JP2006114699A - 薄板支持容器用クランプ装置 - Google Patents
薄板支持容器用クランプ装置 Download PDFInfo
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- JP2006114699A JP2006114699A JP2004300578A JP2004300578A JP2006114699A JP 2006114699 A JP2006114699 A JP 2006114699A JP 2004300578 A JP2004300578 A JP 2004300578A JP 2004300578 A JP2004300578 A JP 2004300578A JP 2006114699 A JP2006114699 A JP 2006114699A
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- 239000004065 semiconductor Substances 0.000 abstract description 54
- 238000001514 detection method Methods 0.000 abstract description 12
- 235000012431 wafers Nutrition 0.000 description 56
- 230000007246 mechanism Effects 0.000 description 20
- 238000006073 displacement reaction Methods 0.000 description 5
- 230000001965 increasing effect Effects 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 230000032258 transport Effects 0.000 description 5
- 230000006870 function Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】 内部に半導体ウエハを収納して搬送する薄板支持容器1を、搬送先のロードポート20に載置して半導体ウエハを自動的に出し入れする際に上記薄板支持容器を固定する薄板支持容器用クランプ装置である。薄板支持容器1のリテーニング部15に係止して薄板支持容器1全体を支持するフック部24と、当該フック部24を上下動可能に支持してフック部24をリテーニング部15に係止した状態で引き込んで薄板支持容器1を支持する駆動部25と、当該駆動部25によってフック部24を引き込む力を、薄板支持容器1の蓋体4を着脱するときに強く、半導体ウエハの出し入れのときに弱くする制御部31とを備えた。制御部31は、肉厚センサ32、位置センサ33及び引き込み力検出センサ34での検出値に基づいて、フック部24を引き込む力を調整する。
【選択図】 図1
Description
位置決め手段11は、V字溝状の3本の嵌合溝13によって構成されている。各嵌合溝13は、容器本体2の縦方向に整合する第1嵌合溝13Aと、容器本体2の縦方向に対して同じ角度(ほぼ60度)だけ傾斜させた第2及び第3嵌合溝13B,13Cとから構成されている。これら3本の嵌合溝13は規格に合わせて精密な寸法精度に設定されている。この位置決め手段11の各嵌合溝13A,13B,13Cが、ロードポート20の3つの嵌合突起22にそれぞれ嵌合することによって、薄板支持容器1が正確な位置に載置されて、ウエハ搬送用ロボットで半導体ウエハが出し入れされるようになっている。
以上のように構成された薄板支持容器用クランプ装置21は、次のように動作する。以下、制御部31での制御を中心に、図8に示すフローチャートに基づいて説明する。
(1) 上記実施形態では、薄板支持容器の例として、半導体ウエハを収納するための薄板支持容器を例に説明したが、本発明は、これに限らず、記憶ディスク、液晶ガラス基板等の薄板を収納するための薄板支持容器すべてに適用することができる。
Claims (4)
- 内部に薄板を収納して搬送する薄板支持容器を、搬送先のロードポートに載置して上記薄板を自動的に出し入れする際に上記薄板支持容器を固定する薄板支持容器用クランプ装置であって、
上記薄板支持容器の保持部に係止して薄板支持容器全体を支持するフック部と、
当該フック部を上下動可能に支持して当該フック部を上記薄板支持容器の保持部に係止した状態で引き込んで上記薄板支持容器を支持する駆動部と、
当該駆動部によって上記フック部を引き込む力を、上記薄板支持容器の蓋体を着脱するときに強く、上記薄板の出し入れのときに弱くする制御部とを備えて構成されたことを特徴とする薄板支持容器用クランプ装置。 - 請求項1に記載の薄板支持容器用クランプ装置において、
上記薄板支持容器の保持部が設けられた壁面の肉厚を測定する肉厚測定手段を備え、
上記制御部が、上記肉厚測定手段で測定した壁面の肉厚に基づいて、上記フック部を引き込む力を調整することを特徴する薄板支持容器用クランプ装置。 - 請求項1又は2に記載の薄板支持容器用クランプ装置において、
上記薄板支持容器内の薄板の位置を測定する位置測定手段を備え、
上記制御部が、上記位置測定手段で測定した薄板の位置に基づいて、上記フック部を引き込む力を調整することを特徴する薄板支持容器用クランプ装置。 - 請求項1ないし3のいずれか1項に記載の薄板支持容器用クランプ装置において、
上記フック部を上記薄板支持容器の保持部に係止して引き込む力を検出する引き込み力検出手段を備え、
上記制御部が、上記引き込み力検出手段で測定した引き込み力に基づいて、上記フック部を引き込む力を調整することを特徴する薄板支持容器用クランプ装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004300578A JP4373316B2 (ja) | 2004-10-14 | 2004-10-14 | 薄板支持容器用クランプ装置 |
TW094134466A TWI384580B (zh) | 2004-10-14 | 2005-10-03 | 薄板支承容器用夾緊裝置 |
US11/245,159 US7665787B2 (en) | 2004-10-14 | 2005-10-07 | Thin plate supporting container clamping device |
KR1020050095715A KR101145063B1 (ko) | 2004-10-14 | 2005-10-11 | 박판 지지 용기용 클램프 장치 |
DE602005018307T DE602005018307D1 (de) | 2004-10-14 | 2005-10-12 | Klemmvorrichtung für einen Tragebehälter für dünne Platten |
EP05022280A EP1648026B1 (en) | 2004-10-14 | 2005-10-12 | Thin plate supporting container clamping device |
CNB2005101137318A CN100472745C (zh) | 2004-10-14 | 2005-10-14 | 薄板支承容器用夹紧装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004300578A JP4373316B2 (ja) | 2004-10-14 | 2004-10-14 | 薄板支持容器用クランプ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006114699A true JP2006114699A (ja) | 2006-04-27 |
JP4373316B2 JP4373316B2 (ja) | 2009-11-25 |
Family
ID=35708617
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004300578A Expired - Fee Related JP4373316B2 (ja) | 2004-10-14 | 2004-10-14 | 薄板支持容器用クランプ装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7665787B2 (ja) |
EP (1) | EP1648026B1 (ja) |
JP (1) | JP4373316B2 (ja) |
KR (1) | KR101145063B1 (ja) |
CN (1) | CN100472745C (ja) |
DE (1) | DE602005018307D1 (ja) |
TW (1) | TWI384580B (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011203309A (ja) * | 2010-03-24 | 2011-10-13 | Shin-Etsu Chemical Co Ltd | ペリクルの収納容器およびペリクル収納容器の搬送用台車 |
JP2012023176A (ja) * | 2010-07-14 | 2012-02-02 | Disco Abrasive Syst Ltd | 研削装置 |
US9401295B2 (en) | 2011-07-29 | 2016-07-26 | Tdk Corporation | Load port apparatus and clamping device to be used for the same |
JP2016192495A (ja) * | 2015-03-31 | 2016-11-10 | Tdk株式会社 | ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法 |
KR101924185B1 (ko) | 2018-06-15 | 2018-11-30 | 주식회사 싸이맥스 | 클램프가 장착된 로드포트모듈 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4842879B2 (ja) * | 2007-04-16 | 2011-12-21 | 信越ポリマー株式会社 | 基板収納容器及びそのハンドル |
US8915368B2 (en) * | 2012-09-20 | 2014-12-23 | Shenzhen China Star Optoelectronics Technology Co., Ltd | LCD glass substrate storage tray |
JP6451453B2 (ja) * | 2015-03-31 | 2019-01-16 | Tdk株式会社 | ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法 |
JP6502878B2 (ja) * | 2016-03-01 | 2019-04-17 | 株式会社スギノマシン | ハンドストッカおよびハンド |
KR102126466B1 (ko) * | 2018-09-27 | 2020-06-24 | 크린팩토메이션 주식회사 | 이에프이엠 |
CN113474267B (zh) * | 2019-02-22 | 2022-09-20 | 村田机械株式会社 | 盖开闭装置 |
WO2020122261A2 (ja) * | 2020-03-31 | 2020-06-18 | ミライアル株式会社 | 基板収納容器 |
TWI772886B (zh) * | 2020-09-11 | 2022-08-01 | 樂華科技股份有限公司 | 智慧堆疊機構之解鎖裝置及其方法 |
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US5469963A (en) * | 1992-04-08 | 1995-11-28 | Asyst Technologies, Inc. | Sealable transportable container having improved liner |
US5451131A (en) * | 1992-06-19 | 1995-09-19 | International Business Machines Corporation | Dockable interface airlock between process enclosure and interprocess transfer container |
US6501070B1 (en) * | 1998-07-13 | 2002-12-31 | Newport Corporation | Pod load interface equipment adapted for implementation in a fims system |
AU1554901A (en) * | 1999-12-16 | 2001-06-25 | Nikon Corporation | Exposure method and exposure apparatus |
US6676356B2 (en) | 2000-09-18 | 2004-01-13 | Tokyo Electron Limited | Device for attaching target substrate transfer container to semiconductor processing apparatus |
JP4555918B2 (ja) | 2000-09-18 | 2010-10-06 | 東京エレクトロン株式会社 | ウェハ搬送容器装着装置 |
US20030029479A1 (en) * | 2001-08-08 | 2003-02-13 | Dainippon Screen Mfg. Co, Ltd. | Substrate cleaning apparatus and method |
JP2003059885A (ja) | 2001-08-08 | 2003-02-28 | Dainippon Screen Mfg Co Ltd | 基板洗浄装置 |
US6927505B2 (en) * | 2001-12-19 | 2005-08-09 | Nikon Corporation | Following stage planar motor |
US20030169412A1 (en) * | 2002-03-08 | 2003-09-11 | Hazelton Andrew J. | Reaction frame for a wafer scanning stage with electromagnetic connections to ground |
JP4105883B2 (ja) | 2002-04-01 | 2008-06-25 | 日本電産サンキョー株式会社 | Foupクランプ機構 |
US6595075B1 (en) * | 2002-05-06 | 2003-07-22 | Taiwan Semiconductor Manufacturing Co., Ltd | Method and apparatus for testing cassette pod door |
US7621714B2 (en) | 2003-10-23 | 2009-11-24 | Tdk Corporation | Pod clamping unit in pod opener, pod corresponding to pod clamping unit, and clamping mechanism and clamping method using pod clamping unit |
US7433050B2 (en) * | 2005-10-05 | 2008-10-07 | Nikon Corporation | Exposure apparatus and exposure method |
-
2004
- 2004-10-14 JP JP2004300578A patent/JP4373316B2/ja not_active Expired - Fee Related
-
2005
- 2005-10-03 TW TW094134466A patent/TWI384580B/zh not_active IP Right Cessation
- 2005-10-07 US US11/245,159 patent/US7665787B2/en not_active Expired - Fee Related
- 2005-10-11 KR KR1020050095715A patent/KR101145063B1/ko not_active IP Right Cessation
- 2005-10-12 EP EP05022280A patent/EP1648026B1/en not_active Not-in-force
- 2005-10-12 DE DE602005018307T patent/DE602005018307D1/de active Active
- 2005-10-14 CN CNB2005101137318A patent/CN100472745C/zh active Active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011203309A (ja) * | 2010-03-24 | 2011-10-13 | Shin-Etsu Chemical Co Ltd | ペリクルの収納容器およびペリクル収納容器の搬送用台車 |
JP2012023176A (ja) * | 2010-07-14 | 2012-02-02 | Disco Abrasive Syst Ltd | 研削装置 |
US9401295B2 (en) | 2011-07-29 | 2016-07-26 | Tdk Corporation | Load port apparatus and clamping device to be used for the same |
JP2016192495A (ja) * | 2015-03-31 | 2016-11-10 | Tdk株式会社 | ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法 |
KR101924185B1 (ko) | 2018-06-15 | 2018-11-30 | 주식회사 싸이맥스 | 클램프가 장착된 로드포트모듈 |
Also Published As
Publication number | Publication date |
---|---|
KR101145063B1 (ko) | 2012-05-11 |
EP1648026A2 (en) | 2006-04-19 |
US20060081498A1 (en) | 2006-04-20 |
EP1648026B1 (en) | 2009-12-16 |
KR20060052190A (ko) | 2006-05-19 |
TWI384580B (zh) | 2013-02-01 |
US7665787B2 (en) | 2010-02-23 |
CN1761045A (zh) | 2006-04-19 |
DE602005018307D1 (de) | 2010-01-28 |
TW200618160A (en) | 2006-06-01 |
CN100472745C (zh) | 2009-03-25 |
EP1648026A3 (en) | 2006-08-02 |
JP4373316B2 (ja) | 2009-11-25 |
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