JP2006119564A5 - - Google Patents

Download PDF

Info

Publication number
JP2006119564A5
JP2006119564A5 JP2005008595A JP2005008595A JP2006119564A5 JP 2006119564 A5 JP2006119564 A5 JP 2006119564A5 JP 2005008595 A JP2005008595 A JP 2005008595A JP 2005008595 A JP2005008595 A JP 2005008595A JP 2006119564 A5 JP2006119564 A5 JP 2006119564A5
Authority
JP
Japan
Prior art keywords
metal
metal layer
oxide film
layer
metal material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005008595A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006119564A (ja
Filing date
Publication date
Priority claimed from KR1020040084526A external-priority patent/KR20060035164A/ko
Application filed filed Critical
Publication of JP2006119564A publication Critical patent/JP2006119564A/ja
Publication of JP2006119564A5 publication Critical patent/JP2006119564A5/ja
Withdrawn legal-status Critical Current

Links

JP2005008595A 2004-10-21 2005-01-17 金属配線とその製造方法、金属配線を具備したアレイ基板及びその製造方法、並びにアレイ基板を具備した表示パネル Withdrawn JP2006119564A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040084526A KR20060035164A (ko) 2004-10-21 2004-10-21 금속 배선과 이의 제조 방법과, 이를 구비한 어레이 기판및 이의 제조 방법과, 이를 구비한 표시 패널

Publications (2)

Publication Number Publication Date
JP2006119564A JP2006119564A (ja) 2006-05-11
JP2006119564A5 true JP2006119564A5 (enExample) 2008-03-06

Family

ID=36205428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005008595A Withdrawn JP2006119564A (ja) 2004-10-21 2005-01-17 金属配線とその製造方法、金属配線を具備したアレイ基板及びその製造方法、並びにアレイ基板を具備した表示パネル

Country Status (5)

Country Link
US (1) US20060086979A1 (enExample)
JP (1) JP2006119564A (enExample)
KR (1) KR20060035164A (enExample)
CN (1) CN1763617A (enExample)
TW (1) TW200629530A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI308800B (en) * 2006-10-26 2009-04-11 Ind Tech Res Inst Method for making thin film transistor and structure of the same
JP2011095451A (ja) * 2009-10-29 2011-05-12 Sony Corp 横電界方式の液晶表示装置
KR101623956B1 (ko) * 2010-01-15 2016-05-24 삼성전자주식회사 트랜지스터와 그 제조방법 및 트랜지스터를 포함하는 전자소자
CN102184928A (zh) * 2010-12-29 2011-09-14 友达光电股份有限公司 显示元件及其制造方法
CN102237370A (zh) * 2011-04-18 2011-11-09 上海丽恒光微电子科技有限公司 Tft基板及其形成方法、显示装置
KR101915754B1 (ko) 2012-05-08 2018-11-07 삼성디스플레이 주식회사 박막 트랜지스터 기판 및 표시 장치
JP6070896B2 (ja) * 2014-12-05 2017-02-01 凸版印刷株式会社 表示装置基板、表示装置基板の製造方法、及び、これを用いた表示装置
WO2016130717A1 (en) * 2015-02-10 2016-08-18 University Of Houston System Scratch resistant flexible transparent electrodes and methods for fabricating ultrathin metal films as electrodes
CN105161502B (zh) * 2015-08-24 2018-09-11 京东方科技集团股份有限公司 一种阵列基板及其制造方法、显示装置
KR102379192B1 (ko) * 2017-03-10 2022-03-29 삼성디스플레이 주식회사 표시 장치

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6330047B1 (en) * 1997-07-28 2001-12-11 Sharp Kabushiki Kaisha Liquid crystal display device and method for fabricating the same
JP2004172150A (ja) * 2002-11-15 2004-06-17 Nec Kagoshima Ltd 積層構造配線の製造方法

Similar Documents

Publication Publication Date Title
CN1639867A (zh) 非易失性存储器及其制造方法
JP5780504B2 (ja) 電極およびこれを含む電子素子ならびに電極の製造方法
JP2004163901A (ja) 液晶表示装置用アレイ基板及びその製造方法
US20170104053A1 (en) Organic light emitting display device and manufacturing method thereof
JP2006119564A5 (enExample)
JP2013016529A5 (enExample)
KR20130063535A (ko) Al 합금막, Al 합금막을 갖는 배선 구조 및 Al 합금막의 제조에 사용되는 스퍼터링 타깃
TWI525702B (zh) The display device is configured with a wiring
CN106298852A (zh) 一种显示器件的像素单元版图结构
JPH02211426A (ja) 液晶表示装置およびその製造方法
JP6043264B2 (ja) 入力装置に用いられる電極
TW201138025A (en) Array substrate of liquid crystal display and fabrication method thereof
JP2006261109A5 (ja) 発光装置及び電子機器
JP6196387B2 (ja) アクティブマトリクス基板
CN102738387A (zh) 一种基于TiOx结构的忆阻器及其制备方法
JP2007250804A5 (enExample)
JP2020522728A5 (enExample)
CN102321832B (zh) Cu电极保护膜用NiCu合金靶材以及叠层膜
TW200527091A (en) An array substrate applied in large-scale and high-quality display device and manufacturing method thereof
JP4421394B2 (ja) 銀合金材料、回路基板、電子装置、及び回路基板の製造方法
JP2813234B2 (ja) 配線構造
CN109390414B (zh) 一种薄膜晶体管、阵列基板以及显示面板
CN103744213A (zh) 一种阵列基板及其制备方法
JPWO2020178651A5 (enExample)
TW200816486A (en) Thin-film transistor array and method for manufacturing the same