前記支持台によって前記本体を支持させる突出部がさらに備えられることを特徴とする請求項10に記載の蒸着装置。
- 前記絶縁体は、前記突出部と前記支持台との間、または前記突出部と前記熱線との間に介在されることを特徴とする請求項13に記載の蒸着装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040089650A KR100592304B1 (ko) | 2004-11-05 | 2004-11-05 | 가열 용기와 이를 구비한 증착 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006131995A JP2006131995A (ja) | 2006-05-25 |
JP4444906B2 true JP4444906B2 (ja) | 2010-03-31 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2005311750A Active JP4444906B2 (ja) | 2004-11-05 | 2005-10-26 | 加熱容器とそれを備えた蒸着装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7922820B2 (ja) |
JP (1) | JP4444906B2 (ja) |
KR (1) | KR100592304B1 (ja) |
CN (1) | CN1769514B (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100784953B1 (ko) * | 2006-05-23 | 2007-12-11 | 세메스 주식회사 | 다수의 도가니를 이용한 유기발광소자 박막 제작을 위한선형증발원 |
KR100929035B1 (ko) | 2007-08-23 | 2009-11-26 | 삼성모바일디스플레이주식회사 | 가열용기 및 이를 구비한 증착장치 |
KR20110004081A (ko) * | 2009-07-07 | 2011-01-13 | 삼성모바일디스플레이주식회사 | 증착 장치용 캐니스터, 이를 이용한 증착 장치 및 증착 방법 |
DE102011000502A1 (de) | 2011-02-04 | 2012-08-09 | Solibro Gmbh | Abscheidevorrichtung und Verfahren zur Herstellung eines Tiegels hierfür |
TW201303056A (zh) * | 2011-07-07 | 2013-01-16 | Hon Hai Prec Ind Co Ltd | 坩堝、真空蒸鍍系統及蒸鍍方法 |
TW201303055A (zh) * | 2011-07-07 | 2013-01-16 | Hon Hai Prec Ind Co Ltd | 坩堝、真空蒸鍍系統及方法 |
JP5798452B2 (ja) * | 2011-11-16 | 2015-10-21 | 株式会社半導体エネルギー研究所 | 蒸発源 |
CN103789733B (zh) * | 2014-02-27 | 2015-12-16 | 苏州驰鸣纳米技术有限公司 | 可任意角度安装使用的真空蒸发源 |
CN104073764B (zh) * | 2014-06-17 | 2016-05-18 | 京东方科技集团股份有限公司 | 一种用于oled蒸镀的旋转蒸发源装置 |
CN104404450B (zh) * | 2014-10-28 | 2018-06-01 | 深圳市华星光电技术有限公司 | 用于升华型oled材料蒸镀的坩埚 |
CN104988463B (zh) * | 2015-06-24 | 2018-11-06 | 深圳市华星光电技术有限公司 | 一种加热源及有机发光二极管的蒸镀机 |
CN104962864B (zh) * | 2015-07-23 | 2017-11-10 | 京东方科技集团股份有限公司 | 坩埚装置和蒸镀设备 |
US20190048460A1 (en) * | 2017-08-14 | 2019-02-14 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Evaporation Crucible and Evaporation System |
US20220228250A1 (en) * | 2021-01-15 | 2022-07-21 | Phoenix Silicon International Corp. | Crucible and vapor deposition apparatus |
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JPS60214522A (ja) * | 1984-04-11 | 1985-10-26 | Hitachi Ltd | 真空蒸着用セル |
JPH01226792A (ja) * | 1988-03-08 | 1989-09-11 | Fujitsu Ltd | 分子線源セル |
JPH0345955A (ja) | 1989-07-13 | 1991-02-27 | Canon Inc | 画像形成媒体及びそれを用いた画像形成方法 |
GB9515929D0 (en) * | 1995-08-03 | 1995-10-04 | Fisons Plc | Sources used in molecular beam epitaxy |
JPH10204622A (ja) | 1997-01-13 | 1998-08-04 | Tdk Corp | 薄膜形成装置 |
JP2000068055A (ja) * | 1998-08-26 | 2000-03-03 | Tdk Corp | 有機el素子用蒸発源、この有機el素子用蒸発源を用いた有機el素子の製造装置および製造方法 |
US6162300A (en) * | 1998-09-25 | 2000-12-19 | Bichrt; Craig E. | Effusion cell |
KR100324899B1 (ko) * | 2000-02-15 | 2002-02-28 | 조양호 | 고분자 박막 증착을 위한 개량된 크누드센 셀 |
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TWI277363B (en) * | 2002-08-30 | 2007-03-21 | Semiconductor Energy Lab | Fabrication system, light-emitting device and fabricating method of organic compound-containing layer |
KR100889758B1 (ko) * | 2002-09-03 | 2009-03-20 | 삼성모바일디스플레이주식회사 | 유기박막 형성장치의 가열용기 |
JP4380319B2 (ja) | 2002-12-19 | 2009-12-09 | ソニー株式会社 | 蒸着装置および有機エレクトロルミネッセンス素子の製造方法 |
US20050022743A1 (en) * | 2003-07-31 | 2005-02-03 | Semiconductor Energy Laboratory Co., Ltd. | Evaporation container and vapor deposition apparatus |
US8123862B2 (en) * | 2003-08-15 | 2012-02-28 | Semiconductor Energy Laboratory Co., Ltd. | Deposition apparatus and manufacturing apparatus |
JP2005293969A (ja) * | 2004-03-31 | 2005-10-20 | Sanyo Electric Co Ltd | 有機エレクトロルミネッセンス素子の製造方法 |
-
2004
- 2004-11-05 KR KR1020040089650A patent/KR100592304B1/ko active IP Right Grant
-
2005
- 2005-10-26 JP JP2005311750A patent/JP4444906B2/ja active Active
- 2005-11-03 CN CN2005101173579A patent/CN1769514B/zh active Active
- 2005-11-04 US US11/266,397 patent/US7922820B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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CN1769514B (zh) | 2010-11-17 |
KR20060040828A (ko) | 2006-05-11 |
CN1769514A (zh) | 2006-05-10 |
KR100592304B1 (ko) | 2006-06-21 |
JP2006131995A (ja) | 2006-05-25 |
US7922820B2 (en) | 2011-04-12 |
US20060096542A1 (en) | 2006-05-11 |
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